KR100662832B1 - Method of manufacturing organic electro luminescence panel, manufacturing apparatus of organic electro luminescence panel, and organic electro luminescence panel - Google Patents

Abstract

The present invention provides a method for producing an organic EL panel which can form a high-definition electroluminescent layer, and is easy to attach and detach a deposition mask and a substrate to be deposited, and a simple configuration for carrying out this manufacturing method. The manufacturing apparatus of organic electroluminescent panel, and the organic electroluminescent panel manufactured with this manufacturing apparatus are provided.

The present invention provides a method for producing an organic electroluminescent panel, in which a part or all of an electroluminescent layer composed of a plurality of layers is formed by vapor deposition using a vapor deposition mask (3). It is arrange | positioned at the predetermined position of a to-be-deposited substrate (glass substrate 4), and a vapor deposition mask 3 and a to-be-deposited board | substrate are contact | adhered by dynamically pressing a vapor-deposited board | substrate.

Electroluminescence, Deposition Mask, Organic EL Panel

Description

The manufacturing method of the organic electroluminescent panel, the manufacturing apparatus of an organic electroluminescent panel, and an organic electroluminescent panel

1 is a conceptual diagram illustrating a method and a manufacturing apparatus for an organic EL panel according to Embodiment 1. FIG.

FIG. 2 is an enlarged conceptual view of portions of the deposition mask, the glass substrate, and the weight of FIG. 1. FIG.

3 is a schematic diagram showing a step until deposition is performed on a glass substrate in Embodiment 1;

4 is a schematic diagram illustrating a process following the process in FIG. 3.

FIG. 5 is a schematic diagram illustrating a process following the process in FIG. 4. FIG.

FIG. 6 is a schematic diagram illustrating a manufacturing apparatus of an organic EL panel according to Embodiment 2 of the present invention. FIG.

FIG. 7 is a schematic diagram illustrating a manufacturing apparatus of an organic EL panel according to Embodiment 3 of the present invention. FIG.

8 is a longitudinal sectional view showing a process for producing an organic EL panel according to a fourth embodiment of the present invention.

※ Explanation of codes for main parts of drawing

1: deposition chamber

2: deposition source

3: deposition mask

3a: opening

4: glass substrate

4a: alkali free glass

5: weight

5a: weight

6: gap

8: glass substrate inlet

9: lifting means

10: wire

11: shutter

13: spring

14: plunger pin

15: guide

17: cancer

18: drive means

20: anode

21: silicon oxide layer

22: hole injection layer

23: hole transport layer

25: periphery

26R: red light emitting layer

26G: green light emitting layer

26B: blue light emitting layer

27: electron transport layer

28: cathode

29: desiccant

30: sealing glass

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a method for producing an organic electroluminescent panel (hereinafter referred to as an organic EL) panel, an apparatus for producing the organic EL panel, and an organic EL panel. In particular, an organic EL layer can be formed with a high definition. The manufacturing method of the organic electroluminescent panel which can be used, the manufacturing apparatus of the organic electroluminescent panel for implementing this manufacturing method, and the organic electroluminescent panel manufactured with this manufacturing apparatus.

In the conventional method of manufacturing a full color organic EL display panel, three vacuum chambers for depositing a deposition material corresponding to each color are prepared when the light emitting layers of red, green, and blue are deposited, and the organic EL display inside the vacuum chamber. A full color organic EL display panel has been manufactured using a metal mask having a larger area and a thinner thickness than the panel.

Moreover, in the manufacturing method of the conventional electroluminescent display apparatus, there existed to form the vapor deposition mask for vapor deposition of a light emitting layer etc. from the single crystal silicon substrate. The vapor deposition mask which consists of this single crystal silicon substrate is formed using semiconductor manufacturing techniques, such as photolithography and dry etching, and is high in processing precision. Moreover, since the vapor deposition mask which consists of a single crystal silicon substrate has almost the same thermal expansion coefficient as the glass substrate which is a vapor deposition board | substrate, vapor deposition positions, such as a light emitting element, do not shift | deviate by thermal expansion at the time of vapor deposition (for example, a patent document 1).

