KR100697902B1 - Apparatus for inspecting printed wiring boards for mounting electronic component and method of verifing a bad pattern - Google Patents

Abstract

The present invention provides an inspection apparatus for a printed wiring board for mounting electronic components and a method for checking pattern defects, which can effectively discriminate intrinsic defects and pseudo defects. The inspection apparatus of the present invention includes a defect checking unit, which picks up an imaging area in which a defective portion of the wiring pattern detected by the image processing unit is located among the imaging areas partitioned into pieces, and displays the imaging area. Visually discriminates whether or not at least one defective part included in the image-displayed imaging area is intrinsic defect or all defective parts are pseudo defect, and selects and inputs the result by input means. . In the display means, each imaging area is displayed in an image in order of giving priority to the imaging area including a large defective portion.

Printed wiring board, bad pattern, intrinsic, pseudo, imaging, visual

Description

Apparatus for inspecting printed wiring boards for mounting electronic component and method of verifing a bad pattern}

1 is a diagram showing an imaging area partitioned into respective pieces of a printed wiring board for mounting electronic components.

Fig. 2 is a view showing a display screen on which an image capturing area is displayed on the display means (display) of the defective confirmation unit.

FIG. 3 is a diagram illustrating a display screen in which the image capturing area shown in FIG. 2 is further enlarged.

4 is a view showing a part of each imaging area partitioned into pieces.

FIG. 5 is a diagram showing a state in which each image capturing region of FIG. 4 is displayed on the display means in the order of including the coordinates of the defective portion having a larger size.

Fig. 6 is a diagram showing a schematic configuration of an inspection apparatus of a printed wiring board for mounting electronic components in one embodiment of the present invention.

Fig. 7 is a flowchart showing the inspection processing procedure by the inspection apparatus of the printed wiring board for mounting electronic components in one embodiment of the present invention.

Fig. 8 is a flowchart showing the inspection processing procedure by the inspection apparatus of the printed wiring board for mounting electronic components in one embodiment of the present invention.

9A and 9B are views (display screens of displays) for explaining a method for confirming a pattern failure by a conventional inspection apparatus for a printed wiring board for mounting electronic components.

The present invention is a flexible printed circuit (FRP) and film carrier tape (TAB (Tape Automated Bonding) tape, T-BGA (Tape Ball Grid Array) tape, Chip Size Package) tape, ASIC (Application Specific Integrated) Print for mounting electronic components such as flexible tape wiring boards such as circuit tape, COF (chip on film) tape, 2-metal (double-sided wiring) tape, multilayer wiring tape, etc.) and rigid printed wiring boards using glass epoxy substrate For each piece on which the wiring pattern of the wiring board is formed, the electronic device which detects the presence or absence of a defective part in the wiring pattern and confirms the detected defective part by comparing the image data obtained by imaging the piece with the master pattern An inspection apparatus for a printed circuit board for component mounting and a method for identifying a pattern defect using the inspection apparatus. In the present invention, the "printed wiring board for mounting electronic components" includes not only the printed wiring board before mounting the electronic components but also the printed wiring board after mounting the electronic components.

Electronic components such as flexible FPCs and TAB tapes for assembling electronic components such as ICs (Integrated Circuits) and LSIs (Large Integrated Circuits) to devices equipped with liquid crystal displays such as mobile phones, personal computers and televisions, or printers. A mounting method using a film carrier tape for mounting and a rigid printed wiring board (PWB) has been adopted. In these printed wiring boards for electronic component mounting, the quality is checked before and after mounting the electronic components on the wiring board, for example, defects such as disconnection, short circuit, missing, and protrusion in the wiring pattern.

Background Art [0002] Conventionally, various image processing apparatuses for automatically inspecting defects such as disconnection, short circuit, missing, and protrusion have been proposed for each wiring pattern formed on a TAB tape or the like (for example, Japanese Patent Laid-Open No. 6-341960, Japan). See Japanese Patent Application Laid-Open No. 2000-151198 and Japanese Patent Laid-Open No. 2003-141508). In these image processing apparatuses, image processing for comparing a wiring pattern such as a TAB tape with a master pattern is performed to detect a defect. For example, when inspecting a TAB tape, a master pattern as a reference is created from good TAB tapes and registered in advance in the image memory. By comparing the image data with the master pattern, determination is made regarding the presence or absence of defects such as disconnection, short circuit, missing, and projection.

