US6590337B1 - Sealing structure for display device - Google Patents

Sealing structure for display device Download PDF

Info

Publication number
US6590337B1
US6590337B1 US09670679 US67067900A US6590337B1 US 6590337 B1 US6590337 B1 US 6590337B1 US 09670679 US09670679 US 09670679 US 67067900 A US67067900 A US 67067900A US 6590337 B1 US6590337 B1 US 6590337B1
Authority
US
Grant status
Grant
Patent type
Prior art keywords
insulating film
substrate
seal
pixel
display device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Active, expires
Application number
US09670679
Inventor
Ryuji Nishikawa
Tsutomu Yamada
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Sanyo Electric Co Ltd
Original Assignee
Sanyo Electric Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Grant date
Family has litigation

Links

Images

Classifications

    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • H01L51/524Sealing arrangements having a self-supporting structure, e.g. containers
    • H01L51/5246Sealing arrangements having a self-supporting structure, e.g. containers characterised by the peripheral sealing arrangements, e.g. adhesives, sealants
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L27/00Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate
    • H01L27/28Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part
    • H01L27/32Devices consisting of a plurality of semiconductor or other solid-state components formed in or on a common substrate including components using organic materials as the active part, or using a combination of organic materials with other materials as the active part with components specially adapted for light emission, e.g. flat-panel displays using organic light-emitting diodes [OLED]
    • H01L27/3241Matrix-type displays
    • H01L27/3244Active matrix displays
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • H01L51/524Sealing arrangements having a self-supporting structure, e.g. containers
    • H01L51/5243Sealing arrangements having a self-supporting structure, e.g. containers the sealing arrangements being made of metallic material
    • HELECTRICITY
    • H01BASIC ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES; ELECTRIC SOLID STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H01L51/00Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof
    • H01L51/50Solid state devices using organic materials as the active part, or using a combination of organic materials with other materials as the active part; Processes or apparatus specially adapted for the manufacture or treatment of such devices, or of parts thereof specially adapted for light emission, e.g. organic light emitting diodes [OLED] or polymer light emitting devices [PLED];
    • H01L51/52Details of devices
    • H01L51/5237Passivation; Containers; Encapsulation, e.g. against humidity
    • H01L51/5259Passivation; Containers; Encapsulation, e.g. against humidity including getter material or desiccant
    • YGENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10STECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S428/00Stock material or miscellaneous articles
    • Y10S428/917Electroluminescent

Abstract

In a display device formed by adhering substrates facing one another using a seal, a buffer layer is disposed between the seal and a substrate to prevent separation between the substrates. Specifically, for example, a display region is configured by covering switching elements with a planarizing insulating film for planarization, then forming, in order, pixel electrodes, an emissive layer, and a counter electrode. The planarizing insulating film is extended beyond the display region to an area under the seal. The planarizing insulating film functions as the buffer layer to absorb the stress generated during curing of the seal, thereby preventing separation between the substrate and the protective casing.

Description

BACKGROUND OF THE INVENTION

1. Field of the Invention

The present invention relates to a display device comprising a light-emitting layer such as an electroluminescence (hereinafter referred to as “EL”) element disposed on a substrate, and particularly to a sealing structure for an organic EL display device.

2. Description of the Prior Art

In the recent years, organic EL display devices have gained attention as devices that may replace CRTs and LCDs. FIG. 1A is a plan view of a conventional organic EL display device, and FIG. 1B shows a cross-sectional view taken along line A-A′ of FIG. 1A. A plurality of selective drive circuits 2 are disposed for respective pixels on a transparent substrate 1. A planarizing insulating film 3 is formed covering the selective drive circuits 2. A contact hole is created in the planarizing insulating film 3 in a position corresponding to each selective drive circuit 2. Each selective drive circuit 2 is connected to a pixel electrode 4 through this contact hole. An emissive layer 5 and a counter electrode 6 are disposed covering those structures. Surrounding the pixel region including the selective drive circuits 2, pixel electrodes 4, emissive layer 5, and counter electrode 6, display driver circuits 7 a, 7 b are arranged for controlling the selective drive circuits 2 and applying predetermined voltages to the pixel electrodes 4 so as to drive the display region. The driver circuits 7 are connected to terminals 9 by wiring 8. A protective casing 10 composed of a metal such as aluminum is arranged covering these structures, and adhered to the transparent substrate 1 using an adhesive 11 made of a resin cured by ultraviolet rays. The sealed space between the protective casing 10 and the transparent substrate 1 is filled with dry nitrogen. A desiccant sheet 12 is disposed on the inner surface of the protective casing 10.

A selective drive circuit 2 comprises, for example, a plurality of semiconductor elements including thin film transistors (TFT). A first TFT switches between “on” (conductive state) and “off” (non-conductive state) in response to the output from the driver circuit 7 a. When the first TFT of a selective drive circuit 2 is turned on by an output from the driver circuit 7 a, the corresponding pixel electrode 4 is applied with a voltage according to an output from the driver circuit 7 b via a second TFT. An electric current thereby flows between the pixel electrode 4 and the counter electrode 6. The emissive layer 5 is configured to emit light when a current is made to flow therein by the pixel electrode 4 and the counter electrode 6, and emits light at an intensity according to the amount of current flowing between the pixel electrode 4 and the counter electrode 6. The generated light transmits downward in the cross-sectional view through the transparent substrate 1 to be observed.

In the organic EL element, holes injected from the anode and electrons injected from the cathode recombine within the emissive layer. As a result, organic molecules constituting the emissive layer are excited, generating excitons. Through the process in which these excitons undergo radiation until deactivation, light is emitted from emissive layer. This light radiates outward through the side of the transparent anode via the transparent insulator substrate, resulting in light emission.

An organic EL layer 5 is known to be susceptible to degradation by moisture. When, for example, a defect such as a pinhole is present in the counter electrode 6, moisture entering from the pinhole may cause oxidation of the counter electrode 6 or separation between the organic EL layer 5 and the counter electrode 6, producing dark spots and resulting in deterioration of display quality. It is the function of the protective casing 10 not only to protect the display region and the driver circuits 7 from physical shock, but also to prevent moisture from entering the device. The protective casing 10 is therefore formed in a shape of a tray covering the display region. Further, to prevent damage by penetrating moisture, the space inside the protective casing 10 is filled with an inert gas such as dry nitrogen or helium, and the desiccant sheet 12 is disposed. A stepped portion may be provided in the location for arranging the desiccant sheet 12. The structure as described above is disclosed, for example, in Japanese Patent Laid-Open Publication No. Hei 9-148066.

However, in a conventional sealing structure, the protective casing 10 is adhered to the transparent substrate 1 by directly applying the adhesive 11 on the transparent substrate 1. By such a method, the adhesive may peel off during curing of the adhesive 11 due to the difference in the coefficient of thermal expansion between the transparent substrate 1 and the protective casing 10, resulting in incomplete sealing.

Moreover, the adhesive 11 is applied over the wiring 8 in areas provided with the wiring 8. A disconnection may be caused in the wiring due to stress generated during curing of the adhesive 11.

SUMMARY OF THE INVENTION

The object of the present invention is to provide an EL display device having a structure preventing separation between the transparent substrate 1 and the protective casing 10 even when there exists a difference in the coefficient of thermal expansion between the transparent substrate 1 and the protective casing 10, while also preventing disconnection in the wiring 8.

The present invention for achieving the above object provides a display device having a display region arranged between first and second substrates composed of different materials, comprising a seal for adhering the first and second substrates to one another, and a buffer layer between the seal and the first and/or second substrate.

The buffer layer may be an insulating film.

In another aspect of the present invention, the display region is configured by laminating a plurality of thin films including an insulating film. The insulating film extends to an area between the seal and the first and/or second substrate to serve as the buffer layer.

In a further aspect, the display region comprises selective drive circuits provided for each pixel, a planarizing insulating film formed covering the selective drive circuits, and pixel electrodes disposed on the planarizing insulating film corresponding to each of the selective drive circuits. The planarizing insulating film serves as the buffer layer.

The first substrate may be a transparent insulating substrate, and the second substrate may be a protective casing formed covering the display region.

Further, the first substrate may be made of glass or resin, and the second substrate may be made of metal.

In another aspect of the present invention, the planarizing insulating film extends in an area between the first substrate and the seal.

The planarizing insulating film may be composed of a material softer compared to the seal and the first substrate.

In a further aspect of the present invention, the display device includes a terminal connected to the display region via a wiring and exposed outside the display device. The buffer layer is arranged between the wiring or the terminal and the seal.

