KR100627236B1 - 컴퓨터 부품용 냉각장치 - Google Patents

컴퓨터 부품용 냉각장치 Download PDF

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Publication number
KR100627236B1
KR100627236B1 KR1020050045737A KR20050045737A KR100627236B1 KR 100627236 B1 KR100627236 B1 KR 100627236B1 KR 1020050045737 A KR1020050045737 A KR 1020050045737A KR 20050045737 A KR20050045737 A KR 20050045737A KR 100627236 B1 KR100627236 B1 KR 100627236B1
Authority
KR
South Korea
Prior art keywords
heat
transfer block
heat transfer
elastic member
heat generating
Prior art date
Application number
KR1020050045737A
Other languages
English (en)
Korean (ko)
Inventor
이상철
윤선규
정상준
이상규
Original Assignee
잘만테크 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Family has litigation
First worldwide family litigation filed litigation Critical https://patents.darts-ip.com/?family=37077626&utm_source=google_patent&utm_medium=platform_link&utm_campaign=public_patent_search&patent=KR100627236(B1) "Global patent litigation dataset” by Darts-ip is licensed under a Creative Commons Attribution 4.0 International License.
Application filed by 잘만테크 주식회사 filed Critical 잘만테크 주식회사
Priority to PCT/KR2006/001611 priority Critical patent/WO2006129919A1/en
Priority to TW95116503A priority patent/TWI309762B/zh
Priority to CNB2006100899836A priority patent/CN100383703C/zh
Application granted granted Critical
Publication of KR100627236B1 publication Critical patent/KR100627236B1/ko

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Classifications

    • G—PHYSICS
    • G06—COMPUTING; CALCULATING OR COUNTING
    • G06F—ELECTRIC DIGITAL DATA PROCESSING
    • G06F1/00—Details not covered by groups G06F3/00 - G06F13/00 and G06F21/00
    • G06F1/16—Constructional details or arrangements
    • G06F1/20—Cooling means
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0233—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes the conduits having a particular shape, e.g. non-circular cross-section, annular
    • F—MECHANICAL ENGINEERING; LIGHTING; HEATING; WEAPONS; BLASTING
    • F28—HEAT EXCHANGE IN GENERAL
    • F28D—HEAT-EXCHANGE APPARATUS, NOT PROVIDED FOR IN ANOTHER SUBCLASS, IN WHICH THE HEAT-EXCHANGE MEDIA DO NOT COME INTO DIRECT CONTACT
    • F28D15/00—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies
    • F28D15/02—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes
    • F28D15/0266—Heat-exchange apparatus with the intermediate heat-transfer medium in closed tubes passing into or through the conduit walls ; Heat-exchange apparatus employing intermediate heat-transfer medium or bodies in which the medium condenses and evaporates, e.g. heat pipes with separate evaporating and condensing chambers connected by at least one conduit; Loop-type heat pipes; with multiple or common evaporating or condensing chambers

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • General Engineering & Computer Science (AREA)
  • Life Sciences & Earth Sciences (AREA)
  • Sustainable Development (AREA)
  • Thermal Sciences (AREA)
  • Mechanical Engineering (AREA)
  • Theoretical Computer Science (AREA)
  • Human Computer Interaction (AREA)
  • General Physics & Mathematics (AREA)
  • Cooling Or The Like Of Electrical Apparatus (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
KR1020050045737A 2005-04-11 2005-05-30 컴퓨터 부품용 냉각장치 KR100627236B1 (ko)

Priority Applications (3)

Application Number Priority Date Filing Date Title
PCT/KR2006/001611 WO2006129919A1 (en) 2005-05-30 2006-04-28 Cooling apparatus for computer parts
TW95116503A TWI309762B (en) 2005-05-30 2006-05-10 Cooling apparatus for computer parts
CNB2006100899836A CN100383703C (zh) 2005-05-30 2006-05-30 用于计算机部件的冷却装置

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
KR1020050030118 2005-04-11
KR20050030118 2005-04-11

Publications (1)

