KR100612814B1 - 유기 el 패널 - Google Patents
유기 el 패널 Download PDFInfo
- Publication number
- KR100612814B1 KR100612814B1 KR1020030034280A KR20030034280A KR100612814B1 KR 100612814 B1 KR100612814 B1 KR 100612814B1 KR 1020030034280 A KR1020030034280 A KR 1020030034280A KR 20030034280 A KR20030034280 A KR 20030034280A KR 100612814 B1 KR100612814 B1 KR 100612814B1
- Authority
- KR
- South Korea
- Prior art keywords
- organic
- panel
- sealing
- thin film
- sealing material
- Prior art date
Links
- 238000005401 electroluminescence Methods 0.000 title description 3
- 239000003566 sealing material Substances 0.000 claims abstract description 22
- 229910052581 Si3N4 Inorganic materials 0.000 claims abstract description 16
- HQVNEWCFYHHQES-UHFFFAOYSA-N silicon nitride Chemical compound N12[Si]34N5[Si]62N3[Si]51N64 HQVNEWCFYHHQES-UHFFFAOYSA-N 0.000 claims abstract description 16
- 230000002093 peripheral effect Effects 0.000 claims abstract description 7
- 239000010408 film Substances 0.000 claims description 60
- 239000010409 thin film Substances 0.000 claims description 26
- 239000000758 substrate Substances 0.000 claims description 22
- 238000007789 sealing Methods 0.000 claims description 13
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims description 12
- 229910052814 silicon oxide Inorganic materials 0.000 claims description 12
- 239000011159 matrix material Substances 0.000 claims description 7
- 239000011241 protective layer Substances 0.000 claims description 5
- 230000000903 blocking effect Effects 0.000 abstract description 20
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 abstract description 8
- 229910004205 SiNX Inorganic materials 0.000 abstract description 7
- 239000005394 sealing glass Substances 0.000 abstract description 5
- BOTDANWDWHJENH-UHFFFAOYSA-N Tetraethyl orthosilicate Chemical compound CCO[Si](OCC)(OCC)OCC BOTDANWDWHJENH-UHFFFAOYSA-N 0.000 abstract description 2
- 230000035515 penetration Effects 0.000 abstract description 2
- 239000010410 layer Substances 0.000 description 32
- 239000011521 glass Substances 0.000 description 9
- 239000011229 interlayer Substances 0.000 description 6
- 239000011368 organic material Substances 0.000 description 6
- 230000005525 hole transport Effects 0.000 description 5
- 229910004298 SiO 2 Inorganic materials 0.000 description 3
- 239000000463 material Substances 0.000 description 3
- 239000004065 semiconductor Substances 0.000 description 3
- 239000004925 Acrylic resin Substances 0.000 description 2
- 229920000178 Acrylic resin Polymers 0.000 description 2
- 230000002411 adverse Effects 0.000 description 2
- 229910052782 aluminium Inorganic materials 0.000 description 2
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 2
- 239000003990 capacitor Substances 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000009545 invasion Effects 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 230000007847 structural defect Effects 0.000 description 2
- 238000009825 accumulation Methods 0.000 description 1
- 239000002274 desiccant Substances 0.000 description 1
- 238000001035 drying Methods 0.000 description 1
- 239000003822 epoxy resin Substances 0.000 description 1
- 239000012535 impurity Substances 0.000 description 1
- 238000009413 insulation Methods 0.000 description 1
