KR100761310B1 - Sorting table apparatus for test handler - Google Patents

Abstract

The present invention relates to a sorting table apparatus for a test handler, the present invention comprising: a base having at least one or more loading parts for loading a semiconductor element; And a driving device for enabling linear movement of the base. It includes, and by the adsorption means for adsorbing the semiconductor element loaded on the mounting portion of the base portion, so that the semiconductor element loaded on the mounting portion can be stably adsorbed even during the movement of the base It is proposed in the technology that can prevent the departure of the semiconductor device according to the movement of the expectation, and ultimately greatly reduce the unnecessary downtime of the test handler.

Test handler, sorting table

Description

Sorting table device for test handlers {SORTING TABLE APPARATUS FOR TEST HANDLER}

1 is a schematic perspective view of a conventional test handler.

FIG. 2 is a schematic perspective view of the sorting table apparatus applied to the test handler of FIG. 1.

3 is a schematic exploded perspective view of a sorting table apparatus according to an embodiment of the present invention.

4 is a plan view of the base applied to the sorting table apparatus of FIG.

5 is a cross-sectional view taken along line AA of FIG. 4.

FIG. 6 is an enlarged view in which main parts of FIG. 5 are enlarged. FIG.

FIG. 7 is a cross-sectional view taken along line BB of FIG. 4.

FIG. 8 is a bottom view of the upper plate applied to the base of FIG. 4. FIG.

9 is an operation state diagram according to the operation of the sorting table apparatus of FIG.

Fig. 10 is a conceptual diagram of main parts of the sorting table apparatus according to the second embodiment of the present invention.

* Description of the symbols for the main parts of the drawings *

300: sorting table device

30: expect

30-1: intake hole 31: top plate

31a: Loading part 31b: Intake groove

31c: adsorption hole 32: lower plate

40: drive device

50: ejector

The present invention relates to a test handler, and more particularly, to a sorting table apparatus for sorting semiconductor devices.

In general, a test handler supports testing a semiconductor device manufactured through a predetermined manufacturing process by a tester, and classifies semiconductor devices according to test results and loads them into a customer tray. It is open to the public.

1 is a schematic perspective view of such a conventional test handler, which will be described in brief with reference to the main part of the conventional test handler.

First, referring to FIG. 1, the conventional test handler 100 includes a loading hand 110, a soak chamber 120, a test chamber 130, a desoak chamber 140, and a pair of sorting table devices 150a, 150b), a sorting hand 160 and an unloading hand 170.

The loading device 110 loads (transfers and loads) the semiconductor devices loaded in the customer tray 10a into the test tray 11.

The soak chamber 120 has a temperature environment for preheating / preheating the semiconductor device loaded in the test tray, and sequentially receives the test tray which has been loaded by the loading apparatus 110. The test trays entered into the soak chamber 120 are sequentially arranged while translating in a direction close to the test chamber 130 while maintaining the vertical state. During this time, the semiconductor elements contained in the test tray Sufficiently preheated / precooled.

The test chamber 130 is provided for testing a semiconductor device loaded in two test trays supplied from the soak chamber 120. To this end, the test chamber 130 has a temperature environment for testing a semiconductor device.

The desock chamber 140 (also referred to as a 'recovery chamber') is provided to reduce the semiconductor device in a high temperature or cooling state to room temperature.

The sorting hand 160 classifies the semiconductor devices on the test tray passing through the desock chamber 140 by testing grade and loads the semiconductor elements on a base to be described later. The sorting hand 160 is generally configured to move only in the left and right directions.

The sorting table devices 150a and 150b are generally provided in pairs that operate independently of each other, as shown in FIG. 1, and each of the sorting table devices 150a and 150b linearly moves forward and backward 151a. And 151b and drive devices 152a and 152b for linearly moving the bases 151a and 151b. Here, the bases 151a and 151b have a plurality of loading units 151-1 arranged in a matrix form.