In addition, the defective information obtained by processing in this image processing apparatus includes not only intrinsic defects such as disconnection, short circuit, missing, and protrusion, but also pseudoness caused by attached foreign matter, degree of reflection of light, and the like. Since a defect may also be included, a confirmation device is provided together with the image processing device, and each of the defective parts detected by the image processing device is visually discriminated using this confirmation device. .

The confirmation apparatus performs imaging for each position where a defect is detected in the image processing apparatus, and displays each defective position on the display one by one. That is, as shown in Figs. 9A and 9B, each detection position a1, a2, a3, a4 of each defective portion detected by the image processing apparatus in one piece 23 (Fig. 9A), respectively. By picking up with a camera and displaying the enlarged image 31 (FIG. 9B), and observing this enlarged display image 31, the detected defective part has disconnection 41, the short circuit 42, the missing 43, and the projection. (44) It is determined whether it is an intrinsic defect or a pseudo defect with the naked eye, and selects and inputs the result with a mouse, a keyboard, etc.

In this way, visual inspection and result input are performed for each defect detection position in the piece one by one, and it is determined whether the defect at any defect detection position is an intrinsic defect or a defect in all the defect detection positions is a pseudo defect. This operation is repeated for one piece until confirmation.

As described above, since the image processing apparatus performs imaging and enlargement display one by one with respect to the plurality of defect inspection positions detected in one piece and visually discriminates them sequentially, the defect detection position detected in the piece is In many cases verification takes a long time.

SUMMARY OF THE INVENTION The present invention has been made to solve the problems of the prior art, and an object thereof is to inspect an electronic component mounting printed wiring board capable of efficiently discriminating intrinsic defects and pseudo defects, and a pattern defect using the inspection apparatus. It is to provide a verification method.

In the inspection apparatus for an electronic component mounting printed wiring board of the present invention, the inspection apparatus for an electronic component mounting printed wiring board that inspects whether or not a pattern is defective in each piece on which a wiring pattern is formed,

The inspection apparatus is provided with a defect confirmation section for confirming a defective portion of a wiring pattern detected by image processing for comparing the image data obtained by imaging the piece with a master pattern,

The failure confirmation unit,

Display means for image-displaying the imaging region including one or more of the defective portions based on the image data obtained by imaging the imaging region partitioned into the piece;

Display control means for controlling the imaging area to be displayed on the display means in an order of giving priority to the imaging area including the defective portion having the largest size;

At least one of the defective portions included in the image capturing region is intrinsic defective with respect to the image capturing region image-displayed on the display means, or all of the defective portions included in the image capturing region are pseudo defects. And input means for performing selective input for confirming the result of visual discrimination with respect to the application.

In addition, the inspection apparatus of the printed wiring board for mounting an electronic component of the present invention compares the image data obtained by imaging the piece with the master pattern, and determines the presence or absence of a defective part in the wiring pattern of the piece and calculates the size of the defective part. And an image processing unit for performing the step.

Moreover, the inspection apparatus of the printed wiring board for mounting electronic components of this invention,

When the image processing unit determines that there is a defective portion in the wiring pattern of the piece, the image processing unit outputs a defective signal to the defective confirmation unit,

The failure confirmation unit,

And a good quality signal determining means for correcting the bad signal output from the image processing unit and confirming it as a good quality signal when all of the bad parts included in the respective imaging areas are pseudo bad as a result of the visual discrimination. It is done.

The inspection apparatus for an electronic component mounting printed wiring board according to the present invention is further characterized by including a defect marking portion for performing defect marking on the piece corresponding to the defect signal based on the defect signal.

In addition, the pattern defect confirmation method of the printed wiring board for electronic component mounting of this invention is the said defect detected by the inspection apparatus of the printed wiring board for electronic component mounting which detects the defective part of the wiring pattern in each piece by image processing. In the method for identifying the part,

Calculate which imaging area of each imaging area partitioned the defective portion is located in the piece,

Based on the image data of the imaging area including one or more of the defective parts obtained by imaging this calculated imaging area, the imaging area including the defective part having the largest size is given priority in the above-mentioned order. Image is displayed on the display means,

Visually discriminating the imaging area image-displayed on the display means as to whether at least one defective part included in this imaging area is intrinsic defective or all the defective parts included in this imaging area are pseudo defective. and,

It is characterized in that the result of the visual discrimination is selected and input by the input means to confirm.

