KR100622258B1 - 탄성표면파 장치 - Google Patents
탄성표면파 장치 Download PDFInfo
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- KR100622258B1 KR100622258B1 KR1020050116128A KR20050116128A KR100622258B1 KR 100622258 B1 KR100622258 B1 KR 100622258B1 KR 1020050116128 A KR1020050116128 A KR 1020050116128A KR 20050116128 A KR20050116128 A KR 20050116128A KR 100622258 B1 KR100622258 B1 KR 100622258B1
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/25—Constructional features of resonators using surface acoustic waves
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/0023—Balance-unbalance or balance-balance networks
- H03H9/0028—Balance-unbalance or balance-balance networks using surface acoustic wave devices
- H03H9/0033—Balance-unbalance or balance-balance networks using surface acoustic wave devices having one acoustic track only
- H03H9/0038—Balance-unbalance or balance-balance networks using surface acoustic wave devices having one acoustic track only the balanced terminals being on the same side of the track
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
- H01L24/93—Batch processes
- H01L24/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L24/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/0023—Balance-unbalance or balance-balance networks
- H03H9/0028—Balance-unbalance or balance-balance networks using surface acoustic wave devices
- H03H9/0047—Balance-unbalance or balance-balance networks using surface acoustic wave devices having two acoustic tracks
- H03H9/0052—Balance-unbalance or balance-balance networks using surface acoustic wave devices having two acoustic tracks being electrically cascaded
- H03H9/0057—Balance-unbalance or balance-balance networks using surface acoustic wave devices having two acoustic tracks being electrically cascaded the balanced terminals being on the same side of the tracks
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/02535—Details of surface acoustic wave devices
- H03H9/02637—Details concerning reflective or coupling arrays
- H03H9/02685—Grating lines having particular arrangements
- H03H9/0274—Intra-transducers grating lines
- H03H9/02748—Dog-legged reflectors
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/058—Holders; Supports for surface acoustic wave devices
- H03H9/059—Holders; Supports for surface acoustic wave devices consisting of mounting pads or bumps
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1071—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a frame built on a substrate and a cap, the frame having no mechanical contact with the SAW device
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1078—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a foil covering the non-active sides of the SAW device
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/05—Holders; Supports
- H03H9/10—Mounting in enclosures
- H03H9/1064—Mounting in enclosures for surface acoustic wave [SAW] devices
- H03H9/1085—Mounting in enclosures for surface acoustic wave [SAW] devices the enclosure being defined by a non-uniform sealing mass covering the non-active sides of the BAW device
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14544—Transducers of particular shape or position
- H03H9/14576—Transducers whereby only the last fingers have different characteristics with respect to the other fingers, e.g. different shape, thickness or material, split finger
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14544—Transducers of particular shape or position
- H03H9/14576—Transducers whereby only the last fingers have different characteristics with respect to the other fingers, e.g. different shape, thickness or material, split finger
- H03H9/14582—Transducers whereby only the last fingers have different characteristics with respect to the other fingers, e.g. different shape, thickness or material, split finger the last fingers having a different pitch
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14544—Transducers of particular shape or position
- H03H9/14588—Horizontally-split transducers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/10—Bump connectors; Manufacturing methods related thereto
- H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
- H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
- H01L2224/161—Disposition
- H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/93—Batch processes
- H01L2224/95—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips
- H01L2224/97—Batch processes at chip-level, i.e. with connecting carried out on a plurality of singulated devices, i.e. on diced chips the devices being connected to a common substrate, e.g. interposer, said common substrate being separable into individual assemblies after connecting
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/161—Cap
- H01L2924/1615—Shape
- H01L2924/16195—Flat cap [not enclosing an internal cavity]
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/181—Encapsulation
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14517—Means for weighting
- H03H9/14529—Distributed tap
- H03H9/14532—Series weighting; Transverse weighting
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14544—Transducers of particular shape or position
- H03H9/14547—Fan shaped; Tilted; Shifted; Slanted; Tapered; Arched; Stepped finger transducers
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- H—ELECTRICITY
- H03—ELECTRONIC CIRCUITRY
- H03H—IMPEDANCE NETWORKS, e.g. RESONANT CIRCUITS; RESONATORS
- H03H9/00—Networks comprising electromechanical or electro-acoustic devices; Electromechanical resonators
- H03H9/02—Details
- H03H9/125—Driving means, e.g. electrodes, coils
- H03H9/145—Driving means, e.g. electrodes, coils for networks using surface acoustic waves
- H03H9/14597—Matching SAW transducers to external electrical circuits
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- Physics & Mathematics (AREA)
- Acoustics & Sound (AREA)
- Engineering & Computer Science (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Surface Acoustic Wave Elements And Circuit Networks Thereof (AREA)
Abstract
Description
Claims (7)
- 압전 기판과,상기 압전 기판 위에 있어서, 탄성표면파의 전파 방향을 따라 배치된 5개의 빗형 전극부를 갖는 평형-불평형 변환 기능을 갖는 세로결합 공진자형의 탄성표면파 필터를 구비한 탄성표면파 필터 장치에 있어서,5개의 빗형 전극부 중에서, 중앙에 위치하는 빗형 전극부의 한쪽의 빗형 전극이 탄성표면파 전파 방향으로 분할함으로써 형성된 제1, 제2 분할 전극부를 가지며, 상기 제1, 제2 분할 전극부가 각각 중앙에 위치하는 상기 빗형 전극부의 양측에 위치하고 있는 2개의 빗형 전극부의 양측에 더 위치하고 있는 2개의 빗형 전극부와 공통접속되며, 또한 제1, 제2 평형 신호 단자에 접속되어 있고, 중앙에 위치하는 상기 빗형 전극부의 양측에 위치하고 있는 2개의 빗형 전극부 중에서 한쪽의 빗형 전극부가 다른쪽의 빗형 전극부에 대하여 반전되어 있으며, 또한 상기 중앙의 빗형 전극부의 양측의 2개의 빗형 전극부가 불평형 신호 단자에 접속되어 있고,상기 5개의 빗형 전극부에 있어서, 갭을 사이에 두고 표면파 전파 방향에 있어서 서로 이웃하는 한쪽의 빗형 전극부의 상기 갭측 단부 및 다른쪽의 빗형 전극부의 상기 갭측 단부에 각각 협피치 전극지부(電極指部)가 형성되어 있는 것을 특징으로 하는 탄성표면파 장치.
