MY137648A - Apparatus and method for alignment of a bonding tool - Google Patents

Apparatus and method for alignment of a bonding tool

Info

Publication number
MY137648A
MY137648A MYPI20050207A MYPI20050207A MY137648A MY 137648 A MY137648 A MY 137648A MY PI20050207 A MYPI20050207 A MY PI20050207A MY PI20050207 A MYPI20050207 A MY PI20050207A MY 137648 A MY137648 A MY 137648A
Authority
MY
Malaysia
Prior art keywords
bonding tool
alignment
force
sensing section
sensing
Prior art date
Application number
MYPI20050207A
Other languages
English (en)
Inventor
Chan Lai Wa Helen
Choy Siu Hong
Liu Chou Kee Peter
Ng Ming Wai Kelvin
Au Yuk Cheung
Original Assignee
Asm Assembly Automation Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Asm Assembly Automation Ltd filed Critical Asm Assembly Automation Ltd
Publication of MY137648A publication Critical patent/MY137648A/en

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H04—ELECTRIC COMMUNICATION TECHNIQUE
    • H04M—TELEPHONIC COMMUNICATION
    • H04M1/00—Substation equipment, e.g. for use by subscribers
    • H04M1/02—Constructional features of telephone sets
    • H04M1/23—Construction or mounting of dials or of equivalent devices; Means for facilitating the use thereof
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Signal Processing (AREA)
  • Die Bonding (AREA)
  • Wire Bonding (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
MYPI20050207A 2004-01-21 2005-01-19 Apparatus and method for alignment of a bonding tool MY137648A (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/762,826 US7240711B2 (en) 2004-01-21 2004-01-21 Apparatus and method for alignment of a bonding tool

Publications (1)

Publication Number Publication Date
MY137648A true MY137648A (en) 2009-02-27

Family

ID=34750379

Family Applications (1)

Application Number Title Priority Date Filing Date
MYPI20050207A MY137648A (en) 2004-01-21 2005-01-19 Apparatus and method for alignment of a bonding tool

Country Status (6)

Country Link
US (1) US7240711B2 (enExample)
JP (1) JP4364810B2 (enExample)
KR (1) KR100718485B1 (enExample)
CN (1) CN100423185C (enExample)
MY (1) MY137648A (enExample)
SG (1) SG113575A1 (enExample)

Families Citing this family (12)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US7849896B2 (en) * 2008-02-26 2010-12-14 Asm Assembly Automation Ltd Bondhead alignment tool for a bonding apparatus
US8016010B2 (en) * 2009-09-02 2011-09-13 Asm Assembly Automation Ltd Rotary bonding tool which provides a large bond force
DE102011008377A1 (de) * 2011-01-12 2012-07-12 Emitec Gesellschaft Für Emissionstechnologie Mbh Thermoelektrisches Material und Verfahren zur Herstellung
CH707934B1 (de) * 2013-04-19 2017-04-28 Besi Switzerland Ag Verfahren zum Montieren von elektronischen oder optischen Bauelementen auf einem Substrat.
DE102013210370A1 (de) * 2013-06-04 2014-12-04 Böllhoff Verbindungstechnik GmbH Einstellhilfe für eine Fügeeinrichtung mit einem Stempel und einem Gegenwerkzeug sowie ein Verfahren zum Einstellen der Fügeeinrichtung
CH709459A1 (de) * 2014-04-02 2015-10-15 Kistler Holding Ag Vorspannvorrichtung einer Kraftmessvorrichtung, Kraftmessvorrichtung und Verfahren zu deren Einführung in Aussparungen von Maschinenteilen.
KR102361571B1 (ko) * 2016-06-15 2022-02-10 세미컨덕터 테크놀로지스 앤드 인스트루먼츠 피티이 엘티디 부품 픽업 작업 중에 픽업 헤드의 위치 및 힘을 자동으로 세팅, 교정 및 모니터링 또는 측정하는 장치 및 방법
TWI607207B (zh) * 2016-12-22 2017-12-01 矽品精密工業股份有限公司 模封設備
CN107823756B (zh) * 2017-10-12 2021-03-12 英华达（上海）科技有限公司 输液装置
CN108062070B (zh) * 2017-12-25 2019-05-24 重庆骄直电气有限公司 智能工件压装系统
US11911904B2 (en) * 2020-07-15 2024-02-27 Micron Technology, Inc. Apparatus and methods for enhanced microelectronic device handling
CN114388418B (zh) * 2021-12-28 2022-12-13 凌波微步半导体设备(常熟)有限公司 一种半导体焊线机的闭环位置补偿方法及系统

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE4138883C1 (enExample) * 1991-11-27 1993-05-27 Hoechst Ag, 6230 Frankfurt, De
CN1055337C (zh) * 1995-05-19 2000-08-09 清华大学 压电谐振式力传感器
US5985064A (en) * 1996-11-28 1999-11-16 Matsushita Electric Industrial Co., Ltd. Chip compression-bonding apparatus and method
DE59711263D1 (de) * 1997-10-30 2004-03-04 Esec Trading Sa Verfahren und Einrichtung für die Justierung des Bondkopfs einer Maschine für das Bonden von Halbleiterchips auf ein Trägermaterial
JP2000193544A (ja) * 1998-12-25 2000-07-14 Ngk Insulators Ltd 力センサ
JP2000275127A (ja) * 1999-03-26 2000-10-06 Ngk Insulators Ltd 力センサ回路
JP2002170831A (ja) * 2000-12-04 2002-06-14 Sony Corp ダイボンド装置およびダイボンド方法
JP2003194647A (ja) * 2001-12-28 2003-07-09 Hitachi Unisia Automotive Ltd 外力センサ

Also Published As

Publication number Publication date
JP2005210128A (ja) 2005-08-04
CN1645561A (zh) 2005-07-27
CN100423185C (zh) 2008-10-01
JP4364810B2 (ja) 2009-11-18
KR20050076714A (ko) 2005-07-26
KR100718485B1 (ko) 2007-05-16
US7240711B2 (en) 2007-07-10
US20050155712A1 (en) 2005-07-21
SG113575A1 (en) 2005-08-29

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