In the conventional method of manufacturing an organic EL display panel, when depositing a light emitting layer or the like, a magnetic mask or a metal mask is used as the deposition mask, and the spacer and the deposition mask are sucked by a substrate holder equipped with a magnet to form the spacer. The vapor deposition mask and the vapor-deposited substrate were joined together (for example, refer patent document 2).

Patent Document 1: Japanese Unexamined Patent Publication No. 200l-185350 (p. 2, Fig. 1)

Patent Document 2: Japanese Unexamined Patent Publication No. 2001-273976 (2 pages, Fig. 4)

In the conventional method of manufacturing a full color organic EL display panel, when manufacturing a full color organic EL display panel having a large panel size, it is necessary to use a large metal mask, but manufacturing a metal mask having a large area and a thin thickness is required. There was a problem that was very difficult.

In addition, the metal mask has a problem that the thermal expansion coefficient is much larger than that of the glass substrate, which is a substrate to be deposited, so that the metal mask expands by radiant heat during deposition and the deposition position of the light emitting layer is shifted. In particular, this problem was serious when manufacturing large panels of 20 inches or larger because the deviation of deposition positions became cumulative.

Moreover, in the manufacturing method of the conventional electroluminescent display apparatus (for example, refer patent document 1), the position of the vapor deposition mask which consists of single crystal silicon, and the glass substrate which is a vapor deposition board | substrate does not shift by thermal expansion. However, since the single crystal silicon is nonmagnetic, there is a problem in that the deposition mask is sucked by a magnet from the back side of the glass substrate, and the deposition mask and the substrate to be deposited cannot be brought into close contact with each other in the method of manufacturing the organic EL display panel of Patent Document 2. . For this reason, there existed a problem that the gap | interval generate | occur | produced between a glass substrate and a vapor deposition mask at the time of vapor deposition, and a vapor deposition material enters between this gap, and the precision of a vapor deposition pattern falls.

Moreover, in the manufacturing method of the conventional organic electroluminescent display panel (for example, refer patent document 2), a magnetic mask and a metal mask are used as a vapor deposition mask, and a spacer and a vapor deposition mask are carried out by a magnet from the back side of the glass substrate which is a vapor deposition substrate. Is aspirating. However, if the vapor deposition mask and the substrate to be deposited are brought into close contact with a strong magnetic force, for example, without providing the spacer as in Patent Document 2, the vapor deposition mask and the substrate to be deposited are stuck and cannot be easily detached. In addition, when the magnetic force is weak, a gap is formed between the deposition mask and the substrate to be deposited, and the deposition particles enter this gap and the precision of the deposition pattern is lowered.

Moreover, even if the spacer like patent document 2 is provided, there exists a possibility that a problem, such as affixing a spacer and a vapor deposition board | substrate, may generate | occur | produce, and there existed a problem that the handling of a spacer and a vapor deposition process became complicated, and cost increased.

The present invention provides a method for producing an organic EL panel which can form a high-definition electroluminescent layer and easily attaches and detaches a deposition mask and a substrate to be deposited, and an organic EL panel having a simple configuration for carrying out this manufacturing method. It is an object to provide a manufacturing apparatus and an organic EL panel manufactured by the manufacturing apparatus.

The manufacturing method of the organic electroluminescent panel which concerns on this invention is a manufacturing method of the organic electroluminescent panel which forms a part or all part of the electroluminescent layer which consists of a some layer by vapor deposition using a vapor deposition mask, and is deposited The deposition mask is disposed at a predetermined position of the substrate to be deposited at the time, and the substrate to be deposited is mechanically pressurized to bring the deposition mask into contact with the substrate to be deposited.

Since the substrate to be deposited is mechanically pressurized to closely adhere the deposition mask and the substrate to be deposited, no gap is generated between the deposition mask and the substrate to be deposited at the time of deposition, and the accuracy of the deposition pattern can be improved.

