KR100687342B1 - 단결정 실리콘 형성방법 - Google Patents
단결정 실리콘 형성방법 Download PDFInfo
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- KR100687342B1 KR100687342B1 KR1020030098755A KR20030098755A KR100687342B1 KR 100687342 B1 KR100687342 B1 KR 100687342B1 KR 1020030098755 A KR1020030098755 A KR 1020030098755A KR 20030098755 A KR20030098755 A KR 20030098755A KR 100687342 B1 KR100687342 B1 KR 100687342B1
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- Prior art keywords
- film
- single crystal
- crystal silicon
- silicon
- amorphous silicon
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- 238000000034 method Methods 0.000 title claims abstract description 29
- 229910021419 crystalline silicon Inorganic materials 0.000 title 1
- 229910021421 monocrystalline silicon Inorganic materials 0.000 claims abstract description 66
- 229910021417 amorphous silicon Inorganic materials 0.000 claims abstract description 49
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 claims abstract description 34
- 239000011863 silicon-based powder Substances 0.000 claims abstract description 29
- 239000000758 substrate Substances 0.000 claims abstract description 15
- 239000011521 glass Substances 0.000 claims abstract description 13
- 230000004888 barrier function Effects 0.000 claims abstract description 11
- 238000009792 diffusion process Methods 0.000 claims abstract description 11
- 239000012535 impurity Substances 0.000 claims abstract description 11
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 claims abstract description 7
- 229910052739 hydrogen Inorganic materials 0.000 claims abstract description 7
- 239000001257 hydrogen Substances 0.000 claims abstract description 7
- 238000000059 patterning Methods 0.000 claims abstract description 5
- 230000009471 action Effects 0.000 claims abstract description 3
- 238000000137 annealing Methods 0.000 claims abstract description 3
- 238000000151 deposition Methods 0.000 claims abstract description 3
- 238000010438 heat treatment Methods 0.000 claims description 15
- 229910052581 Si3N4 Inorganic materials 0.000 claims description 9
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 8
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 8
- 239000013078 crystal Substances 0.000 claims description 7
- 238000004140 cleaning Methods 0.000 claims description 2
- 229910052710 silicon Inorganic materials 0.000 abstract description 5
- 239000010703 silicon Substances 0.000 abstract description 5
- 239000010408 film Substances 0.000 description 54
- 239000004973 liquid crystal related substance Substances 0.000 description 7
- 230000002093 peripheral effect Effects 0.000 description 5
- 238000004519 manufacturing process Methods 0.000 description 4
- 238000007796 conventional method Methods 0.000 description 3
- 230000008569 process Effects 0.000 description 3
- 238000002425 crystallisation Methods 0.000 description 2
- 230000008025 crystallization Effects 0.000 description 2
- 238000003475 lamination Methods 0.000 description 2
- 238000012423 maintenance Methods 0.000 description 2
- 238000012986 modification Methods 0.000 description 2
- 230000004048 modification Effects 0.000 description 2
- 238000004151 rapid thermal annealing Methods 0.000 description 2
- 230000009467 reduction Effects 0.000 description 2
- 229910004298 SiO 2 Inorganic materials 0.000 description 1
- 230000015572 biosynthetic process Effects 0.000 description 1
- 239000002800 charge carrier Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 230000001678 irradiating effect Effects 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000000746 purification Methods 0.000 description 1
- 239000004065 semiconductor Substances 0.000 description 1
- 238000007711 solidification Methods 0.000 description 1
- 230000008023 solidification Effects 0.000 description 1
- 239000010409 thin film Substances 0.000 description 1
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Classifications
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- G—PHYSICS
- G02—OPTICS
- G02F—OPTICAL DEVICES OR ARRANGEMENTS FOR THE CONTROL OF LIGHT BY MODIFICATION OF THE OPTICAL PROPERTIES OF THE MEDIA OF THE ELEMENTS INVOLVED THEREIN; NON-LINEAR OPTICS; FREQUENCY-CHANGING OF LIGHT; OPTICAL LOGIC ELEMENTS; OPTICAL ANALOGUE/DIGITAL CONVERTERS
- G02F1/00—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics
- G02F1/01—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour
- G02F1/13—Devices or arrangements for the control of the intensity, colour, phase, polarisation or direction of light arriving from an independent light source, e.g. switching, gating or modulating; Non-linear optics for the control of the intensity, phase, polarisation or colour based on liquid crystals, e.g. single liquid crystal display cells
