KR100774984B1 - 도금설비의 가변형 인쇄회로기판 마스크 구조 - Google Patents
도금설비의 가변형 인쇄회로기판 마스크 구조 Download PDFInfo
- Publication number
- KR100774984B1 KR100774984B1 KR1020060055363A KR20060055363A KR100774984B1 KR 100774984 B1 KR100774984 B1 KR 100774984B1 KR 1020060055363 A KR1020060055363 A KR 1020060055363A KR 20060055363 A KR20060055363 A KR 20060055363A KR 100774984 B1 KR100774984 B1 KR 100774984B1
- Authority
- KR
- South Korea
- Prior art keywords
- circuit board
- plating
- printed circuit
- mask structure
- bolt
- Prior art date
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Classifications
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K7/00—Constructional details common to different types of electric apparatus
- H05K7/02—Arrangements of circuit components or wiring on supporting structure
- H05K7/12—Resilient or clamping means for holding component to structure
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K3/00—Apparatus or processes for manufacturing printed circuits
- H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
- H05K3/18—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material
- H05K3/181—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating
- H05K3/182—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method
- H05K3/184—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern using precipitation techniques to apply the conductive material by electroless plating characterised by the patterning method using masks
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- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Manufacturing & Machinery (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
10b : 하부 마스크,
Claims (2)
- 행거(1)의 클램퍼(2)들에 의해 보유지지되어 도금조(3)의 도금액(4)에 침지되면서 이동하여 도금되는 인쇄회로기판(5)의 전기 전도성 균등화를 위해 설치되는 도금설비의 인쇄회로기판 마스크 구조에 있어서,상기 도금조(3)의 상부 설치대(6)에 고정 설치되는 지지대(7)의 양쪽 세로대(8)들 사이에는 구멍(9)들을 갖춘 상, 하부 마스크들(10a,10b)이 볼트(11) 체결식으로 상, 하부에 각각 설치되되, 상기 상, 하부 마스크(10a,10b)들은 이에 형성된 복수의 볼트구멍(12)과 양쪽 세로대(8)에 형성된 복수의 볼트구멍(12)에 맞추어 볼트(11)에 의해 가변적으로 조절 가능하게 체결 부착되는 것을 특징으로 하는 도금설비의 가변형 인쇄회로기판 마스크 구조.
- 제 1항에 있어서, 상기 상, 하부 마스크(10a,10b)의 양단에 형성된 볼트구멍(12)과 세로대(8)들에 형성된 볼트구멍(12)들은 동일한 등간격으로 형성된 것을 특징으로 하는 도금설비의 가변형 인쇄회로기판 마스크 구조.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020060055363A KR100774984B1 (ko) | 2006-06-20 | 2006-06-20 | 도금설비의 가변형 인쇄회로기판 마스크 구조 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
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KR1020060055363A KR100774984B1 (ko) | 2006-06-20 | 2006-06-20 | 도금설비의 가변형 인쇄회로기판 마스크 구조 |
Related Child Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR2020060016586U Division KR200426401Y1 (ko) | 2006-06-20 | 2006-06-20 | 도금설비의 가변형 인쇄회로기판 마스크 구조 |
Publications (1)
Publication Number | Publication Date |
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KR100774984B1 true KR100774984B1 (ko) | 2007-11-12 |
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Family Applications (1)
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KR1020060055363A KR100774984B1 (ko) | 2006-06-20 | 2006-06-20 | 도금설비의 가변형 인쇄회로기판 마스크 구조 |
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KR (1) | KR100774984B1 (ko) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113811088A (zh) * | 2021-09-13 | 2021-12-17 | 南京信息职业技术学院 | 一种pcb板电金装置和电金方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09199843A (ja) * | 1996-01-19 | 1997-07-31 | Nec Corp | メタルマスク固定ジグ |
JPH09260477A (ja) * | 1996-03-19 | 1997-10-03 | Mitsubishi Electric Corp | マスクプレート |
JP2004232050A (ja) | 2003-01-31 | 2004-08-19 | Nippon Seiki Co Ltd | 蒸着用治具 |
KR200389466Y1 (ko) | 2005-04-23 | 2005-07-18 | 주식회사 티케이씨 | 도금설비의 인쇄회로기판 마스크 구조 |
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2006
- 2006-06-20 KR KR1020060055363A patent/KR100774984B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH09199843A (ja) * | 1996-01-19 | 1997-07-31 | Nec Corp | メタルマスク固定ジグ |
JPH09260477A (ja) * | 1996-03-19 | 1997-10-03 | Mitsubishi Electric Corp | マスクプレート |
JP2004232050A (ja) | 2003-01-31 | 2004-08-19 | Nippon Seiki Co Ltd | 蒸着用治具 |
KR200389466Y1 (ko) | 2005-04-23 | 2005-07-18 | 주식회사 티케이씨 | 도금설비의 인쇄회로기판 마스크 구조 |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
CN113811088A (zh) * | 2021-09-13 | 2021-12-17 | 南京信息职业技术学院 | 一种pcb板电金装置和电金方法 |
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