Another aspect of the present invention is a light-emitting device in which an emissive region having an emissive element is sealed between first and second substrates having different coefficients of thermal expansion, wherein the first and second substrates are adhered to one another by a seal in an area surrounding the emissive region, and a buffer layer is formed between the seal and the first and/or second substrate.

A further aspect of the above-described device of the present invention is that a desiccant is mixed in the seal.

According to the present invention, the element provided in the display region or the emissive region may be an organic electroluminescence element containing an organic emissive material.

In a further aspect of the present invention, the emissive region comprises selective drive circuits provided for each pixel, a planarizing insulating film formed covering the selective drive circuits, and pixel electrodes disposed on the planarizing insulating film corresponding to each of the selective drive circuits. The planarizing insulating film serves as the buffer layer.

By providing a buffer layer as described above, stress generated at the seal portion due to causes such as the difference in the coefficient of thermal expansion between the first and second substrates can be absorbed by the buffer layer in the present invention. Accordingly, defects in adhesion between the first and second substrates due to peeling of the seal or other reasons can reliably be prevented.

According to the present invention, the display region is configured by laminating a plurality of thin films including an insulating film, and the insulating film serves as the buffer layer. It is therefore unnecessary to separately provide a buffer layer. The buffer layer can be formed at the same time of forming the display region, simplifying the manufacturing process.

In the present invention, the planarizing insulating film serves as the buffer layer. A planarizing insulating film has a greater thickness compared to a gate insulating film or an interlayer insulating film, and is softer than glass or the seal. Among the insulating films formed within the display region, the planarizing insulating film is most suitable as the buffer layer.

Further, according to the present invention, the display device includes a terminal connected to the display region via a wiring and exposed outside the display device, and a buffer layer is arranged between the wiring or the terminal and the seal. Such an arrangement prevents disconnection of the wiring caused by the stress generated during curing of the seal.

BRIEF DESCRIPTION OF THE DRAWINGS

FIGS. 1A and 1B show a plan view and a cross-sectional view of a conventional display device.

FIGS. 2A, 2B, and 2C show a plan view and cross-sectional views of a display device according to the present invention.

DESCRIPTION OF PREFERRED EMBODIMENT

FIG. 2A is a plan view of an organic EL display device according to a preferred embodiment of the present invention, and FIG. 2B shows a cross-sectional view taken along line A-A′ of FIG. 2A. Structures similar to those in the conventional device described earlier are labeled with the same reference numerals, and detailed explanation of those structures will not be repeated. Arranged on a transparent substrate for respective pixels are selective drive circuits 2 and pixel electrodes 4. An emissive layer 5 and a counter electrode 6 are disposed covering those structures. Surrounding the pixel region including the selective drive circuits 2, pixel electrodes 4, emissive layer 5, and counter electrode 6, driver circuits 7 a, 7 b are arranged for controlling the selective drive circuits 2 and applying predetermined voltages to the pixel electrodes 4. The driver circuits 7 are connected to terminals 9 by wiring 8. A protective casing 10 is arranged covering the display region. In the present specification, term “substrate” is used also to refer to the protective casing 10.

A feature of the present embodiment is that a buffer layer is provided between the seal and a substrate. Specifically, in this embodiment, the planarizing insulating film 21 formed covering the selective drive circuits 2 is extended beyond the display region and arranged between the seal 11 and the substrate 1.

The planarizing insulating film 21 is positioned between the seal 11 and the substrate 1. The planarizing insulating film 21 is softer compared to the seal 11 and the substrate 1. Even when stress is imposed on the seal 11 during curing of the seal 11 due to the difference in the coefficient of thermal expansion between the substrate 1 and the protective casing 10, the planarizing insulating film 21 functions as the buffer layer and absorbs the stress, preventing separation between the substrate 1 and the protective casing 10.

The significant feature of the present invention is that a buffer layer softer than the seal 11 is disposed between the seal 11 and the substrate 1. The buffer layer is not limited to a planarizing insulating film 21, and may be composed of any material softer than the seal 11. However, in an arrangement wherein the wiring 8 is laid under the seal 11 to connect with the terminals 9 exposed outside, the buffer layer must at least be an insulating film.

Other than by extending a film used in the laminated structure of the display region, the buffer layer can obviously be provided by forming separately. However, as the display region comprises several layers of insulating films, the buffer layer can efficiently be formed without adding a manufacturing process by extending one or more of those several layers to the area of the seal 11.

Among the several insulating films formed in the display region, the planarizing insulating film 21 is formed at a greater thickness of 1 μm-2 μm compared to the gate insulating film 42 and the interlayer insulating film 45 having a thickness of 500 Å-2000 Å, because the planarizing insulating film 21 has the function to planarize unevenness produced by the structures formed in the underlying layers. The planarizing insulating film 21 is optimal as the buffer layer because of its sufficient thickness.

Materials such as acrylic resin, silicon oxide film, silicon nitride film, and positive type resist material can be used as the material for the planarizing insulating film 21. However, because plural display devices are fabricated simultaneously on one large mother glass in the same process and subsequently divided, acrylic resins and positive type resist materials, which are suitable for processing a large area, are more preferable compared to rotational application type materials used for semiconductor chips, namely, SOG films. Further, for the planarizing insulating film 21, it is preferable to select a material having the minimum possible moisture permeability because the organic EL element having an emissive layer is easily deteriorated by moisture. Display quality becomes degraded when moisture enters the sealed space formed by the substrate 1 and the protective casing 10.

By increasing the thickness of the planarizing insulating film 21, the film 21 demonstrates a superior performance as a buffer layer. However, at the same time, area of the film 21 exposed outside becomes increased, in turn increasing the amount of moisture penetrating from the exposed portions. It is therefore preferable to form the planarizing insulating film 21 at a minimum possible thickness within the range that the film 21 can sufficiently function as the buffer layer.

Using any of the above-mentioned materials of the planarizing insulating film 21, slight permeation of moisture is inevitable. To deal with this problem, desiccant powder can be mixed in the seal 11. The desiccant powder adsorbs the moisture permeating through the planarizing insulating film 21 to accomplish a more reliable prevention of deterioration of the organic EL element. Because the planarizing insulating film 21 is 1 μm-2 μm as described above, moisture permeation through the planarizing insulating film 21 into the sealed space can be prevented by mixing the desiccant in the seal 11, without requiring to mix the desiccant in the planarizing insulating film 21. The desiccant is mixed into the seal 11 before curing. By curing the resin after the mixture is thoroughly mixed, the desiccant can uniformly be mixed in the seal 11. As the desiccant, a substance having a chemically adsorptive property is used. Examples of chemically adsorptive desiccants include oxides of alkali earth metals such as calcium oxide and barium oxide, halides of alkali earth metals such as calcium chloride, and phosphorus pentaoxide. Physically adsorptive desiccants such as silica gel are not appropriate because such desiccants discharge adsorbed moisture at high temperatures.

FIG. 2C is a cross-sectional view of an example configuration showing one pixel of an active matrix type organic EL display device according to the present embodiment. A gate electrode 41 made of a refractory metal such as Cr or Mo is formed on an insulator substrate 1 made of quartz glass, non-alkali glass, or a similar material. Over the gate electrode 41, a gate insulating film 42 composed of SiO2 and an active layer 43 composed of p-Si film are sequentially formed. The active layer 43 includes a channel 43 c located above the gate electrode 41. On both sides of the channel 43 c, ion doping is performed by using a stopper insulating film 44 located over the channel 43 c as a mask. Further ion doping is subsequently performed by covering both sides of the gate electrode 41 with a resist. As a result, low-concentration regions are formed on both sides of the gate electrode 41, and a source 43 s and a drain 43 d, which are high-concentration regions, are disposed on the outboard sides of the low-concentration regions. The gate electrode 41, the gate insulating film 42, and the active layer 43 are arranged in a configuration of a TFT, and constitute a part of the selective drive circuit. The TFT is formed in the so-called LDD structure.

An interlayer insulating film 45 formed by a sequential lamination of a SiO2 film, a SiN film, and a SiO2 film is provided on the entire surface over the gate insulating film 42, the active layer 43, and the stopper insulating film 44. A contact hole formed in a position corresponding to the drain 43 d is filled with a metal such as Al to form a connection with a power source line 46. Further, a planarizing insulating film 3 made of an organic resin or a similar material is formed over the entire surface for planarization. Subsequently, a contact hole is formed in the planarizing insulating film 3 in a position corresponding to the source 43 s. A transparent electrode 4 composed of ITO (indium tin oxide) or a similar material is formed through this contact hole to contact the source 43 s.