In addition, since the vapor deposition mask and the vapor deposition substrate are closely adhered to each other by pressurizing the vapor deposition substrate without using magnetic force or electric force, the vapor deposition mask and the vapor deposition substrate can be prevented from being attached and detached.

Moreover, the manufacturing method of the organic electroluminescent panel which concerns on this invention uses one or more weight as said means to pressurize dynamically.

As a means for mechanically pressing, by using one or a plurality of weights, the deposition mask and the substrate to be deposited can be easily brought into close contact with each other, and a high precision electroluminescence layer can be formed by a simple manufacturing apparatus.

In addition, when a plurality of weights smaller in size than the substrate to be deposited are used, even if there is a variation in the flatness of the substrate to be deposited, the deposition mask and the substrate to be deposited can be easily brought into close contact with each other.

Moreover, in the manufacturing method of the organic electroluminescent panel which concerns on this invention, the said mechanically pressurizing means is equipped with one or several elastic bodies, and pressurizes a vapor-deposited board | substrate through this elastic body.

The mechanically pressurizing means includes one or a plurality of elastic bodies and elastically presses the substrate to be deposited via the elastic body, so that the substrate to be deposited can be prevented from being damaged. In addition, even when there is a deviation in the flatness of the substrate to be deposited, the deposition mask and the substrate to be deposited can be closely adhered to each other.

Moreover, in the manufacturing method of the organic electroluminescent panel which concerns on this invention, a plunger pin is affixed to said elastic body, and the plunger pin is made to contact a vapor-deposited board | substrate, and is pressed.

Since the plunger pin is attached to the elastic body, even when there is a deviation in the flatness of the substrate to be deposited, the deposition mask and the substrate to be deposited can be closely adhered to each other.

For example, when the plunger pin which moves only in a specific direction (vertical direction or the like) is brought into contact with the substrate to be deposited and pressed, the predetermined position of the substrate to be deposited can be accurately pressed.

Moreover, in the manufacturing method of the organic electroluminescent panel which concerns on this invention, the said vapor deposition mask consists of single crystal silicon which predetermined process was performed.

As described above, the vapor deposition mask and the vapor deposition substrate are closely contacted with each other by pressurizing the vapor-deposited substrate without using a magnetic force or an electric force, so that a vapor deposition mask made of single crystal silicon rather than a metal or magnetic material can be used. In addition, when the deposition mask is formed by photolithography, dry etching, or the like, a high-definition deposition mask can be manufactured, and a highly precise deposition pattern can be formed.

The manufacturing apparatus of the organic electroluminescent panel which concerns on this invention has a dynamic pressurization means for implementing the manufacturing method of any one of the organic electroluminescent panels mentioned above.

Moreover, since it has a means of pressurizing with a high dynamics which does not use a magnetic force or an electric force, and pressurizes a board | substrate to be deposited by this pressurizing means, and a vapor deposition mask and a to-be-deposited board | substrate adhere | attach, the precision of a deposition pattern can be improved. In addition, the deposition mask and the substrate to be deposited can be prevented from being attached and detached from each other.

In addition to the above-mentioned weights, this mechanically pressurizing means may be the same as those directly attached to the manufacturing apparatus.

The organic electroluminescent panel according to the present invention is manufactured by the apparatus for producing an organic electroluminescent panel described above.

Since this organic electroluminescent panel is manufactured with the manufacturing apparatus provided with the above-mentioned mechanically pressurizing means, it has a vapor deposition pattern of a high-definition electroluminescent layer, and it has few defects and damage.

{Best Mode for Implementing the Invention}

(Embodiment 1)

1 is a conceptual diagram illustrating a method and a manufacturing apparatus for an organic EL panel according to Embodiment 1 of the present invention. 1, the longitudinal cross section of the manufacturing apparatus of organic electroluminescent panel is shown.

