KR100632170B1 - 노볼락수지용액, 포지티브형 포토레지스트 조성물 및 그제조방법 - Google Patents
노볼락수지용액, 포지티브형 포토레지스트 조성물 및 그제조방법 Download PDFInfo
- Publication number
- KR100632170B1 KR100632170B1 KR1020030024308A KR20030024308A KR100632170B1 KR 100632170 B1 KR100632170 B1 KR 100632170B1 KR 1020030024308 A KR1020030024308 A KR 1020030024308A KR 20030024308 A KR20030024308 A KR 20030024308A KR 100632170 B1 KR100632170 B1 KR 100632170B1
- Authority
- KR
- South Korea
- Prior art keywords
- novolak resin
- resin solution
- solution
- photoresist composition
- bis
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Fee Related
Links
Classifications
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08L—COMPOSITIONS OF MACROMOLECULAR COMPOUNDS
- C08L61/00—Compositions of condensation polymers of aldehydes or ketones; Compositions of derivatives of such polymers
- C08L61/04—Condensation polymers of aldehydes or ketones with phenols only
- C08L61/06—Condensation polymers of aldehydes or ketones with phenols only of aldehydes with phenols
- C08L61/14—Modified phenol-aldehyde condensates
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
-
- G—PHYSICS
- G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
- G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
- G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
- G03F7/004—Photosensitive materials
- G03F7/022—Quinonediazides
- G03F7/023—Macromolecular quinonediazides; Macromolecular additives, e.g. binders
- G03F7/0233—Macromolecular quinonediazides; Macromolecular additives, e.g. binders characterised by the polymeric binders or the macromolecular additives other than the macromolecular quinonediazides
- G03F7/0236—Condensation products of carbonyl compounds and phenolic compounds, e.g. novolak resins
Landscapes
- Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- General Physics & Mathematics (AREA)
- Chemical & Material Sciences (AREA)
- Health & Medical Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Medicinal Chemistry (AREA)
- Polymers & Plastics (AREA)
- Organic Chemistry (AREA)
- Materials For Photolithography (AREA)
- Compositions Of Macromolecular Compounds (AREA)
- Phenolic Resins Or Amino Resins (AREA)
Applications Claiming Priority (4)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2002119501 | 2002-04-22 | ||
| JPJP-P-2002-00119501 | 2002-04-22 | ||
| JP2002141597 | 2002-05-16 | ||
| JPJP-P-2002-00141597 | 2002-05-16 |
Related Child Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020060018065A Division KR100626583B1 (ko) | 2002-04-22 | 2006-02-24 | 노볼락수지용액, 포지티브형 포토레지스트 조성물 및 그제조방법 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20040002494A KR20040002494A (ko) | 2004-01-07 |
| KR100632170B1 true KR100632170B1 (ko) | 2006-10-11 |
Family
ID=29272314
Family Applications (2)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020030024308A Expired - Fee Related KR100632170B1 (ko) | 2002-04-22 | 2003-04-17 | 노볼락수지용액, 포지티브형 포토레지스트 조성물 및 그제조방법 |
| KR1020060018065A Expired - Fee Related KR100626583B1 (ko) | 2002-04-22 | 2006-02-24 | 노볼락수지용액, 포지티브형 포토레지스트 조성물 및 그제조방법 |
Family Applications After (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1020060018065A Expired - Fee Related KR100626583B1 (ko) | 2002-04-22 | 2006-02-24 | 노볼락수지용액, 포지티브형 포토레지스트 조성물 및 그제조방법 |
Country Status (4)
| Country | Link |
|---|---|
| US (1) | US7060410B2 (enExample) |
| KR (2) | KR100632170B1 (enExample) |
| CN (1) | CN1243283C (enExample) |
| TW (1) | TW200306324A (enExample) |
Families Citing this family (12)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP1665394A4 (en) * | 2003-09-09 | 2006-12-13 | Csg Solar Ag | SETTING MASKS BY FLOW |