- 239000004973 liquid crystal related substance Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 239000012044 organic layer Substances 0.000 description 1
- 229910021420 polycrystalline silicon Inorganic materials 0.000 description 1
- 229920000647 polyepoxide Polymers 0.000 description 1
- 229920005591 polysilicon Polymers 0.000 description 1
- 239000011347 resin Substances 0.000 description 1
- 229920005989 resin Polymers 0.000 description 1
Images
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/10—OLED displays
- H10K59/12—Active-matrix OLED [AMOLED] displays
- H10K59/124—Insulating layers formed between TFT elements and OLED elements
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B33/00—Electroluminescent light sources
- H05B33/02—Details
- H05B33/04—Sealing arrangements, e.g. against humidity
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K50/00—Organic light-emitting devices
- H10K50/80—Constructional details
- H10K50/84—Passivation; Containers; Encapsulations
- H10K50/841—Self-supporting sealing arrangements
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10K—ORGANIC ELECTRIC SOLID-STATE DEVICES
- H10K59/00—Integrated devices, or assemblies of multiple devices, comprising at least one organic light-emitting element covered by group H10K50/00
- H10K59/80—Constructional details
- H10K59/87—Passivation; Containers; Encapsulations
- H10K59/871—Self-supporting sealing arrangements
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Physics & Mathematics (AREA)
- Optics & Photonics (AREA)
- Electroluminescent Light Sources (AREA)
Abstract
Description
Claims (3)
- 매트릭스 배치된 유기 EL 소자와, 이들 유기 EL 소자를 구동하기 위한 복수의 박막 트랜지스터가 기판 상에 제공되고, 이 기판의 주변 부분에, 유기 EL 소자가 배치되는 화소 에리어의 상측을 밀폐하는 밀봉 패널을 접합하는 유기 EL 패널에 있어서,상기 박막 트랜지스터의 상측에 실리콘계 질화막 또는 실리콘계 산화막을 형성하고, 이 실리콘계 질화막 또는 실리콘계 산화막을 시일재에 의해 밀봉 패널에 접착함으로써, 기판과 밀봉 패널과의 밀봉을 행하며,상기 시일재의 하측에 박막 트랜지스터의 소스 혹은 드레인 전극이 존재하고, 그 상측을 덮는 전극 보호층을 형성하며, 이것을 시일재로 덮는 것을 특징으로 하는 유기 EL 패널.
- 매트릭스 배치된 유기 EL 소자와, 이들 유기 EL 소자를 구동하기 위한 복수의 박막 트랜지스터가 기판 상에 제공되고, 이 기판의 주변 부분에, 유기 EL 소자가 배치되는 화소 에리어의 상측을 밀폐하는 밀봉 패널을 접합하는 유기 EL 패널에 있어서,상기 유기 EL 소자는, 기판 상에서의 상기 박막 트랜지스터보다 상측에 형성되어 있으며, 상기 박막 트랜지스터의 상측에 실리콘계 질화막 또는 실리콘계 산화막을 형성하고, 이 실리콘계 질화막 또는 실리콘계 산화막을 시일재에 의해 밀봉 패널에 접착함으로써, 기판과 밀봉 패널과의 밀봉을 행하며,상기 시일재의 하측에 박막 트랜지스터의 소스 혹은 드레인 전극이 존재하고, 그 상측을 덮는 전극 보호층을 형성하며, 이것을 시일재로 덮는 것을 특징으로 하는 유기 EL 패널.
- 삭제
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JPJP-P-2002-00158178 | 2002-05-30 | ||
JP2002158178A JP2003347044A (ja) | 2002-05-30 | 2002-05-30 | 有機elパネル |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030094003A KR20030094003A (ko) | 2003-12-11 |
KR100612814B1 true KR100612814B1 (ko) | 2006-08-18 |
Family
ID=29773637
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1020030034280A KR100612814B1 (ko) | 2002-05-30 | 2003-05-29 | 유기 el 패널 |
Country Status (5)
Country | Link |
---|---|
US (1) | US7049744B2 (ko) |
JP (1) | JP2003347044A (ko) |
KR (1) | KR100612814B1 (ko) |
CN (1) | CN1472992A (ko) |
TW (1) | TWI233578B (ko) |
Families Citing this family (16)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100581901B1 (ko) * | 2004-02-06 | 2006-05-22 | 삼성에스디아이 주식회사 | 액티브 매트릭스형 유기전계발광소자 |
KR100615212B1 (ko) | 2004-03-08 | 2006-08-25 | 삼성에스디아이 주식회사 | 평판 표시 장치 |
JP2005285395A (ja) * | 2004-03-29 | 2005-10-13 | Fujitsu Display Technologies Corp | 配線構造並びにそれを備えた表示装置用基板及び表示装置 |