In addition, the pattern defect confirmation method of the printed wiring board for electronic component mounting of this invention performs the said image process by comparing the image data obtained by imaging the said piece, and a master pattern, and based on this comparison result, the wiring of the said piece It is characterized by determining the presence or absence of defective parts in the pattern and calculating the size of the defective parts.

In addition, the pattern defect confirmation method of the printed wiring board for mounting an electronic component of the present invention is based on the above-described visual discrimination, when all the defective portions included in the respective imaging areas are pseudo defects. It is characterized in that the defective signal outputted to the signal is corrected and confirmed as a good signal.

The defective pattern confirmation method of the printed wiring board for mounting an electronic component according to the present invention is characterized in that the defective marking is performed on the piece corresponding to the defective signal based on the defective signal.

EMBODIMENT OF THE INVENTION Hereinafter, embodiment of this invention is described, referring drawings. Fig. 6 is a diagram showing a schematic configuration of an inspection apparatus (hereinafter referred to as an "inspection apparatus") of a printed wiring board for mounting electronic components in one embodiment of the present invention.

As shown in Fig. 6, this inspection apparatus is a printed wiring board for mounting electronic components (hereinafter referred to as TAB tape or the like) for inspecting the presence or absence of a defective wiring pattern in each piece arranged in the longitudinal direction of the tape. The unwinding part 11 which unwinds a carrier tape (henceforth "film carrier tape") is demonstrated as an example, and wiring is carried out about each piece of film carrier tape by image processing. The image processing unit 12 which determines the presence or absence of a defective pattern and calculates the size of the defective portion when the defect is detected is discriminated as to whether the defective portion detected by the image processing unit 12 is true or pseudo defective. The defect confirming unit 13 which carries out the inspection, the defect marking unit 14 which carries out the defective marking on the defective piece based on the determined defect signal of the defect confirming unit 13, and the film carrier tape which finished the inspection. And a conveyance control unit 16 that controls conveyance of the film carrier tape based on communication data from the image processing unit 12, the defect checking unit 13, and the defect marking unit 14. have.

In the unwinding part 11, the film carrier tape to be inspected is wound around a reel via a protective spacer, and the film carrier tape is unwound together with the protective spacer by motor driving a rotating shaft on which the reel is fixed.

The film carrier tape unwound from the unwinding part 11 is guided by the guide roller and conveyed to the image processing part 12. While conveying this film carrier tape by unwinding from the reel in the unwinding part 11 and winding up by the lilo in the winding-up part 15, it pitches a tape by engaging with the sprocket hole of a film carrier tape, for example. The conveying gear is driven by rotationally driving a drive gear provided on the roller surface, and the drive control unit 16 controls the driving of the drive gear.

Each piece of the film carrier tape is subjected to defect detection in the image processing unit 12 and confirmation (determination of discrimination between true and pseudo defects) by the defect confirmation unit 13, and then the defective marking unit 14 ) Is then transferred to the winding unit 15 after the poor marking is performed by punching, ink marking or the like. In the winding-up part 15, the film carrier tape which completed the test | inspection is wound by the reel with the protective spacer conveyed and supplied from the reel of the unwinding part 11. As shown in FIG.

Hereinafter, the configurations of the image processing unit 12 and the defect checking unit 13 will be described with reference to FIGS. 1 to 5. The image processing part 12 can be comprised with the image processing apparatus conventionally used. In this image processing unit 12, a master pattern created based on a good piece in advance is registered in the image memory as pixel data. The piece 23 of FIG. 1 conveyed to the image processing part 12 is a camera, such as a line sensor camera, is imaged by scanning with a black-and-white image, for example, and the obtained image data is stored in an image memory.

The image data of the piece 23 is subjected to arithmetic processing comparing with the master pattern, and the presence or absence of defective parts such as disconnection, short circuit, missing, and projections is determined, and the size is calculated when there are defective parts. do.