In addition, the unloading hand 170 classifies and loads a semiconductor device classified and loaded on the bases 151a and 151b that have been moved to the unloading position according to the grade (10b or 10c). Can be positioned).

In the test handler 100 as described above, the sorting hand 160 generally holds a plurality of semiconductor devices in one row or two rows at a time from the test tray, and then loads the held semiconductor devices with different front and rear rows. Tested semiconductor devices are classified into grades and loaded on an expectation by dividing them into testing grades in 151-1. However, as described above, since the sorting hand 160 is configured to perform only left and right movements, the sorting hand 160 is loaded by dividing the semiconductor elements into the loading units 151-1 having different front and rear rows by testing class. In order for the process to be carried out to be carried out, a loading part 151-1 of a column (such as a good or bad row) to be loaded with a semiconductor device of a certain grade should be located in the direct direction of the semiconductor device having a certain grade to be loaded. do. Therefore, in order for such a process to be performed properly, the expectations 151a and 151b must move the staff at multiples of one time between the front and rear rows.

If it is desired to improve the processing capacity of the test handler 100, it is necessary to step the movements of the bases 151a and 151b at a high speed. In the case where the semiconductor device is relatively large, despite the fast forward and backward movements of the bases 151a and 151b. Although it is possible to maintain a state in which the stacking unit 151-1 is stably loaded, in the case of a light and simple semiconductor device, the base 151a, There is a problem in that the phenomenon that the semiconductor element on 151b) is separated from the position frequently occurs. However, if the movement speed of the bases 151a and 151b is made low, the working time by the sorting hand 160 or the unloading hand 170 is increased, and unnecessary idle time of the test handler 100 is generated. This results in another problem of lowering the processing capacity of the handler 100.

SUMMARY OF THE INVENTION The present invention devised to solve the above-described problem provides a technique capable of adsorbing semiconductor elements loaded on a base to a base of the base, and furthermore, the semiconductor elements are placed on the base of the base in synchronization with the movement of the base. It is an object of the present invention to provide a technique in which adsorption of a semiconductor element can be released when adsorption is performed and the base stops.

The sorting table apparatus for a test handler according to the present invention for achieving the above object, the base having at least one or more loading parts for loading a semiconductor element; And a driving device for enabling linear movement of the base. And an adsorption means capable of adsorbing the semiconductor element loaded on the mounting portion of the base to the loading portion.

The adsorption means is characterized in that the semiconductor element is attracted to the mounting portion in synchronization with the linear motion of the base.

The adsorption means is another feature that is provided in the base. Here, the adsorption means is characterized in that it comprises a suction hole formed to penetrate the base in the linear movement direction of the base in the lower side of the loading portion and the suction hole for communicating the intake hole to the loading portion. .

The adsorption means is characterized in that to further lower the air pressure of the lower air layer of the semiconductor element loaded in the loading portion to adsorb the semiconductor element to the bottom of the loading portion, wherein the adsorption means includes an ejector (ejector) It is characterized by more specific features.

Hereinafter, a preferred embodiment of a sorting table device for a test handler according to the present invention as described above (hereinafter referred to as a 'sorting table device') will be described in more detail with reference to the accompanying drawings.

First Embodiment

3 is an exploded perspective view illustrating a major part of the sorting table apparatus 300 according to the first embodiment of the present invention. Referring to FIG. 3, the sorting table device 300 according to the present embodiment includes a base 30, a driving device 40, and the like.

The base 30 is provided to classify and stack semiconductor elements, and includes an upper plate 31 and a lower plate 32. The configuration of the base 30 will be described in more detail with reference to FIGS. 4 to 8.

FIG. 4 is a plan view of the base 30 configured in the sorting table apparatus 300 of FIG. 3, FIG. 5 is a cross-sectional view taken along the line AA of FIG. 4, and FIG. 6 is an enlarged view of an arbitrary loading part 31a in FIG. FIG. 7 is a cross-sectional view taken along line BB of FIG. 4, and FIG. 8 is a bottom view of the upper plate 31 of the base 30. FIG.