- 제1항에 있어서, 상기 협피치 전극지부가, 협피치 전극지부가 형성되어 있는 빗형 전극부의 협피치 전극지부 이외의 부분의 전극지 피치에 비하여, 전극지 피치가 상대적으로 좁게 되어 있는 전극지부인 탄성표면파 장치.
- 제1항에 있어서, 상기 탄성표면파 필터가, 플립 칩 본딩되어 있는 패키지를 더 구비하는 탄성표면파 장치.
- 제1항 또는 제2항에 있어서, 상기 중앙에 위치하는 빗형 전극부의 최외측 전극지가 부유 전극 또는 접지된 전극이고, 상기 중앙에 위치하는 빗형 전극부에 인접하는 2개의 빗형 전극부 중에서, 상기 중앙에 위치하는 빗형 전극부에 인접하는 최외측 전극지가 접지되어 있는 빗형 전극부에 가까운 측에 위치하는 평형 신호 단자 쪽이 상대적으로 기생 용량이 커지도록, 인출 배선이 비대칭적으로 형성되어 있는 것을 특징으로 하는 탄성표면파 장치.
- 제1항 또는 제2항에 있어서, 상기 중앙에 위치하는 빗형 전극부의 최외측 전극지가 시그널 전극이고,상기 중앙에 위치하는 빗형 전극부에 인접하는 2개의 빗형 전극부 중에서, 상기 중앙에 위치하는 빗형 전극부에 인접하는 최외측 전극지가 시그널 전극인 빗형 전극부에 가까운 측에 위치하는 평형 신호 단자 쪽이 상대적으로 기생 용량이 커지도록, 인출 배선이 비대칭적으로 형성되어 있는 것을 특징으로 하는 탄성표면파 장치.
- 제1항 또는 제2항에 있어서, 상기 중앙에 위치하는 빗형 전극부의 최외측 전 극지가 부유 전극 또는 접지된 전극이고,상기 중앙에 위치하는 빗형 전극부에 인접하는 2개의 빗형 전극 중에서, 상기 중앙에 위치하는 빗형 전극부에 인접하는 최외측 전극지가 접지되어 있는 빗형 전극부에 가까운 측에 위치하는 평형 신호 단자에 리액턴스 성분 또는 지연선이 부가되어 있는 탄성표면파 장치.