The emissive layer 5 is an emissive element layer comprising a first hole-transport layer 5 a composed of MTDATA (4,4′,4″-tris(3-methylphenylphenylamino)triphenylamine), a second hole-transport layer 5 b composed of TPD (N,N′-diphenyl-N,N′-di(3-methylphenyl)-1,1′-biphenyl-4,4′-diamine), an emissive layer 5 c formed of Bebq2 (bis(10-hydroxybenzo[h]quinolinato)beryllium) including quinacridone derivatives, and an electron transport layer 5 d made of Bebq2. The above-described structure is disclosed in, for example, Japanese Patent Applications No. Hei 11-22183 and No. Hei 11-22184.

A TFT having a bottom gate type structure wherein the gate electrode is located closer to the substrate compared to the active layer is described herein as an example. However, the TFT may have any type of structure as long as the TFT can apply a voltage selectively to each one of the plurality of pixel electrodes. For example, the TFT may have a top gate type structure wherein the active layer is disposed closer to the substrate compared to the gate electrode.

Although an organic EL display device having a display region configured by sandwiching an emissive layer with electrodes is used as an example in the above-described embodiment, the present invention is not limited to such a device. The present invention can similarly be implemented in various display and emissive devices such as vacuum fluorescent display (VFD) devices and LED devices. However, an organic EL display device is especially vulnerable to moisture such that any slight separation between the substrates cannot be overlooked. Accordingly, prevention of separation between substrates by using the present invention is most beneficial when applied in an organic EL display device.

Claims (65)