US8278818B2 (en) | 2004-06-04 | 2012-10-02 | Samsung Mobile Display Co., Ltd. | Electroluminescent display device and method of fabricating the same |
KR100611755B1 (ko) * | 2004-06-04 | 2006-08-10 | 삼성에스디아이 주식회사 | 유기전계발광소자 및 그의 제조방법 |
US8350466B2 (en) | 2004-09-17 | 2013-01-08 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method thereof |
US8148895B2 (en) | 2004-10-01 | 2012-04-03 | Semiconductor Energy Laboratory Co., Ltd. | Display device and manufacturing method of the same |
JP2006339049A (ja) * | 2005-06-02 | 2006-12-14 | Tokki Corp | 封止膜形成装置 |
JP2007149542A (ja) * | 2005-11-29 | 2007-06-14 | Kyocera Corp | 画像表示装置およびその製造方法 |
US20070170846A1 (en) * | 2006-01-23 | 2007-07-26 | Choi Dong-Soo | Organic light emitting display and method of fabricating the same |
KR100685854B1 (ko) * | 2006-01-25 | 2007-02-22 | 삼성에스디아이 주식회사 | 유기전계발광표시장치 및 그 제조방법 |
KR101281888B1 (ko) | 2006-06-30 | 2013-07-03 | 엘지디스플레이 주식회사 | 유기 전계 발광 표시 장치 및 이의 제조 방법 |
JP5620146B2 (ja) | 2009-05-22 | 2014-11-05 | 三星ディスプレイ株式會社Samsung Display Co.,Ltd. | 薄膜蒸着装置 |
JP6142151B2 (ja) * | 2012-07-31 | 2017-06-07 | 株式会社Joled | 表示装置および電子機器 |
JP6296187B2 (ja) * | 2012-07-31 | 2018-03-20 | 株式会社Joled | 表示装置および電子機器 |
KR20140064328A (ko) * | 2012-11-20 | 2014-05-28 | 엘지디스플레이 주식회사 | 유기전계 발광소자 및 이의 제조 방법 |
Family Cites Families (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
AU6853898A (en) * | 1997-04-17 | 1998-11-11 | Kureha Kagaku Kogyo K.K. | Moisture-proofing film and electroluminescent device |
TW439387B (en) * | 1998-12-01 | 2001-06-07 | Sanyo Electric Co | Display device |
JP2000174282A (ja) * | 1998-12-03 | 2000-06-23 | Semiconductor Energy Lab Co Ltd | 半導体装置 |
JP3817081B2 (ja) * | 1999-01-29 | 2006-08-30 | パイオニア株式会社 | 有機el素子の製造方法 |
US6281552B1 (en) * | 1999-03-23 | 2001-08-28 | Semiconductor Energy Laboratory Co., Ltd. | Thin film transistors having ldd regions |
JP3423261B2 (ja) * | 1999-09-29 | 2003-07-07 | 三洋電機株式会社 | 表示装置 |
US6605826B2 (en) * | 2000-08-18 | 2003-08-12 | Semiconductor Energy Laboratory Co., Ltd. | Light-emitting device and display device |
JP3695308B2 (ja) * | 2000-10-27 | 2005-09-14 | 日本電気株式会社 | アクティブマトリクス有機el表示装置及びその製造方法 |
US6720198B2 (en) * | 2001-02-19 | 2004-04-13 | Semiconductor Energy Laboratory Co., Ltd. | Light emitting device and manufacturing method thereof |
KR100533719B1 (ko) * | 2001-06-29 | 2005-12-06 | 엘지.필립스 엘시디 주식회사 | 유기 전계발광소자 및 그 제조방법 |
KR100870660B1 (ko) * | 2001-12-31 | 2008-11-26 | 엘지디스플레이 주식회사 | 패널의 합착력이 향상된 액정표시소자 및 제조방법 |
US7038377B2 (en) * | 2002-01-16 | 2006-05-02 | Seiko Epson Corporation | Display device with a narrow frame |
-
2002
- 2002-05-30 JP JP2002158178A patent/JP2003347044A/ja active Pending
-
2003
- 2003-05-12 TW TW092112811A patent/TWI233578B/zh not_active IP Right Cessation
- 2003-05-29 KR KR1020030034280A patent/KR100612814B1/ko active IP Right Grant
- 2003-05-29 US US10/448,990 patent/US7049744B2/en not_active Expired - Lifetime
- 2003-05-30 CN CNA031380506A patent/CN1472992A/zh active Pending
Also Published As
Publication number | Publication date |
---|---|
US20040012870A1 (en) | 2004-01-22 |
TWI233578B (en) | 2005-06-01 |
KR20030094003A (ko) | 2003-12-11 |
CN1472992A (zh) | 2004-02-04 |
JP2003347044A (ja) | 2003-12-05 |
US7049744B2 (en) | 2006-05-23 |
TW200405227A (en) | 2004-04-01 |
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