KR100718485B1 - 본딩 툴의 얼라인을 위한 장치 및 방법 - Google Patents

본딩 툴의 얼라인을 위한 장치 및 방법 Download PDF

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Publication number
KR100718485B1
KR100718485B1 KR1020050005883A KR20050005883A KR100718485B1 KR 100718485 B1 KR100718485 B1 KR 100718485B1 KR 1020050005883 A KR1020050005883 A KR 1020050005883A KR 20050005883 A KR20050005883 A KR 20050005883A KR 100718485 B1 KR100718485 B1 KR 100718485B1
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KR
South Korea
Prior art keywords
force
bonding tool
force sensor
sensing
alignment
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Expired - Lifetime
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KR1020050005883A
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English (en)
Korean (ko)
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KR20050076714A (ko
Inventor
찬라이와헬렌
쵸슈홍
루차우키페터
엔지밍와이켈빈
아우유크체웅
Original Assignee
에이에스엠 어쌤블리 오토메이션 리미티드
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Publication of KR20050076714A publication Critical patent/KR20050076714A/ko
Application granted granted Critical
Publication of KR100718485B1 publication Critical patent/KR100718485B1/ko
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    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/23—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Signal Processing (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
KR1020050005883A 2004-01-21 2005-01-21 본딩 툴의 얼라인을 위한 장치 및 방법 Expired - Lifetime KR100718485B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/762,826 2004-01-21
US10/762,826 US7240711B2 (en) 2004-01-21 2004-01-21 Apparatus and method for alignment of a bonding tool

Publications (2)

Publication Number Publication Date
KR20050076714A KR20050076714A (ko) 2005-07-26
KR100718485B1 true KR100718485B1 (ko) 2007-05-16

Family

ID=34750379

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020050005883A Expired - Lifetime KR100718485B1 (ko) 2004-01-21 2005-01-21 본딩 툴의 얼라인을 위한 장치 및 방법

Country Status (6)

Country Link
US (1) US7240711B2 (enExample)
JP (1) JP4364810B2 (enExample)
KR (1) KR100718485B1 (enExample)
CN (1) CN100423185C (enExample)
MY (1) MY137648A (enExample)
SG (1) SG113575A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7849896B2 (en) * 2008-02-26 2010-12-14 Asm Assembly Automation Ltd Bondhead alignment tool for a bonding apparatus
US8016010B2 (en) * 2009-09-02 2011-09-13 Asm Assembly Automation Ltd Rotary bonding tool which provides a large bond force
DE102011008377A1 (de) * 2011-01-12 2012-07-12 Emitec Gesellschaft Für Emissionstechnologie Mbh Thermoelektrisches Material und Verfahren zur Herstellung
CH707934B1 (de) * 2013-04-19 2017-04-28 Besi Switzerland Ag Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.
DE102013210370A1 (de) * 2013-06-04 2014-12-04 Böllhoff Verbindungstechnik GmbH Einstellhilfe für eine Fügeeinrichtung mit einem Stempel und einem Gegenwerkzeug sowie ein Verfahren zum Einstellen der Fügeeinrichtung
CH709459A1 (de) * 2014-04-02 2015-10-15 Kistler Holding Ag Vorspannvorrichtung einer Kraftmessvorrichtung, Kraftmessvorrichtung und Verfahren zu deren Einführung in Aussparungen von Maschinenteilen.
KR102361571B1 (ko) * 2016-06-15 2022-02-10 세미컨덕터 테크놀로지스 앤드 인스트루먼츠 피티이 엘티디 부품 픽업 작업 중에 픽업 헤드의 위치 및 힘을 자동으로 세팅, 교정 및 모니터링 또는 측정하는 장치 및 방법
TWI607207B (zh) * 2016-12-22 2017-12-01 矽品精密工業股份有限公司 模封設備
CN107823756B (zh) * 2017-10-12 2021-03-12 英华达（上海）科技有限公司 输液装置
CN108062070B (zh) * 2017-12-25 2019-05-24 重庆骄直电气有限公司 智能工件压装系统
US11911904B2 (en) * 2020-07-15 2024-02-27 Micron Technology, Inc. Apparatus and methods for enhanced microelectronic device handling
CN114388418B (zh) * 2021-12-28 2022-12-13 凌波微步半导体设备(常熟)有限公司 一种半导体焊线机的闭环位置补偿方法及系统

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05230458A (ja) * 1991-11-27 1993-09-07 Hoechst Ag 土壌補助剤としての菌類菌糸体の使用
JP2003194647A (ja) * 2001-12-28 2003-07-09 Hitachi Unisia Automotive Ltd 外力センサ

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
CN1055337C (zh) * 1995-05-19 2000-08-09 清华大学 压电谐振式力传感器
US5985064A (en) * 1996-11-28 1999-11-16 Matsushita Electric Industrial Co., Ltd. Chip compression-bonding apparatus and method
DE59711263D1 (de) * 1997-10-30 2004-03-04 Esec Trading Sa Verfahren und Einrichtung für die Justierung des Bondkopfs einer Maschine für das Bonden von Halbleiterchips auf ein Trägermaterial
JP2000193544A (ja) * 1998-12-25 2000-07-14 Ngk Insulators Ltd 力センサ
JP2000275127A (ja) * 1999-03-26 2000-10-06 Ngk Insulators Ltd 力センサ回路
JP2002170831A (ja) * 2000-12-04 2002-06-14 Sony Corp ダイボンド装置およびダイボンド方法

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH05230458A (ja) * 1991-11-27 1993-09-07 Hoechst Ag 土壌補助剤としての菌類菌糸体の使用
JP2003194647A (ja) * 2001-12-28 2003-07-09 Hitachi Unisia Automotive Ltd 外力センサ

Non-Patent Citations (2)

* Cited by examiner, † Cited by third party
Title
05230458
15194647

Also Published As

Publication number Publication date
JP2005210128A (ja) 2005-08-04
CN1645561A (zh) 2005-07-27
CN100423185C (zh) 2008-10-01
JP4364810B2 (ja) 2009-11-18
KR20050076714A (ko) 2005-07-26
MY137648A (en) 2009-02-27
US7240711B2 (en) 2007-07-10
US20050155712A1 (en) 2005-07-21
SG113575A1 (en) 2005-08-29

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