In the vapor deposition chamber 1 which is a manufacturing apparatus of an organic EL panel, vacuum deposition is performed, for example, and the inside is sealed. The vapor deposition source 2 is provided in the bottom surface side inside the vapor deposition chamber 1, and the upper side of the vapor deposition source 2 in the inside of the vapor deposition chamber 1, for example, photolithography is carried out in single-crystal silicon, The vapor deposition mask 3 which gave predetermined process by the etching etc. is provided. The deposition mask 3 is formed with an opening 3a having a predetermined shape by etching or the like. The opening 3a may be, for example, one in which a plurality of dot shapes corresponding to individual pixels of the finished product of the organic EL panel are formed, and the pixels in a row arranged vertically or horizontally can be collectively deposited. As long as the opening part 3a of thin shape is provided in multiple numbers, it may be sufficient.

Moreover, the glass substrate 4 which is a vapor deposition board | substrate is arrange | positioned so that the upper surface of the vapor deposition mask 3 may contact. This glass substrate 4 is put in the inside of the deposition chamber 1 before the process of vapor deposition, and is arrange | positioned correctly at the predetermined position of the upper surface of the vapor deposition mask 3 by a positioning means (not shown).

In addition, before putting the glass substrate 4 into the vapor deposition chamber 1, the wiring which consists of ITO etc. in the surface of the lower surface side (side which contacts the deposition mask 3) of the glass substrate 4 is made. In some cases, some electroluminescence layers (described later) are formed in advance.

Moreover, one or more weight 5 is mounted on the upper surface of the glass substrate 4 as a means for dynamically pressing. In addition, although the some weight 5 was shown in FIG. 1, you may make it mount only one flat weight, for example.

The weight 5 pressurizes the glass substrate 4 by gravity without using magnetic force or electric force to bring the deposition mask 3 into close contact with the glass substrate 4 as the substrate to be deposited. In addition, in the present invention, the means for dynamically pressing means that it is means for pressing by a classical mechanical force rather than a magnetic force or an electric force, and the mechanical weight shown in the weight 5 shown in the first embodiment and the third embodiment described later. It means the means etc. which pressurize with.

In this manner, after the deposition mask 3, the glass substrate 4, and the weight 5 are disposed, the deposition material is evaporated from the deposition source 2 to be deposited on the glass substrate 4, and an electroluminescence layer such as a light emitting layer is provided. Form part or all of it.

FIG. 2 is an enlarged conceptual view of portions of the deposition mask 3, the glass substrate 4, and the weight 5 of FIG. 1. 2, the longitudinal section of these parts is shown similarly to FIG. In addition, the weight 5 has shown only one for convenience.

As shown in Fig. 2 (a), the glass substrate 4 that is placed inside the deposition chamber 1 and disposed at a predetermined position on the upper surface of the deposition mask 3 by the positioning means is subjected to surface stress or the like. It is largely bent, and the clearance gap 6 is formed between the vapor deposition mask 3 and the glass substrate 4. When vapor deposition is carried out on the glass substrate 4 in this state, a vapor deposition material enters the gap 6, and a portion which must be blocked by the original deposition mask is deposited, and the accuracy of the deposition pattern is lowered. For this reason, as shown in FIG.2 (b), the glass substrate 4 is pressurized by loading the weight 5 which is a means which presses dynamically on the upper surface of the glass substrate 4, and the vapor deposition mask 3 and glass. The substrate 4 is brought into close contact. As a result, since the gap 6 is almost eliminated, the deposition material can be deposited at a predetermined position, and the accuracy of the deposition pattern can be improved.