What is claimed is:
1. An active matrix type display device having a display region arranged between first and second substrates composed of different materials, comprising:
a seal for adhering said first and second substrates to one another; wherein
said display region comprises selective drive circuits each provided for each pixel, an insulating film formed covering said selective drive circuits, and pixel electrodes each corresponding to each pixel and disposed on said insulating film; and
said insulating film is arranged between said seal and said first and/or second substrates as a buffer layer.
2. The display device as defined in claim 1, wherein
said insulating film extends from said display region to an area between said seal and said first and/or second substrate to serve as said buffer layer.
3. The display device as defined in claim 1, wherein
said insulating film is a planarizing insulating film.
4. The display device as defined in claim 1, wherein
said insulating film is a planarizing insulating film, and
said planarizing insulating film extends to an area between said first substrate and said seal.
5. The display device as defined in claim 1, wherein
said display region comprises an organic electroluminescence element in which an organic layer containing an organic emissive material is formed between electrodes.
6. The display device as defined in claim 1, wherein
a desiccant is mixed in said seal.
7. An active matrix type display device having a display region arranged between first and second substrates composed of different materials, comprising:
a seal for adhering said first and second substrates to one another; wherein
said display region comprises selective drive circuits each provided for each pixel, an insulating film formed covering said selective drive circuits, and pixel electrodes each corresponding to each pixel and disposed on said insulating film; and
said insulating film is arranged between said seal and said first and/or second substrates as a buffer layer, wherein
said first substrate is a transparent insulating substrate; and
said second substrate is a protective casing formed covering said display region.
8. The display device as defined in claim 7, wherein said first substrate is made of glass or resin; and said second substrate is made of metal.
9. An active matrix type display device having a display region arranged between first and second substrates composed of different materials, comprising:
a seal for adhering said first and second substrates to one another; wherein
said display region comprises selective drive circuits each provided for each pixel, an insulating film formed covering said selective drive circuits, and pixel electrodes each corresponding to each pixel and disposed on said insulating film; and
said insulating film is arranged between said seal and said first and/or second substrates as a buffer layer, wherein
said insulating film is a planarizing insulating film,
said planarizing insulating film extends to an area between said first substrate and said seal, and
said planarizing insulating film is composed of a material softer compared to said seal and said first substrate.
10. An active matrix type display device having a display region arranged between first and second substrates composed of different materials, comprising:
a seal for adhering said first and second substrates to one another; wherein
said display region comprises selective drive circuits each provided for each pixel, an insulating film formed covering said selective drive circuits, and pixel electrodes each corresponding to each pixel and disposed on said insulating film;
said insulating film is arranged between said seal and said first and/or second substrates as a buffer layer;
a terminal connected to said display region via a wiring and exposed outside said display device; and
said buffer layer is arranged between said wiring or said terminal and said seal.
11. A light-emitting device in which an emissive region having an emissive element is sealed between first and second substrates having different coefficients of thermal expansion, wherein
said first and second substrates are adhered to one another by a seal in an area surrounding said emissive region;
said emissive region comprises selective drive circuits each provided for each pixel, an insulating film formed covering said selective drive circuits, and pixel electrodes each corresponding to each pixel, disposed on said insulating film, and forming a portion of said emissive element; and
said insulating film is arranged between said seal and said first and/or second substrate as a buffer layer.
12. The light-emitting device as defined in claim 11, wherein
a desiccant is mixed in said seal.
13. The light-emitting device as defined in claim 11, wherein
said emissive element is an organic electroluminescence element containing an organic emissive material.
14. The display device as defined in claim 11, wherein
said emissive region includes an insulating film; and
said insulating film extends to an area between said seal and said first and/or second substrate to serve as said buffer layer.
15. The display device as defined in claim 11, wherein
said emissive region comprises selective drive circuits provided for each pixel, a planarizing insulating film formed covering said selective drive circuits, and pixel electrodes disposed on said planarizing insulating film corresponding to each of said selective drive circuits; and
said planarizing insulating film serves as said buffer layer.
16. An active matrix type display device in which a display region having a display element is disposed between first and second substrates, said active matrix type light-emitting device comprising:
a seal for adhering said first and second substrates to one another, wherein
on the side of the said first substrate, there are provided selective drive circuits each provided for each pixel, an insulting film formed covering said selective drive circuits, pixel electrodes each corresponding to each pixel, disposed on said insulating film, and forming a part of said display element, and other components of said display element layered on said pixel electrodes, and
said insulating film is provided between said seal and said first substrate as a buffer layer.
17. The active matrix type light-emitting device as defined in claim 16, wherein
said selective drive circuit includes a thin film transistor.
18. An active matrix type light-emitting device in which an emissive region having an electroluminescence element is sealed between first and second substrates, wherein
said first and second substrates are adhered to one another by a seal in an area surrounding said emissive region;
selective drive circuits each provided for each pixel and each for driving corresponding electroluminescence element, an insulting film formed covering said selective drive circuits, and said electroluminescence elements are provided on the side of said first substrate, each of said electroluminescence elements comprising a pixel electrode corresponding to each pixel and disposed on said insulating film, an element layer on said pixel electrode and including at least an emissive layer, and an electrode layer on said element layer and opposing said pixel electrode, and
said insulating film is disposed between said seal and said first substrate as a buffer layer.
19. The active matrix type light-emitting device as defined in claim 18, wherein
said insulating film extends from said emissive region to an area between said first substrate and said seal to serve as said buffer layer.
20. The active matrix light-emitting device as defined in claim 18, wherein
said insulating film includes a silicon oxide film.
21. The active matrix light-emitting device as defined in claim 18, wherein said insulating film includes a silicon nitride film.
22. An active matrix type light-emitting device in which an emissive region having an electroluminescence element is sealed between first and second substrates, wherein
said first and second substrates are adhered to one another by a seal in an area surrounding said emissive region;
selective drive circuits each provided for each pixel and each for driving corresponding electroluminescence element, an insulting film formed covering said selective drive circuits, and said electroluminescence elements are provided on the side of said first substrate, each of said electroluminescence elements comprising a pixel electrode corresponding to each pixel and disposed on said insulating film, an element layer on said pixel electrode and including at least an emissive layer, and an electrode layer on said element layer and opposing said pixel electrode; and
said insulating film is disposed between said seal and said first substrate as a buffer layer, wherein
said insulating film is a resin.
23. An active matrix type display device in which a display region having a display element is disposed between first and second substrates, said active matrix type light-emitting device comprising:
a seal for adhering said first and second substrates to one another, wherein
on the side of the said first substrate, there are provided selective drive circuits each provided for each pixel, an insulting film formed covering said selective drive circuits, pixel electrodes each corresponding to each pixel, disposed on said insulating film, and forming a part of said display element, and other components of said display element layered on said pixel electrodes,
said insulating film is provided between seal and said first substrate as a buffer layer, and
said insulating film is a resin.
24. A light-emitting device in which an emissive region having an emissive element is sealed between first and second substrates having different coefficients of thermal expansion, wherein
said first and second substrates are adhered to one another by a seal in an area surrounding said emissive region;
said emissive region comprises selective drive circuits each provided for each pixel, an insulating film formed covering said selective drive circuits, and pixel electrodes each corresponding to each pixel, disposed on said insulating film, and forming a portion of said emissive element;
said insulating film is arranged between said seal and said first and/or second substrate as a buffer layer;
said first substrate is a transparent insulating substrate; and
said second substrate is a protective casing formed covering said display region.
25. The display device as defined in claim 24, wherein
said first substrate is made of glass or resin; and
said second substrate is made of metal.
26. The display device as defined in claim 24, wherein
said insulating film is composed of a material softer compared to said seal and said first substrate.
27. The display device as defined in claim 24, further comprising:
a terminal connected to said display region via a wiring and exposed outside said display device; wherein
said buffer layer is arranged between said wiring or said terminal and said seal.
28. The display device as defined in claim 24, wherein
said insulating film is a resin.
29. An active matrix type display device in which a display region having a display element is disposed between first and second substrates, said active matrix type light-emitting device comprising:
a seal for adhering said first and second substrates to one another, wherein
on the side of the said first substrate, there are provided selective drive circuits each provided for each pixel, an insulting film formed covering said selective drive circuits, pixel electrodes each corresponding to each pixel, disposed on said insulating film, and forming a part of said display element, and other components of said display element layered on said pixel electrodes,
said insulating film is provided between said seal and said first substrate as a buffer layer,
said first substrate is a transparent insulating substrate; and
said second substrate is a protective casing forming covering said display region.
30. The display device as defined in claim 29, wherein
said first substrate is made of glass or resin; and
said second substrate is made of metal.
31. The display device as defined in claim 29, wherein
said insulating film is composed of a material softer compared to said seal and said first substrate.
32. The display device as defined in claim 29, further comprising:
a terminal connected to said display region via a wiring and exposed outside said display device; wherein
said buffer layer is arranged between said wiring or said terminal and said seal.
33. The display device as defined in claim 29, wherein
said insulating film is a resin.
34. An active matrix type light-emitting device in which an emissive region having an electroluminescence element is sealed between first and second substrates, wherein
said first and second substrates are adhered to one another by a seal in an area surrounding said emissive region;
selective drive circuits each provided for each pixel and each for driving corresponding electroluminescence element, an insulting film formed covering said selective drive circuits, and said electroluminescence elements are provided on the side of said first substrate, each of said electroluminescence elements comprising a pixel electrode corresponding to each pixel and disposed on said insulating film, an element layer on said pixel electrode and including at least an emissive layer, and an electrode layer on said element layer and opposing said pixel electrode;
said insulating film is disposed between said seal and said first substrate as a buffer layer;
said first substrate is a transparent insulating substrate; and
said second substrate is a protective casing formed covering said display region.
35. The display device as defined in claim 34, wherein
said first substrate is made of glass or resin; and
said second substrate is made of metal.
36. The display device as defined in claim 34, wherein
said insulating film is composed of a material softer compared to said seal and said first substrate.
37. The display device as defined in claim 34, further comprising:
a terminal connected to said display region via a wiring and exposed outside said display device; wherein
said buffer layer is arranged between said wiring or said terminal and said seal.
38. The display device as defined in claim 34, wherein
said insulating film is a resin.
39. An active matrix type display device having a display region arranged between first and second substrates composed of different materials, comprising:
a seal for adhering said first and second substrates to one another, wherein
said display region comprises selective drive circuits each provided for each pixel, an insulating film formed covering said selective drive circuits, and pixel electrodes each corresponding to each pixel and disposed on said insulating film;
said insulating film is arranged between said seal and said first and/or second substrates as a buffer layer; and
said insulating film is composed of a material softer compared to said seal and said first substrate.
40. The display device as defined in claim 39, wherein
said first substrate is made of glass or resin; and
said second substrate is made of metal.
41. The display device as defined in claim 39, further comprising:
a terminal connected to said display region via a wiring and exposed outside said display device; wherein
said buffer layer is arranged between said wiring or said terminal and said seal.
42. The display device as defined in claim 39, wherein
said insulating film is a resin.
43. A light-emitting device in which an emissive region having an emissive element is scaled between first and second substrates having different coefficients of thermal expansion, wherein
said first and second substrates are adhered to one another by a seal in an area surrounding said emissive region;
said emissive region comprises selective drive circuits each provided for each pixel, an insulating film formed covering said selective drive circuits, and pixel electrodes each corresponding to each pixel, disposed on said insulating film, and forming a portion of said emissive element;
said insulating film is arranged between said seal and said first and/or second substrate as a buffer layer; and
said insulating film is composed of a material softer compared to said seal and said first substrate.
44. The display device as defined in claim 43, wherein
said first substrate is made of glass or resin; and
said second substrate is made of metal.
45. The display device as defined in claim 43, further comprising:
a terminal connected to said display region via a wiring and exposed outside said display device; wherein
said buffer layer is arranged between said wiring or said terminal and said seal.
46. The display device as defined in claim 43, wherein
said insulating film is a resin.
47. An active matrix type display device in which a display region having a display element is disposed between first and second substrates, said active matrix type light-emitting device comprising:
a seal for adhering said first and second substrates to one another, wherein
on the side of the said first substrate, there are provided selective drive circuits each provided for each pixel, an insulting film formed covering said selective drive circuits, pixel electrodes each corresponding to each pixel, disposed on said insulating film, and forming a part of said display element, and other components of said display element layered on said pixel electrodes,
said insulating film is provided between said seal and said first substrate as a buffer layer, and
said insulating film is composed of a material softer compared to said seal and said first substrate.
48. The display device as defined in claim 47, wherein
said first substrate is made of glass or resin; and
said second substrate is made of metal.
49. The display device as defined in claim 47, further comprising:
a terminal connected to said display region via a wiring and exposed outside said display device; wherein
said buffer layer is arranged between said wiring or said terminal and said seal.
50. The display device as defined in claim 47, wherein
said insulating film is a resin.
51. An active matrix type light-emitting device in which an emissive region having an electroluminescence element is sealed between first and second substrates, wherein
said first and second substrates are adhered to one another by a seal in an area surrounding said emissive region;
selective drive circuits each provided for each pixel and each for driving corresponding electroluminescence element, an insulting film formed covering said selective drive circuits, and said electroluminescence elements are provided on the side of said first substrate, each of said electroluminescence elements comprising a pixel electrode corresponding to each pixel and disposed on said insulating film, an element layer on said pixel electrode and including at least an emissive layer, and an electrode layer on said element layer and opposing said pixel electrode;
said insulating film is disposed between said seal and said first substrate as a buffer layer; and
said insulating film is composed of a material softer compared to said seal and said first substrate.
52. The display device as defined in claim 51, wherein
said first substrate is made of glass or resin; and
said second substrate is made of metal.
53. The display device as defined in claim 51, further comprising:
a terminal connected to said display region via a wiring and exposed outside said display device; wherein
said buffer layer is arranged between said wiring or said terminal and said seal.
54. The display device as defined in claim 51, wherein
said insulating film is a resin.
55. A light-emitting device in which an emissive region having an emissive element is sealed between first and second substrates having different coefficients of thermal expansion, wherein
said first and second substrates are adhered to one another by a seal in an area surrounding said emissive region;
said emissive region comprises selective drive circuits each provided for each pixel, an insulating film formed covering said selective drive circuits, and pixel electrodes each corresponding to each pixel, disposed on said insulating film, and forming a portion of said emissive element;
said insulating film is arranged between said seal and said first and/or second substrate as a buffer layer; and
a terminal connected to said display region via a wiring and exposed outside said display device, wherein
said buffer layer is arranged between said wiring or said terminal and said seal.
56. The display device as defined in claim 55, wherein
said first substrate is made of glass or resin; and
said second substrate is made of metal.
57. The display device as defined in claim 55, wherein
said insulating film is a resin.
58. An active matrix type display device in which a display region having a display element is disposed between first and second substrates, said active matrix type light-emitting device comprising:
a seal for adhering said first and second substrates to one another, wherein
on the side of the said first substrate, there are provided selective drive circuits each provided for each pixel, an insulting film formed covering said selective drive circuits, pixel electrodes each corresponding to each pixel, disposed on said insulating film, and forming a part of said display element, and other components of said display element layered on said pixel electrodes;
said insulating film is provided between said seal and said first substrate as a buffer layer; and
a terminal connected to said display region via a wiring and exposed outside said display device, wherein
said buffer layer is arranged between said wiring or said terminal and said seal.
59. The display device as defined in claim 58, wherein
said first substrate is made of glass or resin; and
said second substrate is made of metal.
60. The display device as defined in claim 58, wherein
said insulating film is a resin.
61. An active matrix type light-emitting device in which an emissive region having an electroluminescence element is sealed between first and second substrates, wherein
said first and second substrates are adhered to one another by a seal in an area surrounding said emissive region;
selective drive circuits each provided for each pixel and each for driving corresponding electroluminescence element, an insulting film formed covering said selective drive circuits, and said electroluminescence elements are provided on the side of said first substrate, each of said electroluminescence elements comprising a pixel electrode corresponding to each pixel and disposed on said insulating film, an element layer on said pixel electrode and including at least on emissive layer, and an electrode layer on said element layer and opposing said pixel electrode;
said insulating film is disposed between said seal and said first substrate as a buffer layer; and
a terminal connected to said display region via a wiring and exposed outside said display device, wherein
said buffer layer is arranged between said wiring or said terminal and said seal.
62. The display device as defined in claim 61, wherein
said first substrate is made of glass or resin; and
said second substrate is made of metal.
63. The display device as defined in claim 61, wherein
said insulating film is a resin.
64. An active matrix type display device having a display region arranged between first and second substrates composed of different materials, comprising:
a seal for adhering said first and second substrates to one another, wherein
said display region comprises selective drive circuits each provided for each pixel, an insulating film formed covering said selective drive circuits, and pixel electrodes each corresponding to each pixel and disposed on said insulating film;
said insulating film is arranged between said seal and said first and/or second substrates as a buffer layer; and
said insulating film is a resin.
65. A light-emitting device in which an emissive region having an emissive element is sealed between first and second substrates having different coefficients of thermal expansion, wherein
said first and second substrates are adhered to one another by a seal in an area surrounding said emissive region;
said emissive region comprises selective drive circuits each provided for each pixel, an insulating film formed covering said selective drive circuits, and pixel electrodes each corresponding to each pixel, disposed on said insulating film, and forming a portion of said emissive element;
said insulating film is arranged between said seal and said first and/or second substrate as a buffer layer; and
said insulating film is a resin.
US09670679 1999-09-29 2000-09-27 Sealing structure for display device Active 2020-10-28 US6590337B1 (en)