In this way, the coordinate data specifying the position in the piece of the defective portion detected by the image processing unit 12 is the coordinate where the defective portion having the larger size is located, starting from the coordinate where the defective portion having the largest size is located. Are output to the failure checking unit 13 in order of priority. In the defect confirmation unit 13, a color CCD camera, which is an imaging device separate from the imaging device (such as a black and white camera) included in the image processing unit 12, is provided on the film carrier tape 21 of FIG. The inside of the piece 23 is configured to image the wiring pattern in each of the imaging areas 24, 24, ... where the camera head is moved and defective. The imaging area 24 is partitioned into a rectangular shape of, for example, 3 mm x 2 mm. In this case, the imaging area 24 is enlarged by about 100 times and displayed on the display. However, the size of the imaging area 24 can be suitably set under appropriate conditions so that confirmation can be easily performed while viewing the display image.

After the coordinate data of the defective portion is outputted to the defective confirmation unit 13, the coordinates outputted by the calculation unit such as the arithmetic processing unit provided in the defective ... Is calculated in which imaging area, and the corresponding imaging area is calculated. Each calculated imaging area may include not only one but also a plurality of defective parts simultaneously.

Next, the color CCD camera head is moved to the calculated imaging area 24 to image the area. The image data of the area obtained by imaging is image-displayed on display means such as a display.

As shown in Fig. 2, the image display area 24 is displayed on the display screen of the display, and an input unit 29 for inputting a result of visual discrimination or the like through a mouse operation or a key operation is displayed. From the image of the imaging area 24 displayed on the display, the inspector judges whether the defective parts 28 and 28 included in the imaging area 24 are intrinsic defects or pseudo defects, respectively. At this time, the corresponding section in the image capturing area 24 can be enlarged and displayed in detail by clicking or pressing the magnification buttons Nos. 1 to 9 of the input unit 29, and visually discriminates more accurately. I can do it. For example, when a magnification button of number 6 is clicked or a key is input, the section corresponding to number 6 in the imaging area 24 is enlarged and displayed as shown in FIG.

The result of confirming each defective part 28, 28 in the imaging area 24 is input by input means (mouse, keyboard, etc.). That is, in FIG. 2, visual discrimination is performed as to whether at least one of the defective portions 28 and 28 in the image capturing region 24 is a true defect or whether both defective portions 28 and 28 are pseudo defects. The result of the determination is confirmed by clicking on the selection button of the input unit 29 with a mouse or by key input.

As a result of visual discrimination, when at least one of the defective parts 28 and 28 in the imaging area 24 is intrinsic defect, the input signal is transmitted by clicking or keying in the intrinsic defective selection button, and the input signal is transmitted. Based on this, the defect signal output from the image processing unit 12 is determined, and the conveyance control unit 16 in FIG. 6 controls the conveyance so as to convey the piece to the defect marking unit 14 and stop it. Then, the piece 23 is subjected to defective marking such as punching and ink marking.

On the other hand, as a result of visual discrimination, when both of the defective parts 28 and 28 in the imaging area 24 of FIG. 2 are pseudo defects, an input signal is transmitted by clicking or keying in a pseudo selection button. Based on this input signal, the display control means of the defective confirmation unit 13 selects the next imaging region 24 in order of giving priority to the imaging region 24 including the coordinates 26 having the largest size of the defective portion. Control to display an image on the display.

As a result of visual discrimination on all of the imaging regions 24, 24, ... including the defective coordinates, when no genuine defects exist in any of the imaging regions, a good quality signal provided in the defective confirmation unit 13 is provided. The deciding means corrects the defective signal output from the image processing unit 12 and changes it to a good product signal. The piece is stored as a good product, and at the same time, the piece is recognized as a good product by the bad marking unit 14, and the bad marking is performed. This is not carried out but conveyed.

4 and 5, the coordinates 26 having the largest size of the defective portion among the imaging areas (Area No. 2, 18, 32) 24 including the defective coordinates 26 are described. Area No. containing An imaging area 24 of 18 is first displayed on the display (FIG. 5), and the above visual discrimination is performed on this area. As a result of visual discrimination, if the defective portion 28 in this area is pseudo defective (OK), an input signal is transmitted by clicking or keying in a pseudo defective selection button, and the display control means based on this input signal. Therefore, Area No. 2, which includes the coordinate 26, where the size of the defective portion is next larger. 32 is controlled to display the imaging area 24 on the display, thereby causing the area No. The above visual discrimination is performed for the 32 imaging areas 24. As a result of visual discrimination, when all the defective parts 28 and 28 in this area are pseudo defects, input is performed in the same manner as above, and Area No including the coordinates 26 where the size of the defective part is next larger. . The imaging area 24 of 2 is displayed on the display, and the above visual discrimination is performed on this area.