Here, when a plurality of weights 5 having a smaller size than the glass substrate 4 are used, the deposition mask 3 and the glass substrate 4 may be separated even if the flatness of the individual glass substrates 4 varies. It may be in close contact (see FIG. 1). In the manufacturing apparatus of the organic electroluminescent panel shown in FIG. 1, when vapor deposition of one glass substrate 4 is complete | finished, it is taken out outside, the next glass substrate 4 is thrown in in the inside of the vapor deposition chamber 1, and vapor deposition is performed. When the glass substrate 4 is sequentially deposited in this manner, there are many cases in which the flatness (bending state) of the individual glass substrates 4 is slightly varied. At this time, as shown in FIG. 1, when the weight 5 which is smaller in size than the glass substrate 4 is mounted on the glass substrate 4, pressurization according to the flatness of each glass substrate 4 will be pressurized. can do. For this reason, even if there exists some deviation in the flatness of the glass substrate 4, vapor deposition can be performed and the manufacturing cost of the glass substrate 4 can be reduced.

3, 4, and 5 are schematic diagrams showing a step from injecting the glass substrate 4 to the deposition chamber 1 in the first embodiment until the deposition is performed. In addition, in FIG. 3, FIG. 4, and FIG. 5, the longitudinal cross section of the manufacturing apparatus of an organic EL panel is shown similarly to FIG. 1, and the concrete structure of the manufacturing apparatus of an organic EL panel is shown from FIG.

First, in the process of FIG. 3, the glass substrate 4 is injected into the upper part of the deposition mask 3 inside the deposition chamber 1 from the glass substrate inlet 8 of the deposition chamber 1. As described above, an anode lamp made of ITO is already formed on the lower surface of the glass substrate 4 at this point in time. At this time, the weight 5 is lifted above the vapor deposition mask 3 and the glass substrate 4 by the elevating means 9, and it is made not to collide with the glass substrate 4. In addition, in the first embodiment, the weight 5 is suspended by the wire 10. 3, the shutter 11 of the vapor deposition source 2 is closed, and the vapor deposition source 2 does not heat a vapor deposition material. In addition, suppose that the above-mentioned positioning means (not shown) is used, in order to introduce the glass substrate 4 into the inside of the vapor deposition chamber 1.

Next, in the process of FIG. 4, the glass substrate 4 is correctly arrange | positioned in the predetermined position of the upper surface of the vapor deposition mask 3 by a positioning means (not shown). At this time, the glass substrate 4 is provided on the upper surface of the deposition mask 3 to be in contact. In addition, at this point in time, the weight 5 is lifted above the vapor deposition mask 3 and the glass substrate 4 by the elevating means 9, and the shutter 11 is also in the closed state.

And in the process of FIG. 5, the weight 5 is mounted on the upper surface of the glass substrate 4 by the lifting means 9. The glass substrate 4 is pressurized by gravity according to this weight 5, and the vapor deposition mask 3 and the glass substrate 4 come into close contact with each other. In addition, the control of the elevating means 9 may be performed by an operator operating an operation panel (not shown) or the like, or may be performed by automatically elevating the weight 5.

After this process of FIG. 5, the glass substrate inlet 8 is sealed by an opening / closing door (not shown), and the shutter 11 is opened. Then, the vapor deposition source 2 is heated to evaporate the vapor deposition material and vapor deposition of electroluminescent layers such as a light emitting layer is performed. In addition, after this vapor deposition is complete, the glass substrate 4 is taken out of the vapor deposition chamber 1.

In the first embodiment, the vapor deposition mask 3 and the glass substrate 4 are brought into close contact by pressing the glass substrate 4 which is the substrate to be deposited by the weight 5, so that the vapor deposition mask 3 and the glass substrate at the time of vapor deposition. The clearance gap 6 does not arise between (4), and the precision of a vapor deposition pattern can be improved.

In addition, since the vapor deposition mask 3 and the glass substrate 4 are brought into close contact with each other by pressurizing the glass substrate 4 in a classically dynamic manner using no magnetic force or electric force, the vapor deposition mask 3 and the glass substrate 4 are attached and detached. You can prevent it from becoming impossible.