Priority Applications (2)

Application Number Priority Date Filing Date Title
JP11-277088 1999-09-29
JP27708899A JP3423261B2 (en) 1999-09-29 1999-09-29 Display device

Publications (1)

Publication Number Publication Date
US6590337B1 true US6590337B1 (en) 2003-07-08

Family

ID=17578619

Family Applications (1)

Application Number Title Priority Date Filing Date
US09670679 Active 2020-10-28 US6590337B1 (en) 1999-09-29 2000-09-27 Sealing structure for display device

Country Status (3)

Country Link
US (1) US6590337B1 (en)
JP (1) JP3423261B2 (en)
KR (2) KR100407445B1 (en)

Cited By (57)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20020057565A1 (en) * 2000-11-14 2002-05-16 Satoshi Seo Light emitting device
US20030132917A1 (en) * 2002-01-11 2003-07-17 Yuen Siltex Peter Ruggedized, water sealed, security-enhanced touchpad assembly
US20030173895A1 (en) * 2002-01-31 2003-09-18 Yoshifumi Kato Organic electroluminescent color display unit
US20030209979A1 (en) * 2002-05-07 2003-11-13 Osram Opto Semiconductors Gmbh Encapsulation for electroluminescent devices
US20030214232A1 (en) * 2002-05-07 2003-11-20 Ewald Guenther Uniform deposition of organic layer
US20030231486A1 (en) * 2002-06-14 2003-12-18 Tseng-Lu Chien Weather proof treatment for electro-luminescent
US20040012329A1 (en) * 2002-06-07 2004-01-22 Seiko Epson Corporation Organic electroluminescent device, method of manufacturing organic electroluminescent device, and electronic apparatus
US20040012870A1 (en) * 2002-05-30 2004-01-22 Ryuji Nishikawa Organic EL panel
US20040012549A1 (en) * 2002-05-09 2004-01-22 Sanyo Electric Co., Ltd. Electroluminescent display device and manufacturing method of the same
US20040051445A1 (en) * 2002-06-21 2004-03-18 Hitachi Displays, Ltd. Display device
US20050046349A1 (en) * 2003-08-27 2005-03-03 Atsushi Tanaka OLED display and production method thereof
US20050058721A1 (en) * 2003-09-12 2005-03-17 Hursey Francis X. Partially hydrated hemostatic agent
US20050062174A1 (en) * 2003-09-19 2005-03-24 Osram Opto Semiconductors Gmbh Encapsulated organic electronic device
US20050084214A1 (en) * 2003-09-04 2005-04-21 Seiko Epson Corporation Electro-optical device, manufacturing method of the same, and electronic apparatus
US20050082969A1 (en) * 2003-10-21 2005-04-21 Hitachi Displays, Ltd. Display device
US20050195355A1 (en) * 2004-03-08 2005-09-08 Won-Kyu Kwak Flat display device
US20050224820A1 (en) * 2001-11-09 2005-10-13 Semiconductor Energy Laboratory Co., Ltd. Light emitting apparatus and method for manufacturing the same
EP1608032A2 (en) * 2004-06-16 2005-12-21 Lg Electronics Inc. Organic electro-luminescence display device and fabricating method thereof
US20060006424A1 (en) * 2001-11-09 2006-01-12 Semiconductor Energy Laboratory Co., Ltd. Light emitting apparatus and method for manufacturing the same
US20060060954A1 (en) * 2003-04-11 2006-03-23 Georg Meyer-Berg Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components
US20060186413A1 (en) * 2004-10-01 2006-08-24 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method of the same
US20070170423A1 (en) * 2006-01-24 2007-07-26 Choi Dong S Organic light-emitting display and method of making the same
US20070170324A1 (en) * 2006-01-25 2007-07-26 Jae Sun Lee Organic light emitting display and fabricating method of the same
US20070170859A1 (en) * 2006-01-25 2007-07-26 Dong Soo Choi Organic light emitting display and method of fabricating the same
US20070170839A1 (en) * 2006-01-20 2007-07-26 Choi Dong S Organic light-emitting display device with frit seal and reinforcing structure
US20070170857A1 (en) * 2006-01-25 2007-07-26 Dong Soo Choi Organic light-emitting display device and method of manufacturing the same
US20070170845A1 (en) * 2006-01-26 2007-07-26 Dong Soo Choi Organic light emitting display device
US20070170850A1 (en) * 2006-01-23 2007-07-26 Choi Dong-Soo Organic light emitting display and method of fabricating the same
US20070170846A1 (en) * 2006-01-23 2007-07-26 Choi Dong-Soo Organic light emitting display and method of fabricating the same
US20070173167A1 (en) * 2006-01-26 2007-07-26 Young Seo Choi Organic light-emitting display device and method of fabricating the same
US20070177069A1 (en) * 2006-01-27 2007-08-02 Jong Woo Lee Organic light emitting display and fabricating method of the same
US20070176549A1 (en) * 2006-01-27 2007-08-02 Jin Woo Park Organic light emitting display and method of fabricating the same
US20070251849A1 (en) * 2006-04-27 2007-11-01 Denny Lo Devices for the identification of medical products
US20080116795A1 (en) * 2002-12-19 2008-05-22 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method of display device
US20080211393A1 (en) * 2007-02-02 2008-09-04 Hiroyuki Yaegashi Light emitting apparatus
CN100421252C (en) 2004-12-02 2008-09-24 乐金显示有限公司 Organic electro-luminescence display device and method for fabricating the same
US20080317831A1 (en) * 2007-06-21 2008-12-25 Denny Lo Hemostatic sponge and method of making the same
EP2023421A2 (en) * 2007-08-08 2009-02-11 Samsung SDI Co., Ltd. Light emitting display device and method of fabricating the same
US20090091005A1 (en) * 2007-10-09 2009-04-09 Huang Chung-Er Shielding structure for semiconductors and manufacturing method therefor
US20090162406A1 (en) * 2007-09-05 2009-06-25 Z-Medica Corporation Wound healing with zeolite-based hemostatic devices
CN100530675C (en) 2005-05-17 2009-08-19 乐金显示有限公司 The organic electroluminescent device
US20100102302A1 (en) * 2008-10-24 2010-04-29 Hitachi Displays, Ltd. Organic electroluminescence device
US20100121244A1 (en) * 2005-02-09 2010-05-13 Z-Medica Corporation Devices and methods for the delivery of molecular sieve materials for the formation of blood clots
US20100228174A1 (en) * 2006-05-26 2010-09-09 Huey Raymond J Clay-based hemostatic agents and devices for the delivery thereof
US20100233248A1 (en) * 2006-05-26 2010-09-16 Z-Medica Corporation Clay-based hemostatic agents and devices for the delivery thereof
US7834550B2 (en) 2006-01-24 2010-11-16 Samsung Mobile Display Co., Ltd. Organic light emitting display and fabricating method of the same
US7837530B2 (en) 2006-03-29 2010-11-23 Samsung Mobile Display Co., Ltd. Method of sealing an organic light emitting display by means of a glass frit seal assembly
US7944143B2 (en) 2006-01-25 2011-05-17 Samsung Mobile Display Co., Ltd. Organic light-emitting display device with frit seal and reinforcing structure bonded to frame
US20110187629A1 (en) * 2010-02-02 2011-08-04 Samsung Mobile Display Co., Ltd. Flat panel display apparatus and organic light-emitting display apparatus
US8038495B2 (en) 2006-01-20 2011-10-18 Samsung Mobile Display Co., Ltd. Organic light-emitting display device and manufacturing method of the same
US8257732B2 (en) 2006-05-26 2012-09-04 Z-Medica Corporation Clay-based hemostatic agents and devices for the delivery thereof
US8299705B2 (en) 2006-01-26 2012-10-30 Samsung Display Co., Ltd. Organic light emitting display device and manufacturing method thereof
US8729796B2 (en) 2006-01-25 2014-05-20 Samsung Display Co., Ltd. Organic light emitting display device including a gap to improve image quality and method of fabricating the same
US8858969B2 (en) 2010-09-22 2014-10-14 Z-Medica, Llc Hemostatic compositions, devices, and methods
US9072806B2 (en) 2012-06-22 2015-07-07 Z-Medica, Llc Hemostatic devices
US20170054104A1 (en) * 2015-08-19 2017-02-23 Samsung Display Co., Ltd. Display device and method of manufacturing the same
US9821084B2 (en) 2005-02-15 2017-11-21 Virginia Commonwealth University Hemostasis of wound having high pressure blood flow using kaolin and bentonite