As described above, since the image is sequentially displayed on the display and visually discriminated from the imaging region 24 including the coordinates having the large size of the defective portion, since the imaging region 24 including the defective portion which is likely to be a genuine defect, Visual discrimination can be performed sequentially.

Furthermore, since visual discrimination is performed for each imaging area instead of visual discrimination for each defective coordinate detected by the image processing unit 12, the imaging region can include not only one but also a plurality of defective coordinates. Visual discrimination can be performed as a unit.

Therefore, according to the inspection apparatus of the present embodiment, the number of times of discrimination between intrinsic and pseudo defects is greatly reduced in one piece, and for example, the time required for defect confirmation can be reduced by about 30% as compared with the conventional configuration. As a result, the defect can be checked efficiently.

As mentioned above, although the structure of the image processing part and the defect confirmation part in this embodiment was demonstrated, this invention is not limited to this embodiment, A various deformation | transformation and a change are possible. For example, when sufficient accuracy is obtained in the comparison processing in the image processing unit, piece imaging in the image processing unit may be performed by a color CCD camera. In this case, the image pickup data acquired by the image processing unit is enlarged as it is to the defect confirmation unit. Can be transmitted and image display for confirmation. Therefore, in this case, one imaging device may be sufficient.

In addition, the image processing unit and the confirmation unit may be configured by the same computer without providing the image processing unit and the confirmation unit independently from each other.

In addition, in this embodiment, after calculating to the defect confirmation part sequentially from the coordinate where the size of a defective part is large, the calculation process was performed by the calculation means provided in the defect confirmation part, In addition, this calculation means was installed in the image processing part, and it was bad. You may perform arithmetic processing which calculates the imaging area containing a coordinate. In addition, after outputting data of each defective coordinate to the defective confirmation unit in any order, the defective confirmation unit 13 may store each coordinate data in the order of the size of the defective portion.

Hereinafter, the inspection process procedure by the inspection apparatus of this embodiment mentioned above is demonstrated, referring the flowchart shown to FIG. 7 and FIG.

In the unwinding part 11 of FIG. 6, the film carrier tape wound on the reel is unwound by motor driving a rotating shaft mounted on the reel, and pitch-feeded by the drive gear, so that the piece to be inspected is the image processing part 12. It is conveyed by (S11 of FIG. 7).

The piece conveyed to the image processing unit 12 is picked up by a camera (S12), and image data of the wiring pattern in this piece is acquired and stored in the image memory (S13).

Subsequently, arithmetic processing for comparing the obtained image data with image data of a master pattern registered in advance is performed (S14). As a result, the coordinate position and the size of the defective part in the piece are detected.

The coordinate data (bad coordinates) of the defective portion are sequentially output from the coordinates having the large size of the defective portion to the defective confirmation unit 13 (S15).

The defective confirmation unit 13 calculates in which imaging region the defective coordinates output from the image processing unit 12 are located in each of the imaging regions previously partitioned into pieces by the calculating means (S16).

The imaging area including the bad coordinate calculated by the calculation means is picked up by a color CCD camera separate from the camera of the image processing unit 12 (S17), and image data of the imaging area is obtained (S18).

Based on the obtained image data, the imaging area is image-displayed on the display means in the order of giving priority to the imaging area in which the size of the defective part includes the largest coordinate (S19 in FIG. 8).

Next, from the display image of the imaging area, visual discrimination is made as to whether one or more defective parts included in the imaging area are intrinsic defects or pseudo defects, respectively (S20).

As a result of visual discrimination, if at least one defective portion is an intrinsic defect, the result is selected and input by the input means (S31).

The defective signal output from the image processing unit 12 is determined based on this selected input signal, and the conveyance control unit 16 of FIG. 6 conveys this piece to the defective marking unit 14, and then stops conveying. By controlling, poor marking is performed by punching, ink marking, or the like (S32), and then the piece is conveyed to the winding unit 15 and wound up by a reel by motor driving a rotating shaft mounted on the reel (S51).

As a result of visual discrimination in S20, when all the defective parts included in this imaging area are pseudo defects, the result is selected and input by the input means (S41).