(Embodiment 2)

It is a schematic diagram which shows the manufacturing apparatus of the organic electroluminescent panel which concerns on Embodiment 2 of this invention. 6, the vertical cross section of the manufacturing apparatus of organic electroluminescent panel similarly to FIG. 1 of Embodiment 1 is shown. In addition, the manufacturing apparatus of the organic electroluminescent panel which concerns on this Embodiment 2 uses the weight 5a, the spring 13, and the plunger pin 14 as a means to pressurize dynamically. In other respects, the lifting means 9, the wire 10, and the like in FIG. 3 and the like are omitted in the same manner as in the manufacturing apparatus of the organic EL panel of the first embodiment.

In the apparatus for manufacturing an organic EL panel according to the second embodiment, one weight 5a is provided above the deposition mask 3 and the glass substrate 4 inside the deposition chamber 1. The weight 5a is provided with a plurality of springs 13 as elastic bodies, and each of the springs 13 is provided with a plunger pin 14. This plunger pin 14 moves only the up-down direction inside the tubular guide 15 provided in the weight 5a. In addition, the spring 13 and the plunger pin 14 may be one each.

In the second embodiment, after the glass substrate 4 is introduced into the deposition chamber 1 and disposed at a predetermined position on the upper surface of the deposition mask 3 by positioning means (not shown), the wire 10 ) (Weight not shown in FIG. 6) is lowered by the elevating means 9 (not shown in FIG. 6). When the weight 5a falls, the plunger pin 14 contacts the glass substrate 4 and presses the glass substrate 4 via the spring 13. As a result, the deposition mask 3 and the glass substrate 4 come into close contact with each other.

In addition, you may pressurize the glass substrate 4 directly with elastic bodies, such as the spring 13, without providing the plunger pin 14. Moreover, as shown in following Embodiment 3, you may make the glass substrate 4 pressurize by moving the weight 5a up and down with a drive means via a metal rod etc. In addition, a flat weight is used in place of the weight 5a, the spring 13, and the plunger pin 14, and a sponge-like elastic body is provided on the lower surface of the weight to pressurize the glass substrate 4. You may also do so.

In the second embodiment, the weight 5a is provided with one or a plurality of springs 13, and the glass substrate 4 is broken because the glass substrate 4 is elastically pressed through the springs 13. Can be prevented. Moreover, even if there exists a deviation in the flatness of the glass substrate 4, the vapor deposition mask 3 and the glass substrate 4 can be closely adhered.

Moreover, since the plunger pin 14 which moves only in a specific direction is made to contact and pressurizes the glass substrate 4, the predetermined position of the glass substrate 4 can be pressurized correctly.

The other effects are the same as those of the first embodiment.

(Embodiment 3)

It is a schematic diagram which shows the manufacturing apparatus of the organic electroluminescent panel which concerns on Embodiment 3 of this invention. In addition, similarly to FIG. 1 of Embodiment 1, FIG. 7 has shown the longitudinal cross section of the manufacturing apparatus of an organic EL panel. Moreover, the arm 17 and the drive means 18 are used for the manufacturing apparatus of the organic electroluminescent panel which concerns on this Embodiment 3 as a means to dynamically pressurize. About other points, it is the same as that of the manufacturing apparatus of the organic electroluminescent panel of Embodiment 1. FIG.

In the manufacturing apparatus of the organic electroluminescent panel which concerns on this Embodiment 3, the glass substrate 4 is pressed by the arm 17 instead of the weight 5 of Embodiment 1. As shown in FIG. The arm 17 is movable up and down by the drive means 18. For example, the drive means 18 is provided in the upper surface of the inside of the deposition chamber 1, and the arm in the deposition chamber 1 is armed. (17) is in a directly attached state. The glass substrate 4 is pressurized by this arm 17, and the vapor deposition mask 3 and the glass substrate 4 are closely contacted.

In this case, the control of the drive means 18 may move the arm while the operator checks the position of the arm 17 and the like, and a pressure sensor (not shown) or the like is provided to the drive means 18 to provide a predetermined pressure. You may make it control automatically so that it may be caught by this glass substrate 4. As described above, the weight 5a, the spring 13, and the plunger pin 14 as shown in Fig. 6 of the second embodiment may be attached to an arm such as a metal rod to be moved by the driving means. good.