First, as described in detail with reference to FIG. 4, on the upper surface of the base 30, and more specifically, on the upper surface of the upper plate 31, 72 stacking portions 31a in which semiconductor elements can be loaded are arranged in the form of a 9 × 8 matrix. Are arranged. Therefore, nine loading parts 31a are arranged in the moving direction (front and rear direction) of the base 30, and eight loading parts 31a are arranged in the left and right directions. As shown in FIG. 8, the bottom surface of the upper plate 31 is a position where eight rows of intake grooves 31b correspond to eight rows of mounting portions 31a in the front-rear direction, that is, in the movement direction of the base 30. It is formed to open in the downward direction. 5, 6 and 7, as shown in detail, the suction holes 31c for communicating the bottom of each loading portion 31a with the intake groove 31b are as many as the number of the loading portions 31a. Formed.

The lower plate 32 is coupled to the bottom of the upper plate 31, and thus the lower plate 32 is coupled to the bottom of the upper plate 31 to close the intake groove 31b formed in the upper plate 31 in a downward direction. 5, 6, and 7, the intake hole 30-1 formed long in the front-rear longitudinal direction is formed.

On the other hand, the drive device 40 is provided to linearly move the base 30 in the front and rear direction, the motor 41 having the motor pulley 41a, the drive pulley 42, the driven pulley 43, The motor belt 44, the drive belt 45, the LM guide 46 and the LM block 47, the drive plate 48, the belt fixing block 49 is configured to include.

The motor 41 is fixedly installed on the base plate BP, which is capable of forward and reverse rotation and ultimately provides power for moving the base 30 in the front-back direction.

The driving pulley 42 is provided to receive power from the motor 41, and the driven pulley 43 is disposed behind the driving pulley 42 and is rotatably supported by the base plate BP, respectively. .

The motor belt 44 is for inputting the rotational force of the motor 41 to the drive pulley 42, and is installed between the motor pulley 41a and the drive pulley 42.

The drive belt 45 is installed between the drive pulley 42 and the driven pulley 43 and rotates forward and backward according to the rotational direction of the motor 41.

The LM guide 46 is fixedly installed on the base plate BP in a long form in the direction of movement of the base 30 to ultimately guide the linear movement of the base 30.

The LM block 47 is slidably coupled to the LM guide 46.

The driving plate 48 is provided in a substantially cross shape so that the upper surface is coupled to be in contact with the lower portion of the base 30 to support the base 30, and the lower surface is coupled to be in contact with the LM block 47.

In addition, the belt fixing block 49 is coupled to the driving plate 48 in a state of being coupled to the driving belt 45, thereby ultimately coupling the driving belt 45 to the driving plate 48.

Therefore, when the motor 41 rotates, the drive belt 45 rotates corresponding to the rotational direction of the motor 41, and the drive belt 45 rotates so that the belt fixing block (b) is driven by the drive belt 45. 49), the driving plate 48 and the coupling block 47, etc. are linearly moved integrally, so that the base 30 coupled to the upper surface of the driving plate 48 is ultimately linearly moved.

An operation state diagram of the sorting table apparatus 300 according to the present embodiment as described above will be described with reference to FIG. 9.

FIG. 9 is a cross-sectional view showing an operating state in which the base 30 of FIG. 4 is cut in the BB direction, and as referred to therein, when the motor 41 rotates in the forward direction, the base 30 moves linearly in the a direction. Correspondingly, a strong flow of air is generated in the intake hole 30-1 in the b direction, so that the air pressure of the intake hole 30-1 is lowered, and thus, the air pressure of the adsorption hole 31 c is also lowered. That is, the air pressure of the intake hole 30-1 and the suction hole 31c is lowered in synchronization with the linear movement of the base 30. Accordingly, the air layer on the upper side of the base 30, the intake hole 30-1, and the adsorption hole 31c, more specifically, the upper air layer of the semiconductor element D loaded in the mounting part 31a, and the semiconductor An air pressure difference occurs between the lower air layers of the device D, so that pressure acts on each semiconductor device D seated on the mounting portion 31a in the direction of the arrow c. Thus, the semiconductor device D is placed on the bottom of the loading portion 31. Strong adsorption. Subsequently, when the base 30 is positioned at an appropriate position such as a loading position, the rotation of the motor 41 is stopped, and accordingly, the flow of air in the intake hole 30-1 becomes "0", whereby the intake hole 30 -1) and the air pressure difference between the adsorption hole 31c and the upper air layer of the semiconductor element D are in the same state. Therefore, since the adsorption force generated by the pressure difference disappears and the adsorption of the semiconductor device D is released, the unloading operation by the unloading hand can be performed properly.