Subsequently, a determination is made as to whether visual discrimination has been made with respect to all of the imaging areas including the bad coordinates in this piece (S42). If an imaging area with no visual discrimination remains, the process returns to S19. The next imaging area is displayed on the display means. On the other hand, visual discrimination is performed with respect to all the imaging areas including the defective coordinates, and when all the defective parts in each imaging area are pseudo defects, they are output from the image processing unit 12 by the good quality signal determination means. The defective signal is corrected and changed to a good quality signal, and the piece is stored as good quality data, conveyed to the winding unit 15 as a piece of good quality, and wound up on the reel by driving a rotating shaft mounted on the reel (S51).

As mentioned above, although this invention was demonstrated by the limited embodiment and drawing, this invention is not limited by this and is within the equal range of a common technical idea in the technical field to which this invention belongs, and a claim described below. Of course, various modifications and variations are possible.

According to the inspection apparatus of the printed wiring board for mounting an electronic component and the method of confirming a pattern defect, the imaging region is divided into predetermined dimensions, and is visually discriminated by displaying on the display means sequentially from the imaging region including a large defective portion. In addition, since visual discrimination is performed on the basis of the imaging area obtained by including not only one but a plurality of defective parts as a unit, it is possible to efficiently discriminate between true and pseudo defects.

Claims (8)

In the inspection apparatus of the printed wiring board for mounting electronic components which inspects the presence or absence of the pattern defect in each piece in which the wiring pattern was formed, The inspection apparatus is provided with a defect confirmation section for confirming a defective portion of a wiring pattern detected by image processing for comparing the image data obtained by imaging the piece with a master pattern, The failure confirmation unit, Display means for image-displaying the imaging region including one or more of the defective portions based on the image data obtained by imaging the imaging region partitioned into the piece; Display control means for controlling the imaging area to be displayed on the display means in an order of giving priority to the imaging area including the defective portion having the largest size; At least one of the defective portions included in the image capturing region is intrinsic defective with respect to the image capturing region image-displayed on the display means, or all of the defective portions included in the image capturing region are pseudo defects. And an input means for performing selective input for confirming the result of visual discrimination with respect to the application. The method of claim 1, And an image processing unit which determines whether there is a defective part in the wiring pattern of the piece and calculates the size of the defective part by comparing the image data obtained by imaging the piece with the master pattern. Inspection equipment for wiring boards. The method of claim 2, When the image processing unit determines that there is a defective portion in the wiring pattern of the piece, the image processing unit outputs a defective signal to the defective confirmation unit, The failure confirmation unit, And, as a result of the visual discrimination, when all of the defective portions included in the respective imaging areas are pseudo defects, good quality signal confirmation means for correcting the defective signal output from the image processing unit and determining it as a good quality signal. Inspection apparatus for printed wiring boards for mounting electronic components. The method of claim 3, And a defective marking portion for performing a defective marking on the piece corresponding to the defective signal on the basis of the defective signal. In the method for confirming the said defective part detected by the inspection apparatus of the printed wiring board for electronic component mounting which detects the defective part of the wiring pattern in each piece by image processing, Calculate which imaging area of each imaging area partitioned the defective portion is located in the piece, Based on the image data of the imaging area including one or more of the defective parts obtained by imaging this calculated imaging area, the imaging area including the defective part having the largest size is given priority in the above-mentioned order. Image is displayed on the display means, Visually discriminating the imaging area image-displayed on the display means as to whether at least one defective part included in this imaging area is intrinsic defective or all the defective parts included in this imaging area are pseudo defective. and, A method for confirming a pattern failure of a printed wiring board for mounting electronic components, characterized in that the result of the visual discrimination is selected and inputted by an input means. The method of claim 5, The image processing is performed by comparing the master data with the image data obtained by imaging the piece, and based on the comparison result, determination of the presence or absence of the defective part in the wiring pattern of the piece and the calculation of the size of the defective part are performed. The pattern defect confirmation method of the printed wiring board for mounting electronic components characterized by the above-mentioned. The method of claim 6, And as a result of the visual discrimination, when all of the defective portions included in the respective imaging areas are pseudo defective, the defective signal outputted at the time of the defective determination by the image processing is corrected and determined as a good signal. How to check pattern defect on printed wiring board for component mounting. The method of claim 7, wherein And defective marking on the piece corresponding to the defective signal, based on the defective signal.

Images