In addition, although the arm 17 and the drive means 18 pressurize the glass substrate 4 by high dynamics, it goes without saying that you may use an electric force etc. as a drive force of the drive means 18 itself.

In the third embodiment, the deposition mask 3 and the glass substrate 4 are adhered to each other by pressing the glass substrate 4, which is the substrate to be deposited, by the arm 17 to closely contact the deposition mask 3 and the glass substrate 4. There is no gap between 4) and the accuracy of the deposition pattern can be improved.

Moreover, since the glass substrate 4 is pressurized by the arm 17 and the drive means 18 which do not use a magnetic force or an electric force, and the vapor deposition mask 3 and the glass substrate 4 adhere to each other, the vapor deposition mask 3 And the glass substrate 4 can be prevented from sticking and detaching.

(Embodiment 4)

8 is a longitudinal sectional view showing a process for manufacturing the organic EL panel according to the fourth embodiment of the present invention.

In addition, in FIG. 8, the pixel etc. are shown typically, and it is assumed that many pixels are formed in an actual organic electroluminescent panel.

This organic EL panel is manufactured by the manufacturing apparatus of the organic EL panel as shown in Embodiment 1, Embodiment 2, and Embodiment 3. As shown in FIG. In FIG. 8, although the drive system is a passive type, it shows the bottom emission type organic electroluminescent panel which emits light to the alkali-free glass 4a side (lower surface of FIG. 8), but a drive system is shown. The manufacturing process is almost the same also in this active type thing and a top emission system, and can be manufactured using the manufacturing apparatus of the same organic electroluminescent panel.

First, an anode 20 made of ITO (Indium Tin Oxide) or the like is formed for each pixel on one surface of the alkali free glass 4a, and the silicon oxide layer 21 is formed on the other portions thereof ( 8 (a)). In addition, when forming this anode 20 and the silicon oxide layer 21 by sputter | spatter, you may sputter | spatter using the manufacturing apparatus of the organic electroluminescent panel shown in Embodiment 1, 2, and 3.

Next, the hole injection layer 22 and the hole transport layer 23 are deposited on the upper surfaces of the anode 20 and the silicon oxide layer 21 (Fig. 8 (b)). In the process of FIG. 8B, the hole injection layer 22 and the hole transport layer 23 are collectively deposited on the upper surface of the anode 20 and the silicon oxide layer 21 except for the peripheral portion 25 instead of for each pixel. . At this time, a dedicated deposition mask (not shown) is used to shield a portion of the peripheral portion 25, and an apparatus for manufacturing an organic EL panel such as Embodiment 1 may be used due to the pressurization of the deposition mask.

In addition, the alkali free glass 4a in which the anode 20, the silicon oxide layer 21, the hole injection layer 22, and the hole transport layer 23 was formed shall be called the glass substrate 4. As shown in FIG. The glass substrate 4 in Embodiment 1, 2, and 3 mentioned above shall also perform the process to FIG. 8 (b).

Then, the red light emitting layer 26R, the green light emitting layer 26G, and the blue light emitting layer 26B are deposited on the upper surface of the glass substrate 4 by using the organic EL panel manufacturing apparatus as shown in Embodiments 1, 2 and 3. It forms by (FIG. 8 (c)). At this time, only the portion corresponding to the light emitting layer of one color is opened in the opening 3a (see FIG. 1) of the deposition mask 3, for example, after the deposition of the red light emitting layer 26R is completed, the deposition mask 3 ), The green light emitting layer 26G is deposited, and the blue light emitting layer 26B is similarly deposited. Moreover, the vapor deposition process of this light emitting layer is generally performed by co-depositing the host material and dope material of organic electroluminescent material.