Families Citing this family (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2002216949A (en) * 2001-01-18 2002-08-02 Tohoku Pioneer Corp Sealing method and sealing structure of organic el display
KR100682377B1 (en) * 2001-05-25 2007-02-15 삼성전자주식회사 Organic electroluminescence device and method for fabricating thereof
US6822264B2 (en) 2001-11-16 2004-11-23 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
KR100880936B1 (en) * 2001-12-29 2009-02-04 엘지디스플레이 주식회사 Organic Electro-Luminescence Display Device
JP4255844B2 (en) 2003-02-24 2009-04-15 ソニー株式会社 The organic light emitting display device and a manufacturing method thereof
JP4518747B2 (en) * 2003-05-08 2010-08-04 三洋電機株式会社 Organic el display device
JP2007220647A (en) * 2006-02-14 2007-08-30 Samsung Sdi Co Ltd Organic electroluminescent display device and its manufacturing method
JP4910438B2 (en) * 2006-03-20 2012-04-04 セイコーエプソン株式会社 Sealing structure and its production method for the light emitting device, the light emitting device and an electronic apparatus
JP2008103253A (en) * 2006-10-20 2008-05-01 Mitsubishi Electric Corp Display and its manufacturing method

Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5463279A (en) * 1994-08-19 1995-10-31 Planar Systems, Inc. Active matrix electroluminescent cell design
JPH09148066A (en) 1995-11-24 1997-06-06 Pioneer Electron Corp Organic electroluminescent element
US5757126A (en) * 1995-11-30 1998-05-26 Motorola, Inc. Passivated organic device having alternating layers of polymer and dielectric
US5920080A (en) * 1997-06-23 1999-07-06 Fed Corporation Emissive display using organic light emitting diodes
US6346772B1 (en) * 1997-10-03 2002-02-12 Hitachi, Ltd. Wiring substrate and gas discharge display device that includes a dry etched layer wet-etched first or second electrodes
US6403237B1 (en) * 1998-06-10 2002-06-11 Sumitomo Chemical Co., Ltd. Polymeric fluorescent substance and organic electroluminescence device

Patent Citations (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5463279A (en) * 1994-08-19 1995-10-31 Planar Systems, Inc. Active matrix electroluminescent cell design
JPH09148066A (en) 1995-11-24 1997-06-06 Pioneer Electron Corp Organic electroluminescent element
US5757126A (en) * 1995-11-30 1998-05-26 Motorola, Inc. Passivated organic device having alternating layers of polymer and dielectric
US5920080A (en) * 1997-06-23 1999-07-06 Fed Corporation Emissive display using organic light emitting diodes
US6346772B1 (en) * 1997-10-03 2002-02-12 Hitachi, Ltd. Wiring substrate and gas discharge display device that includes a dry etched layer wet-etched first or second electrodes
US6403237B1 (en) * 1998-06-10 2002-06-11 Sumitomo Chemical Co., Ltd. Polymeric fluorescent substance and organic electroluminescence device