Second Embodiment

The basic technical idea of the present invention is to be able to adsorb the semiconductor element loaded on the mounting portion of the base, and furthermore, when the base is moved, the semiconductor element is strongly adsorbed on the mounting portion, and when the base is stopped, the adsorption of the semiconductor element is prevented. It is released.

On the other hand, the lower side air pressure is lower than the upper side air pressure on the basis of the semiconductor element loaded in the loading portion, so that the semiconductor element can be adsorbed on the loading portion.

As shown in FIG. 9, the basic technical idea is that the intake hole is formed on the bottom side of the upper plate in the base formed of the upper plate and the lower plate as in the first embodiment, but the intake hole is blocked by the shear. The rear end of 30 may be realized by coupling an ejector 50 capable of sucking the air of the intake hole.

The ejector 50 may suck air from the intake holes to lower the air pressure of the intake holes and the adsorption holes to a low level. In this case, after the ejector 50 is operated when the base 30 moves linearly, it is controlled by a controller (not shown) to stop the operation of the ejector 50 at the same time as the base 30 stops. . Therefore, when the base 30 moves linearly, the ejector 50 operates to lower the air pressure of the intake and adsorption holes located below the semiconductor element, thereby reducing the air pressure difference between the lower air layer of the semiconductor element and the upper air layer of the semiconductor element. To generate the semiconductor element so as to be firmly adsorbed to the mounting portion 30a, and when the expectation stops, it is inoperative to cancel the pressure difference, thereby releasing the adsorption force of the semiconductor element.

As described above, the detailed description of the present invention has been made by the embodiments with reference to the accompanying drawings. However, since the above-described embodiments have only been described with reference to preferred embodiments of the present invention, the present invention is limited to the above embodiments. It should not be understood that the scope of the present invention is to be understood by the claims and equivalent concepts described below.

As described in detail above, according to the present invention, the semiconductor device is adsorbed by the simple configuration using Bernoulli's theorem so that the semiconductor device is adsorbed to maintain a solid loading state, and when the expectation is indicated, Since the adsorption is released and the unloading operation and the like can be properly performed, the semiconductor element can be prevented from being separated from the loading position, thereby ensuring high-speed mobility of the expectation and sorting in accordance with guaranteeing high-speed mobility of the expectation. Work by hands or unloading hands can be done quickly, ultimately reducing the unnecessary downtime of the test handler, thereby increasing the operation rate.

Claims (6)

A base having at least one mounting portion for loading a semiconductor element; And A drive device for enabling linear movement of the base; Including, The loading part is formed in the lower part of the loading part in such a manner that an intake hole formed to penetrate the base in the linear movement direction of the base and an adsorption hole communicating the intake hole to the loading part are synchronized with the linear motion of the base. A sorting table device for a test handler, characterized in that the semiconductor element is adsorbed on the test handler. delete delete A base having at least one mounting portion for loading a semiconductor element; And A drive device for enabling linear movement of the base; Including, The base is provided with an intake groove formed below the mounting portion so as to penetrate the base in the linear movement direction of the base, and an adsorption hole for communicating the intake groove with the loading portion in synchronization with the linear movement of the base. A sorting table device for a test handler, characterized by adsorbing a semiconductor element to a portion. delete delete

Images