Classifications

• • H—ELECTRICITY
  • H04—ELECTRIC COMMUNICATION TECHNIQUE
  • H04M—TELEPHONIC COMMUNICATION
  • H04M1/00—Substation equipment, e.g. for use by subscribers
  • H04M1/02—Constructional features of telephone sets
  • H04M1/23—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67242—Apparatus for monitoring, sorting or marking
  • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/67005—Apparatus not specifically provided for elsewhere
  • H01L21/67011—Apparatus for manufacture or treatment
  • H01L21/67092—Apparatus for mechanical treatment
• • H—ELECTRICITY
  • H01—ELECTRIC ELEMENTS
  • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
  • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
  • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
  • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

• Engineering & Computer Science (AREA)
• Physics & Mathematics (AREA)
• Condensed Matter Physics & Semiconductors (AREA)
• General Physics & Mathematics (AREA)
• Manufacturing & Machinery (AREA)
• Computer Hardware Design (AREA)
• Microelectronics & Electronic Packaging (AREA)
• Power Engineering (AREA)
• Signal Processing (AREA)
• Die Bonding (AREA)
• Wire Bonding (AREA)
• Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)

Applications Claiming Priority (1)

Publications (1)

Family

ID=34750379

Family Applications (1)

Country Status (6)

Families Citing this family (12)

Family Cites Families (8)

• 2004
  • 2004-01-21 US US10/762,826 patent/US7240711B2/en not_active Expired - Lifetime
• 2005
  • 2005-01-19 CN CNB2005100023818A patent/CN100423185C/zh not_active Expired - Lifetime
  • 2005-01-19 MY MYPI20050207A patent/MY137648A/en unknown
  • 2005-01-20 SG SG200500296A patent/SG113575A1/en unknown
  • 2005-01-20 JP JP2005012983A patent/JP4364810B2/ja not_active Expired - Lifetime
  • 2005-01-21 KR KR1020050005883A patent/KR100718485B1/ko not_active Expired - Lifetime

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