Cited By (129)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US20060201620A1 (en) * 2000-11-14 2006-09-14 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
US20020057565A1 (en) * 2000-11-14 2002-05-16 Satoshi Seo Light emitting device
US7178927B2 (en) 2000-11-14 2007-02-20 Semiconductor Energy Laboratory Co., Ltd. Electroluminescent device having drying agent
US8557324B2 (en) 2000-11-14 2013-10-15 Semiconductor Energy Laboratory Co., Ltd. Light emitting device
US20050224820A1 (en) * 2001-11-09 2005-10-13 Semiconductor Energy Laboratory Co., Ltd. Light emitting apparatus and method for manufacturing the same
US20100201662A1 (en) * 2001-11-09 2010-08-12 Semiconductor Energy Laboratory Co., Ltd. Light emitting apparatus and method for manufacturing the same
US7709846B2 (en) 2001-11-09 2010-05-04 Semiconductor Energy Laboratory Co., Ltd. Light emitting apparatus and method for manufacturing the same
US20060006424A1 (en) * 2001-11-09 2006-01-12 Semiconductor Energy Laboratory Co., Ltd. Light emitting apparatus and method for manufacturing the same
US20090256467A1 (en) * 2001-11-09 2009-10-15 Semiconductor Energy Laboratory Co., Ltd. Light emitting apparatus and method for manufacturing the same
US20110180801A1 (en) * 2001-11-09 2011-07-28 Semiconductor Energy Laboratory Co., Ltd. Light emitting apparatus and method for manufacturing the same
US7442963B2 (en) 2001-11-09 2008-10-28 Semiconductor Energy Laboratory Co., Ltd. Light emitting apparatus and method for manufacturing the same
US7939835B2 (en) 2001-11-09 2011-05-10 Semiconductor Energy Laboratory Co., Ltd. Light emitting apparatus and method for manufacturing the same
US8785949B2 (en) 2001-11-09 2014-07-22 Semiconductor Energy Laboratory Co., Ltd. Light emitting apparatus and method for manufacturing the same
US7432529B2 (en) 2001-11-09 2008-10-07 Semiconductor Energy Laboratory Co., Ltd. Light emitting apparatus and method for manufacturing the same
US8174029B2 (en) 2001-11-09 2012-05-08 Semiconductor Energy Laboratory Co., Ltd. Light emitting apparatus and method for manufacturing the same
US6784875B2 (en) * 2002-01-11 2004-08-31 Symbol Technologies, Inc. Ruggedized, water sealed, security-enhanced touchpad assembly
US20030132917A1 (en) * 2002-01-11 2003-07-17 Yuen Siltex Peter Ruggedized, water sealed, security-enhanced touchpad assembly
US20030173895A1 (en) * 2002-01-31 2003-09-18 Yoshifumi Kato Organic electroluminescent color display unit
US7109649B2 (en) * 2002-01-31 2006-09-19 Kabushiki Kaisha Toyota Jidoshokki Organic electroluminescent color display unit
WO2003096440A3 (en) * 2002-05-07 2004-02-26 Osram Opto Semiconductors Gmbh Organic device
US20030214232A1 (en) * 2002-05-07 2003-11-20 Ewald Guenther Uniform deposition of organic layer
US20030209979A1 (en) * 2002-05-07 2003-11-13 Osram Opto Semiconductors Gmbh Encapsulation for electroluminescent devices
US7148624B2 (en) * 2002-05-07 2006-12-12 Osram Opto Semiconductors (Malaysia) Sdn. Bhd Uniform deposition of organic layer
US7423375B2 (en) * 2002-05-07 2008-09-09 Osram Gmbh Encapsulation for electroluminescent devices
US20040012549A1 (en) * 2002-05-09 2004-01-22 Sanyo Electric Co., Ltd. Electroluminescent display device and manufacturing method of the same
US20040012870A1 (en) * 2002-05-30 2004-01-22 Ryuji Nishikawa Organic EL panel
US7042154B2 (en) * 2002-06-07 2006-05-09 Seiko Epson Corporation Organic electroluminescent device having wiring lines under the partition walls and electronic apparatus using the same
US20040012329A1 (en) * 2002-06-07 2004-01-22 Seiko Epson Corporation Organic electroluminescent device, method of manufacturing organic electroluminescent device, and electronic apparatus
US20030231486A1 (en) * 2002-06-14 2003-12-18 Tseng-Lu Chien Weather proof treatment for electro-luminescent
US7557494B2 (en) 2002-06-21 2009-07-07 Hitachi Displays, Ltd. Display device
US7928639B2 (en) 2002-06-21 2011-04-19 Hitachi Displays, Ltd. Display device
US7425794B2 (en) 2002-06-21 2008-09-16 Hitachi Displays, Ltd. Display device
US20060028146A1 (en) * 2002-06-21 2006-02-09 Hitachi, Ltd. Display device
US7067985B2 (en) * 2002-06-21 2006-06-27 Hitachi Displays, Ltd. Display device
US20110163333A1 (en) * 2002-06-21 2011-07-07 Masaya Adachi Display Device
US8198804B2 (en) 2002-06-21 2012-06-12 Hitachi Displays, Ltd. Display device
US20040051445A1 (en) * 2002-06-21 2004-03-18 Hitachi Displays, Ltd. Display device
US20090072731A1 (en) * 2002-06-21 2009-03-19 Hitachi Displays, Ltd. Display Device
US20080116795A1 (en) * 2002-12-19 2008-05-22 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method of display device
US8179040B2 (en) 2002-12-19 2012-05-15 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method of display device
US20060060954A1 (en) * 2003-04-11 2006-03-23 Georg Meyer-Berg Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components
US7317251B2 (en) * 2003-04-11 2008-01-08 Infineon Technologies, Ag Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components
US20050046349A1 (en) * 2003-08-27 2005-03-03 Atsushi Tanaka OLED display and production method thereof
US7158694B2 (en) 2003-09-04 2007-01-02 Seiko Epson Corporation Electro-optical device, manufacturing method of the same, and electronic apparatus
CN1313989C (en) * 2003-09-04 2007-05-02 精工爱普生株式会社 Electrooptical apparatus and its mfg method, and electronic apparatus
US20050084214A1 (en) * 2003-09-04 2005-04-21 Seiko Epson Corporation Electro-optical device, manufacturing method of the same, and electronic apparatus
US7245797B2 (en) 2003-09-04 2007-07-17 Seiko Epson Corporation Electro-optical device, manufacturing method of the same, and electronic apparatus
US20050058721A1 (en) * 2003-09-12 2005-03-17 Hursey Francis X. Partially hydrated hemostatic agent
US8252344B2 (en) 2003-09-12 2012-08-28 Z-Medica Corporation Partially hydrated hemostatic agent
US20050062174A1 (en) * 2003-09-19 2005-03-24 Osram Opto Semiconductors Gmbh Encapsulated organic electronic device
US7550918B2 (en) * 2003-10-21 2009-06-23 Hitachi Displays, Ltd. Display device
US20050082969A1 (en) * 2003-10-21 2005-04-21 Hitachi Displays, Ltd. Display device
US20090224665A1 (en) * 2003-10-21 2009-09-10 Hitachi Displays , Ltd. Display device
KR100615212B1 (en) 2004-03-08 2006-08-25 삼성에스디아이 주식회사 Flat display device
US20050195355A1 (en) * 2004-03-08 2005-09-08 Won-Kyu Kwak Flat display device
US7474375B2 (en) 2004-03-08 2009-01-06 Samsung Sdi Co., Ltd. Flat display device having a covering film and interconnection line inside a patterned portion completely covered by only one sealant
US20050280360A1 (en) * 2004-06-16 2005-12-22 Lg Electronics Inc. Organic electro-luminescence display device and fabricating method thereof
EP1608032A2 (en) * 2004-06-16 2005-12-21 Lg Electronics Inc. Organic electro-luminescence display device and fabricating method thereof
EP1608032A3 (en) * 2004-06-16 2007-05-16 Lg Electronics Inc. Organic electro-luminescence display device and fabricating method thereof
US20060186413A1 (en) * 2004-10-01 2006-08-24 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method of the same
US8148895B2 (en) * 2004-10-01 2012-04-03 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method of the same
US8357021B2 (en) 2004-10-01 2013-01-22 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method of the same
US9054230B2 (en) 2004-10-01 2015-06-09 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method of the same
US20150280007A1 (en) * 2004-10-01 2015-10-01 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method of the same
US9887294B2 (en) * 2004-10-01 2018-02-06 Semiconductor Energy Laboratory Co., Ltd. Display device and manufacturing method of the same
CN100421252C (en) 2004-12-02 2008-09-24 乐金显示有限公司 Organic electro-luminescence display device and method for fabricating the same
US20100121244A1 (en) * 2005-02-09 2010-05-13 Z-Medica Corporation Devices and methods for the delivery of molecular sieve materials for the formation of blood clots
US8512743B2 (en) 2005-02-09 2013-08-20 Z-Medica, Llc Devices and methods for the delivery of molecular sieve materials for the formation of blood clots
US8257731B2 (en) 2005-02-09 2012-09-04 Z-Medica Corporation Devices and methods for the delivery of molecular sieve materials for the formation of blood clots
US8557278B2 (en) 2005-02-09 2013-10-15 Z-Medica, Llc Devices and methods for the delivery of blood clotting materials to bleeding wounds
US9821084B2 (en) 2005-02-15 2017-11-21 Virginia Commonwealth University Hemostasis of wound having high pressure blood flow using kaolin and bentonite
CN100530675C (en) 2005-05-17 2009-08-19 乐金显示有限公司 The organic electroluminescent device
US8415880B2 (en) 2006-01-20 2013-04-09 Samsung Display Co., Ltd. Organic light-emitting display device with frit seal and reinforcing structure
US9004972B2 (en) 2006-01-20 2015-04-14 Samsung Display Co., Ltd. Organic light-emitting display device with frit seal and reinforcing structure
US20070170839A1 (en) * 2006-01-20 2007-07-26 Choi Dong S Organic light-emitting display device with frit seal and reinforcing structure
US8038495B2 (en) 2006-01-20 2011-10-18 Samsung Mobile Display Co., Ltd. Organic light-emitting display device and manufacturing method of the same
US8120249B2 (en) 2006-01-23 2012-02-21 Samsung Mobile Display Co., Ltd. Organic light emitting display and method of fabricating the same
US20070170846A1 (en) * 2006-01-23 2007-07-26 Choi Dong-Soo Organic light emitting display and method of fabricating the same
US20070170850A1 (en) * 2006-01-23 2007-07-26 Choi Dong-Soo Organic light emitting display and method of fabricating the same
US7834550B2 (en) 2006-01-24 2010-11-16 Samsung Mobile Display Co., Ltd. Organic light emitting display and fabricating method of the same
US20070170423A1 (en) * 2006-01-24 2007-07-26 Choi Dong S Organic light-emitting display and method of making the same
US20070170324A1 (en) * 2006-01-25 2007-07-26 Jae Sun Lee Organic light emitting display and fabricating method of the same
US20070170857A1 (en) * 2006-01-25 2007-07-26 Dong Soo Choi Organic light-emitting display device and method of manufacturing the same
US20070170859A1 (en) * 2006-01-25 2007-07-26 Dong Soo Choi Organic light emitting display and method of fabricating the same
US8164257B2 (en) 2006-01-25 2012-04-24 Samsung Mobile Display Co., Ltd. Organic light emitting display and method of fabricating the same
US8729796B2 (en) 2006-01-25 2014-05-20 Samsung Display Co., Ltd. Organic light emitting display device including a gap to improve image quality and method of fabricating the same
US7944143B2 (en) 2006-01-25 2011-05-17 Samsung Mobile Display Co., Ltd. Organic light-emitting display device with frit seal and reinforcing structure bonded to frame
US7825594B2 (en) 2006-01-25 2010-11-02 Samsung Mobile Display Co., Ltd. Organic light emitting display and fabricating method of the same
US8299705B2 (en) 2006-01-26 2012-10-30 Samsung Display Co., Ltd. Organic light emitting display device and manufacturing method thereof
US8063561B2 (en) 2006-01-26 2011-11-22 Samsung Mobile Display Co., Ltd. Organic light emitting display device
US20070173167A1 (en) * 2006-01-26 2007-07-26 Young Seo Choi Organic light-emitting display device and method of fabricating the same
US20070170845A1 (en) * 2006-01-26 2007-07-26 Dong Soo Choi Organic light emitting display device
US20070177069A1 (en) * 2006-01-27 2007-08-02 Jong Woo Lee Organic light emitting display and fabricating method of the same
US7821197B2 (en) 2006-01-27 2010-10-26 Samsung Mobile Display Co., Ltd. Organic light emitting display and fabricating method of the same
US20070176549A1 (en) * 2006-01-27 2007-08-02 Jin Woo Park Organic light emitting display and method of fabricating the same
US7837530B2 (en) 2006-03-29 2010-11-23 Samsung Mobile Display Co., Ltd. Method of sealing an organic light emitting display by means of a glass frit seal assembly
US8938898B2 (en) 2006-04-27 2015-01-27 Z-Medica, Llc Devices for the identification of medical products
US20070251849A1 (en) * 2006-04-27 2007-11-01 Denny Lo Devices for the identification of medical products
US8784876B2 (en) 2006-05-26 2014-07-22 Z-Medica, Llc Clay-based hemostatic agents and devices for the delivery thereof
US20100228174A1 (en) * 2006-05-26 2010-09-09 Huey Raymond J Clay-based hemostatic agents and devices for the delivery thereof
US9333117B2 (en) 2006-05-26 2016-05-10 Z-Medica, Llc Clay-based hemostatic agents and devices for the delivery thereof
US8343537B2 (en) 2006-05-26 2013-01-01 Z-Medica, Llc Clay-based hemostatic agents and devices for the delivery thereof
US20100233248A1 (en) * 2006-05-26 2010-09-16 Z-Medica Corporation Clay-based hemostatic agents and devices for the delivery thereof
US8383148B2 (en) 2006-05-26 2013-02-26 Z-Medica, Llc Clay-based hemostatic agents and devices for the delivery thereof
US9078782B2 (en) 2006-05-26 2015-07-14 Z-Medica, Llc Hemostatic fibers and strands
US8460699B2 (en) 2006-05-26 2013-06-11 Z-Medica, Llc Clay-based hemostatic agents and devices for the delivery thereof
US9867898B2 (en) 2006-05-26 2018-01-16 Z-Medica, Llc Clay-based hemostatic agents
US8114433B2 (en) 2006-05-26 2012-02-14 Z-Medica Corporation Clay-based hemostatic agents and devices for the delivery thereof
US8846076B2 (en) 2006-05-26 2014-09-30 Z-Medica, Llc Hemostatic sponge
US8257732B2 (en) 2006-05-26 2012-09-04 Z-Medica Corporation Clay-based hemostatic agents and devices for the delivery thereof
US8202532B2 (en) 2006-05-26 2012-06-19 Z-Medica Corporation Clay-based hemostatic agents and devices for the delivery thereof
US20080211393A1 (en) * 2007-02-02 2008-09-04 Hiroyuki Yaegashi Light emitting apparatus
US20080317831A1 (en) * 2007-06-21 2008-12-25 Denny Lo Hemostatic sponge and method of making the same
US20090039760A1 (en) * 2007-08-08 2009-02-12 Kwon Oh-June Light emitting display device and method of fabricating the same
EP2023421A3 (en) * 2007-08-08 2011-09-07 Samsung Mobile Display Co., Ltd. Light emitting display device and method of fabricating the same
US8016632B2 (en) 2007-08-08 2011-09-13 Samsung Mobile Display Co., Ltd. Light emitting display device and method of fabricating the same
EP2023421A2 (en) * 2007-08-08 2009-02-11 Samsung SDI Co., Ltd. Light emitting display device and method of fabricating the same
US20090162406A1 (en) * 2007-09-05 2009-06-25 Z-Medica Corporation Wound healing with zeolite-based hemostatic devices
US20090091005A1 (en) * 2007-10-09 2009-04-09 Huang Chung-Er Shielding structure for semiconductors and manufacturing method therefor
US20100102302A1 (en) * 2008-10-24 2010-04-29 Hitachi Displays, Ltd. Organic electroluminescence device
US8097886B2 (en) * 2008-10-24 2012-01-17 Hitachi Displays, Ltd. Organic electroluminescence device
US8513884B2 (en) * 2010-02-02 2013-08-20 Samsung Display Co., Ltd. Flat panel display apparatus and organic light-emitting display apparatus
US20110187629A1 (en) * 2010-02-02 2011-08-04 Samsung Mobile Display Co., Ltd. Flat panel display apparatus and organic light-emitting display apparatus
US9889154B2 (en) 2010-09-22 2018-02-13 Z-Medica, Llc Hemostatic compositions, devices, and methods
US8858969B2 (en) 2010-09-22 2014-10-14 Z-Medica, Llc Hemostatic compositions, devices, and methods
US9603964B2 (en) 2012-06-22 2017-03-28 Z-Medica, Llc Hemostatic devices
US9072806B2 (en) 2012-06-22 2015-07-07 Z-Medica, Llc Hemostatic devices
US9352066B2 (en) 2012-06-22 2016-05-31 Z-Medica, Llc Hemostatic devices
US20170054104A1 (en) * 2015-08-19 2017-02-23 Samsung Display Co., Ltd. Display device and method of manufacturing the same