In particular, when depositing the red light emitting layer 26R, the green light emitting layer 26G, and the blue light emitting layer 26B, the glass substrate 4 is pressed to bring the deposition mask 3 and the glass substrate 4 into close contact with each other. One organic EL panel can be manufactured.

Thereafter, the electron transport layer 27 is collectively formed on the upper surfaces of the hole transport layer 23, the red light emitting layer 26R, the green light emitting layer 26G, and the blue light emitting layer 26B, and a very thin electron injection layer is formed on the top surface thereof. A cathode 28 made of aluminum or the like is formed by sputtering or the like (Fig. 8 (d)). At this time, the electron transport layer 27 or the like is not formed on the peripheral portion 25 with a dedicated deposition mask (not shown) as in the process of FIG. 8B. In the present invention, the electroluminescent layer is a hole injection layer 22, a hole transport layer 23, a red light emitting layer 26R, a green light emitting layer 26G, a blue light emitting layer 26B, an electron transport layer 27, an electron injection Let's say layer. However, it is not necessary to necessarily form all these layers.

Finally, the organic EL panel is completed by bonding the sealing glass 30 with the desiccant 29 to the glass substrate 4 on which the electron transport layer 27 or the like is formed with an adhesive or the like (Fig. 8 (e)).

In the fourth embodiment, only the red light emitting layer 26R, the green light emitting layer 26G, and the blue light emitting layer 26B are deposited using the above-described organic EL panel manufacturing apparatus, but the hole injection layer 22 and the hole transport layer ( 23) may be formed individually for each pixel by using the organic EL panel manufacturing apparatus as shown in Embodiments 1, 2 and 3. FIG. The electron transport layer 27, the electron injection layer, or the like may also be formed separately for each pixel.

Since the organic electroluminescent panel of this Embodiment 4 is manufactured with the manufacturing apparatus provided with the mechanically pressurizing means as shown in Embodiment 1, 2, and 3, it has a high-definition electroluminescent layer vapor deposition pattern, Moreover, there are few defects or damage.

{Industrial Availability}

The manufacturing method and manufacturing apparatus of the organic electroluminescent panel as shown to Embodiment 1, 2, and 3 of this invention are applicable also to manufacture of the color filter of a liquid crystal display by a dye vapor deposition method, manufacture of organic transistors, etc.

The present invention provides a method for producing an organic EL panel which can form a high-definition electroluminescent layer and easily attaches and detaches a deposition mask and a substrate to be deposited, and an organic EL panel having a simple configuration for carrying out this manufacturing method. The manufacturing apparatus of this, and the organic electroluminescent panel manufactured with this manufacturing apparatus can be provided.

Claims (7)

As a manufacturing method of the organic electroluminescent panel which forms one part or all part of the electroluminescent layer which consists of a some layer by vapor deposition using a vapor deposition mask, At the time of deposition, the substrate to be deposited is placed at a predetermined position of the deposition mask, Dynamically pressurizing the substrate to be deposited to bring the deposition mask into close contact with the substrate to be deposited; As the means for dynamically pressing, one or more weights are used, The mechanically pressurizing means comprises one or a plurality of elastic bodies, and pressurizes the substrate to be deposited via the elastic bodies. The manufacturing method of an organic electroluminescent panel characterized by the above-mentioned. delete delete The method of claim 1, A plunger pin is attached to said elastic body, and the said plunger pin is made to contact and pressurizes to a board | substrate to be deposited, The manufacturing method of the organic electroluminescent panel characterized by the above-mentioned. The method of claim 1, A method for producing an organic electroluminescent panel, wherein the deposition mask is made of single crystal silicon subjected to a predetermined processing. It has the said dynamically pressurizing means for implementing the manufacturing method of the organic electroluminescent panel of Claim 1, The manufacturing apparatus of the organic electroluminescent panel characterized by the above-mentioned. It was manufactured with the manufacturing apparatus of the organic electroluminescent panel of Claim 6. The organic electroluminescent panel characterized by the above-mentioned.

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