Publication Number Publication Date
KR100627236B1 true KR100627236B1 (ko) 2006-09-25

Family

ID=37077626

Family Applications (2)

Application Number Title Priority Date Filing Date
KR20050045736A KR100600448B1 (ko) 2005-04-11 2005-05-30 컴퓨터 부품용 냉각장치 및 그 제조방법
KR1020050045737A KR100627236B1 (ko) 2005-04-11 2005-05-30 컴퓨터 부품용 냉각장치

Family Applications Before (1)

Application Number Title Priority Date Filing Date
KR20050045736A KR100600448B1 (ko) 2005-04-11 2005-05-30 컴퓨터 부품용 냉각장치 및 그 제조방법

Country Status (5)

Country Link
JP (1) JP2008535278A (zh)
KR (2) KR100600448B1 (zh)
CN (1) CN100576143C (zh)
RU (1) RU2348963C1 (zh)
TW (1) TWI323839B (zh)

Families Citing this family (18)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100907953B1 (ko) * 2007-07-02 2009-07-16 (주)네오파워텍 발전기용 오메가 냉각기 및 그 제조방법
TWI407895B (zh) * 2008-09-05 2013-09-01 Foxconn Tech Co Ltd 散熱裝置
KR101024066B1 (ko) * 2008-11-21 2011-03-22 (주)삼정전기 발광다이오드 램프
CN102045988A (zh) * 2009-10-12 2011-05-04 富准精密工业(深圳)有限公司 散热装置
US8829771B2 (en) 2009-11-09 2014-09-09 Lg Innotek Co., Ltd. Lighting device
KR101003976B1 (ko) * 2010-04-28 2010-12-31 (주) 파루 조명장치의 방열 시스템
KR101021944B1 (ko) * 2010-08-13 2011-03-16 (주) 이노밴 조명기구용 방열판
KR102037682B1 (ko) * 2012-10-31 2019-10-29 웅진코웨이 주식회사 냉각장치 및 수처리 기기의 냉수 저장 장치
KR101422098B1 (ko) * 2012-12-12 2014-07-28 잘만테크 주식회사 수냉 장치
JP5950857B2 (ja) * 2013-03-26 2016-07-13 豊田鉄工株式会社 自動車用電子回路の冷却装置
CN104780738A (zh) * 2014-01-15 2015-07-15 奇鋐科技股份有限公司 热管结构及散热模块
JP6454915B2 (ja) * 2015-03-13 2019-01-23 健治 大沢 放冷用熱伝達器
WO2016186481A1 (ko) * 2015-05-21 2016-11-24 주식회사 브라이트론 회전팬 블레이드부의 표면냉각효과를 이용한 냉각팬
KR101595212B1 (ko) 2015-12-28 2016-02-18 박상웅 냉각장치
JP6688936B2 (ja) 2018-01-31 2020-04-28 古河電気工業株式会社 ヒートシンク
EP3595105B1 (en) * 2018-07-13 2024-01-24 ABB Schweiz AG A heat sink for a high voltage switchgear
CN109973959A (zh) * 2019-04-12 2019-07-05 刘松铭 一种涡轮式散热片及其制造工艺
EP4015967A1 (de) * 2020-12-17 2022-06-22 Siemens Aktiengesellschaft Heatpipekühlkörper für einen pulsierenden betrieb und herstellverfahren für einen derartigen heatpipekühlkörper

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2003075085A (ja) * 2001-08-30 2003-03-12 Hitachi Densen Kiki Kk ヒートパイプ
JP2005051127A (ja) * 2003-07-30 2005-02-24 Toshiba Home Technology Corp 冷却モジュールおよび放熱体の積層構造

Also Published As

Publication number Publication date
TWI323839B (en) 2010-04-21
TW200636435A (en) 2006-10-16
JP2008535278A (ja) 2008-08-28
KR20060028374A (ko) 2006-03-29
CN1848038A (zh) 2006-10-18
KR100600448B1 (ko) 2006-07-13
CN100576143C (zh) 2009-12-30
RU2348963C1 (ru) 2009-03-10

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