Also Published As

Publication number Publication date Type
KR20030079876A (en) 2003-10-10 application
JP2001102166A (en) 2001-04-13 application
KR100407445B1 (en) 2003-11-28 grant
KR20010050683A (en) 2001-06-15 application
JP3423261B2 (en) 2003-07-07 grant
KR100512510B1 (en) 2005-09-06 grant

Similar Documents

Publication Publication Date Title
US5920080A (en) Emissive display using organic light emitting diodes
US6492778B1 (en) Electroluminescence display device
US6690110B1 (en) Line structure in electroluminescence display device
US20040004434A1 (en) Light emitting device and method of manufacturing the same
US20030076046A1 (en) Emissive display device and electroluminescence display device with uniform luminance
US20070080918A1 (en) Display device
US20070170849A1 (en) Organic light emitting display device and method of fabricating the same
US20120061718A1 (en) Electronic Device
US20070170423A1 (en) Organic light-emitting display and method of making the same
US20080143247A1 (en) Organic light emitting display device and method for fabricating the same
US20040137142A1 (en) Method for manufacturing organic electroluminescence panel
US6867541B2 (en) Line structure in electroluminescence display device
US20070170859A1 (en) Organic light emitting display and method of fabricating the same
US20070170861A1 (en) Organic light-emitting display device and manufacturing method of the same
US20070170324A1 (en) Organic light emitting display and fabricating method of the same
US7193366B2 (en) Display apparatus and method of manufacturing the same
US6628086B2 (en) Light emitting body, light emitting element and light emitting display device using same
US6958740B1 (en) Electroluminescence display device
US20040075380A1 (en) Display device
US20060220544A1 (en) Light emitting device, method of manufacturing the same, and electronic apparatus
US20070170850A1 (en) Organic light emitting display and method of fabricating the same
US6522079B1 (en) Electroluminescence display device
US7663311B2 (en) Organic light emitting display (OLED) device and method of fabricating the same
US7019458B2 (en) Electroluminescent display device
US20080239637A1 (en) Display device and method of manufacturing the same

Legal Events

Date Code Title Description
AS Assignment

Owner name: SANYO ELECTRIC CO., LTD., JAPAN

Free format text: ASSIGNMENT OF ASSIGNORS INTEREST;ASSIGNORS:NISHIKAWA, RYUJI;YAMADA, TSUTOMU;REEL/FRAME:011470/0463

Effective date: 20001023

FPAY Fee payment

Year of fee payment: 4

FPAY Fee payment

Year of fee payment: 8

FPAY Fee payment

Year of fee payment: 12