- G02F1/133—Constructional arrangements; Operation of liquid crystal cells; Circuit arrangements
- G02F1/136—Liquid crystal cells structurally associated with a semi-conducting layer or substrate, e.g. cells forming part of an integrated circuit
- G02F1/1362—Active matrix addressed cells
- G02F1/1368—Active matrix addressed cells in which the switching element is a three-electrode device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L27/00—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
- H01L27/02—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers
- H01L27/12—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body
- H01L27/1214—Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including semiconductor components specially adapted for rectifying, oscillating, amplifying or switching and having potential barriers; including integrated passive circuit elements having potential barriers the substrate being other than a semiconductor body, e.g. an insulating body comprising a plurality of TFTs formed on a non-semiconducting substrate, e.g. driving circuits for AMLCDs
- H01L27/1259—Multistep manufacturing methods
- H01L27/127—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement
- H01L27/1274—Multistep manufacturing methods with a particular formation, treatment or patterning of the active layer specially adapted to the circuit arrangement using crystallisation of amorphous semiconductor or recrystallisation of crystalline semiconductor
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
- H01L29/78—Field effect transistors with field effect produced by an insulated gate
- H01L29/786—Thin film transistors, i.e. transistors with a channel being at least partly a thin film
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- Physics & Mathematics (AREA)
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- General Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- Chemical & Material Sciences (AREA)
- Computer Hardware Design (AREA)
- Crystallography & Structural Chemistry (AREA)
- Nonlinear Science (AREA)
- Manufacturing & Machinery (AREA)
- Ceramic Engineering (AREA)
- Mathematical Physics (AREA)
- Optics & Photonics (AREA)
- Recrystallisation Techniques (AREA)
Abstract
Description
Claims (6)
- 유리기판 상에 불순물 확산 베리어막과 비정질 실리콘막을 차례로 증착하는 단계;상기 비정질 실리콘막을 열처리하여 막 내에 존재하는 수소를 제거하는 단계;상기 비정질 실리콘막을 패터닝하여 다수개의 홈을 형성하는 단계;상기 홈 내에 단결정 실리콘 파우더가 매립되도록 패터닝된 비정질 실리콘막 상에 상기 단결정 실리콘 파우더를 산포시키는 단계; 및상기 단계까지의 결과물에 대해 비정질 실리콘막은 완전 용융되고 단결정 실리콘 파우더는 일부만 용융되는 에너지를 가진 레이저를 조사하여 일부 용융되지 않은 단결정 실리콘 파우더가 시드로 작용하는 것을 통해 용융된 비정질 실리콘을 응고시켜 단결정 실리콘막을 형성하는 단계를 포함하는 것을 특징으로 하는 단결정 실리콘 형성방법.
- 제 1 항에 있어서, 상기 불순물 확산 베리어막은실리콘산화막(SiO2), 실리콘질화막(SiN), 실리콘산화막과 실리콘질화막의 적층막, 및 실리콘질화막과 실리콘산화막의 적층막으로 구성된 그룹으로부터 선택되는 어느 하나의 막으로 이루어진 것을 특징으로 하는 단결정 실리콘 형성방법.
- 제 1 항에 있어서, 상기 수소 제거를 위한 열처리는 퍼니스 열처리 또는 급속열처리로 수행하는 것을 특징으로 하는 단결정 실리콘 형성방법.
- 제 1 항에 있어서, 상기 홈은 비정질 실리콘막의 일부 두께가 잔류되도록 형성하거나, 또는, 불순물 확산 베리어막이 노출되도록 형성하는 것을 특징으로 하는 단결정 실리콘 형성방법.
- 제 1 항에 있어서, 상기 단결정 실리콘 파우더를 산포시키는 단계는 홈 내의 매립이 잘 이루어지도록 유리기판을 회전시키거나, 또는, 진동을 주는 상태로 수행하는 것을 특징으로 하는 단결정 실리콘 형성방법.
- 제 1 항에 있어서, 상기 용융되지 않은 단결정 실리콘 파우더를 시드로 하는 비정질 실리콘의 단결정화를 위한 레이저 조사 후, 단결정 실리콘의 결정 품위가 향상되도록 1∼9번의 레이저 조사를 더 수행하는 것을 특징으로 하는 단결정 실리콘 형성방법.
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KR1020030098755A KR100687342B1 (ko) | 2003-12-29 | 2003-12-29 | 단결정 실리콘 형성방법 |
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KR1020030098755A KR100687342B1 (ko) | 2003-12-29 | 2003-12-29 | 단결정 실리콘 형성방법 |
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KR20050067741A KR20050067741A (ko) | 2005-07-05 |
KR100687342B1 true KR100687342B1 (ko) | 2007-02-27 |
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KR102130688B1 (ko) | 2015-11-03 | 2020-07-07 | 삼성디스플레이 주식회사 | 레이저 결정화 방법 |
Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR960042140A (ko) * | 1995-05-31 | 1996-12-21 | 엄길용 | 액정기판의 다결정실리콘층 제조방법 |
KR19980026856A (ko) * | 1996-10-11 | 1998-07-15 | 김광호 | 단결정 실리콘층의 형성방법 |
KR20030060403A (ko) * | 2002-01-09 | 2003-07-16 | 장 진 | 비정질 실리콘의 결정화 방법 |
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- 2003-12-29 KR KR1020030098755A patent/KR100687342B1/ko active IP Right Grant
Patent Citations (3)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR960042140A (ko) * | 1995-05-31 | 1996-12-21 | 엄길용 | 액정기판의 다결정실리콘층 제조방법 |
KR19980026856A (ko) * | 1996-10-11 | 1998-07-15 | 김광호 | 단결정 실리콘층의 형성방법 |
KR20030060403A (ko) * | 2002-01-09 | 2003-07-16 | 장 진 | 비정질 실리콘의 결정화 방법 |
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