- 제1항 또는 제2항에 있어서, 상기 중앙에 위치하는 빗형 전극부의 최외측 전극지가 시그널 전극이고,상기 중앙에 위치하는 빗형 전극부에 인접하는 2개의 빗형 전극 중에서, 상기 중앙에 위치하는 빗형 전극부에 인접하는 최외측 전극지가 시그널 전극인 빗형 전극부에 가까운 측에 위치하는 평형 신호 단자에 리액턴스 성분 또는 지연선이 부가되어 있는 탄성표면파 장치.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2002-00251950 | 2002-08-29 | ||
JP2002251950A JP3931767B2 (ja) | 2002-08-29 | 2002-08-29 | 弾性表面波装置、通信装置 |
Related Parent Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020030060254A Division KR100583669B1 (ko) | 2002-08-29 | 2003-08-29 | 탄성표면파 장치 및 통신 장치 |
Publications (2)
Publication Number | Publication Date |
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KR20060001878A KR20060001878A (ko) | 2006-01-06 |
KR100622258B1 true KR100622258B1 (ko) | 2006-09-19 |
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ID=31492623
Family Applications (3)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020030060254A KR100583669B1 (ko) | 2002-08-29 | 2003-08-29 | 탄성표면파 장치 및 통신 장치 |
KR1020050116128A KR100622258B1 (ko) | 2002-08-29 | 2005-12-01 | 탄성표면파 장치 |
KR1020050116129A KR100560074B1 (ko) | 2002-08-29 | 2005-12-01 | 탄성표면파 장치 및 통신 장치 |
Family Applications Before (1)
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KR1020030060254A KR100583669B1 (ko) | 2002-08-29 | 2003-08-29 | 탄성표면파 장치 및 통신 장치 |
Family Applications After (1)
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KR1020050116129A KR100560074B1 (ko) | 2002-08-29 | 2005-12-01 | 탄성표면파 장치 및 통신 장치 |
Country Status (5)
Country | Link |
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US (1) | US6985048B2 (ko) |
EP (1) | EP1394941A3 (ko) |
JP (1) | JP3931767B2 (ko) |
KR (3) | KR100583669B1 (ko) |
CN (2) | CN1855709A (ko) |
Families Citing this family (40)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JP3729081B2 (ja) * | 2000-06-27 | 2005-12-21 | 株式会社村田製作所 | 弾性表面波装置 |
JP2003060484A (ja) * | 2001-08-14 | 2003-02-28 | Murata Mfg Co Ltd | 弾性表面波装置 |
DE602004021276D1 (de) | 2003-09-25 | 2009-07-09 | Murata Manufacturing Co | Akustischer wellenfilter und kommunikationseinheit |
DE102004020183B4 (de) * | 2004-04-22 | 2015-12-03 | Epcos Ag | Oberflächenwellen-Resonatorfilter mit longitudinal gekoppelten Wandlern |
DE102004031397A1 (de) * | 2004-06-29 | 2006-01-26 | Epcos Ag | Duplexer |
WO2006003787A1 (ja) * | 2004-06-30 | 2006-01-12 | Murata Manufacturing Co., Ltd. | バランス型弾性波フィルタ及び弾性波フィルタ装置 |
KR100755184B1 (ko) | 2004-07-23 | 2007-09-03 | 가부시키가이샤 무라타 세이사쿠쇼 | 탄성 표면파 장치 |
DE102004037821B4 (de) * | 2004-08-04 | 2014-02-13 | Epcos Ag | Filter mit verbessertem symmetrischen Ausgang |
US7479853B2 (en) | 2004-09-02 | 2009-01-20 | Murata Manufacturing Co., Ltd. | Balanced type surface acoustic wave filter |
WO2006043445A1 (ja) | 2004-10-22 | 2006-04-27 | Murata Manufacturing Co., Ltd. | バランス型弾性表面波フィルタ |
ATE403270T1 (de) | 2004-11-04 | 2008-08-15 | Murata Mfg Co Ltd Patent Secti | Symmetrie-saw-filter |
CN100512000C (zh) | 2004-11-04 | 2009-07-08 | 株式会社村田制作所 | 平衡型saw滤波器 |
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EP1263137B1 (en) * | 2001-05-31 | 2017-07-26 | Skyworks Filter Solutions Japan Co., Ltd. | Surface acoustic wave filter, balanced type filter and communication device |
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JP3922163B2 (ja) * | 2001-12-25 | 2007-05-30 | 株式会社村田製作所 | 弾性表面波装置 |
EP1345323B1 (en) * | 2002-03-15 | 2005-02-09 | Matsushita Electric Industrial Co., Ltd. | Balanced high-frequency device and balance-characteristics improving method and balanced high-frequency circuit using the same |
-
2002
- 2002-08-29 JP JP2002251950A patent/JP3931767B2/ja not_active Expired - Lifetime
-
2003
- 2003-08-29 US US10/652,950 patent/US6985048B2/en not_active Expired - Lifetime
- 2003-08-29 CN CNA2006100844477A patent/CN1855709A/zh active Pending
- 2003-08-29 CN CNB031557171A patent/CN1263337C/zh not_active Expired - Lifetime
- 2003-08-29 EP EP03292135A patent/EP1394941A3/en not_active Withdrawn
- 2003-08-29 KR KR1020030060254A patent/KR100583669B1/ko active IP Right Grant
-
2005
- 2005-12-01 KR KR1020050116128A patent/KR100622258B1/ko active IP Right Grant
- 2005-12-01 KR KR1020050116129A patent/KR100560074B1/ko active IP Right Grant
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EP1394941A3 (en) | 2010-02-10 |
KR20040020796A (ko) | 2004-03-09 |
CN1263337C (zh) | 2006-07-05 |
JP2004096244A (ja) | 2004-03-25 |
US6985048B2 (en) | 2006-01-10 |
JP3931767B2 (ja) | 2007-06-20 |
KR20060001879A (ko) | 2006-01-06 |
KR100583669B1 (ko) | 2006-05-26 |
US20040080385A1 (en) | 2004-04-29 |
CN1496174A (zh) | 2004-05-12 |
KR100560074B1 (ko) | 2006-03-13 |
EP1394941A2 (en) | 2004-03-03 |
KR20060001878A (ko) | 2006-01-06 |
CN1855709A (zh) | 2006-11-01 |
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