| WO2005024920A1 (en) * | 2003-09-09 | 2005-03-17 | Csg Solar, Ag | Improved method of forming openings in an organic resin material |
| CN100546006C (zh) * | 2003-09-09 | 2009-09-30 | Csg索拉尔有限公司 | 蚀刻硅的改进方法 |
| JP4476675B2 (ja) * | 2004-04-09 | 2010-06-09 | 東京応化工業株式会社 | 化学増幅型ポジ型ホトレジスト組成物 |
| JP2006010779A (ja) * | 2004-06-22 | 2006-01-12 | Nagase Chemtex Corp | 有機膜組成物及びレジストパターン形成方法 |
| US7582407B2 (en) * | 2007-07-09 | 2009-09-01 | Eastman Kodak Company | Imageable elements with low pH developer solubility |
| US8236476B2 (en) * | 2008-01-08 | 2012-08-07 | International Business Machines Corporation | Multiple exposure photolithography methods and photoresist compositions |
| JP5876976B2 (ja) * | 2009-01-09 | 2016-03-02 | アイカSdkフェノール株式会社 | ノボラック樹脂および熱硬化性樹脂組成物 |
| US8906590B2 (en) * | 2011-03-30 | 2014-12-09 | Az Electronic Materials Usa Corp. | Antireflective coating composition and process thereof |
| US8906592B2 (en) | 2012-08-01 | 2014-12-09 | Az Electronic Materials (Luxembourg) S.A.R.L. | Antireflective coating composition and process thereof |
| US9152051B2 (en) | 2013-06-13 | 2015-10-06 | Az Electronics Materials (Luxembourg) S.A.R.L. | Antireflective coating composition and process thereof |
| CN104391428B (zh) * | 2014-11-20 | 2018-06-19 | 京东方科技集团股份有限公司 | 含重氮基团的感光剂、光刻胶组合物与其制备方法 |
Family Cites Families (11)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US3868254A (en) * | 1972-11-29 | 1975-02-25 | Gaf Corp | Positive working quinone diazide lithographic plate compositions and articles having non-ionic surfactants |
| US4107229A (en) * | 1976-06-07 | 1978-08-15 | Hooker Chemicals & Plastics Corporation | Polyurethane acrylates of hydroxyalkylated novolac resin |
| US4855333A (en) | 1982-06-28 | 1989-08-08 | International Business Machines Corp. | Multiple wire photosensitive adhesive for wire embedment |
| US4814365A (en) * | 1987-06-24 | 1989-03-21 | Showa High Polymer Co., Ltd. | Curable resin composition |
| JPH07248619A (ja) | 1994-03-14 | 1995-09-26 | Toppan Printing Co Ltd | ポジ型フォトレジスト組成物 |
| JPH10232489A (ja) | 1997-02-19 | 1998-09-02 | Sumitomo Chem Co Ltd | ポジ型フォトレジスト組成物 |
| US5880175A (en) | 1997-03-04 | 1999-03-09 | Ashland Inc. | Amine cured foundry binder system and their uses |
| TW452584B (en) * | 1997-10-03 | 2001-09-01 | Hitachi Chemical Co Ltd | Epoxy resin composition and semiconductor devices using it as encapsulant |
| US6103443A (en) * | 1997-11-21 | 2000-08-15 | Clariant Finance Lmited | Photoresist composition containing a novel polymer |
| ZA995240B (en) * | 1998-09-02 | 2000-02-21 | Ashland Inc | Amine cured foundry binder systems and their uses. |
| JP4216494B2 (ja) * | 2001-09-21 | 2009-01-28 | 富士フイルム株式会社 | 平版印刷版原版 |
-
2003
- 2003-04-15 US US10/414,257 patent/US7060410B2/en not_active Expired - Fee Related
- 2003-04-15 TW TW092108684A patent/TW200306324A/zh not_active IP Right Cessation
- 2003-04-17 KR KR1020030024308A patent/KR100632170B1/ko not_active Expired - Fee Related
- 2003-04-17 CN CNB031231454A patent/CN1243283C/zh not_active Expired - Fee Related
-
2006
- 2006-02-24 KR KR1020060018065A patent/KR100626583B1/ko not_active Expired - Fee Related
Also Published As
| Publication number | Publication date |
|---|---|
| KR20040002494A (ko) | 2004-01-07 |
| KR100626583B1 (ko) | 2006-09-25 |
| TWI304822B (enExample) | 2009-01-01 |
| US20040081909A1 (en) | 2004-04-29 |
| KR20060022312A (ko) | 2006-03-09 |
| US7060410B2 (en) | 2006-06-13 |
| CN1453639A (zh) | 2003-11-05 |
| CN1243283C (zh) | 2006-02-22 |
| TW200306324A (en) | 2003-11-16 |
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