KR100592390B1 - Organic electroluminescent display and manufacturing method - Google Patents

Abstract

The present invention relates to an organic electroluminescent display device and a method of manufacturing the same, which can prevent image degradation caused by abnormal light emission.

An organic light emitting display device according to the present invention comprises: an organic light emitting array formed in a display area of a substrate; A first pad formed in a non-display area of the substrate and configured to supply a first driving signal to the organic light emitting array; Second pads for supplying a second driving signal to the organic light emitting array and positioned on both sides of the first pad; A first signal line formed on the non-display area of the substrate and supplying the first driving signal from the first pad to the organic light emitting array; A second signal line for bypassing the organic light emitting array and supplying the second driving signal from the second pad to the organic light emitting array, wherein the first and second signals are provided in the non-display area. A first insulating film formed to cover the line; And a second insulating film formed on the entire surface of the first insulating film.

Description

Organic electroluminescent display device and manufacturing method thereof {Organic Electro Luminescence Display Device And Fabricating Method Thereof}             

1 is a plan view illustrating a portion of a conventional organic light emitting display device.

FIG. 2 is a cross-sectional view illustrating an organic light emitting display taken along the line “I-I” in FIG. 1.

3A through 3E are cross-sectional views illustrating a method of manufacturing the organic light emitting display device illustrated in FIG. 2.

4 and 5 are diagrams for explaining that the second line and the metal layer are connected by forming holes in the insulating layer positioned in the non-display area.

6 is a plan view illustrating an organic light emitting display device according to a first embodiment of the present invention.

FIG. 7 is a cross-sectional view illustrating an organic light emitting display device taken along the line II-II ′ of FIG. 6.

8A through 8F are plan views illustrating a method of manufacturing the organic light emitting display device illustrated in FIG. 7.

9 and 10 are plan views and cross-sectional views illustrating an organic light emitting display device according to a second embodiment of the present invention.

<Explanation of symbols for the main parts of the drawings>

2,102 substrate 4,104 anode electrode

6: insulating film 8,108: partition wall

10,110: organic light emitting layer 12,112: cathode electrode

35,135: hole 106: first insulating film

107: Second insulating film 109: Second partition wall

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to an organic electroluminescent display, and more particularly, to an organic electroluminescent display and a method for manufacturing the same, which can prevent deterioration of image quality caused by abnormal light emission.

Recently, various flat panel displays have been developed to reduce weight and volume, which are disadvantages of cathode ray tubes. Flat display devices include Liquid Crystal Display (LCD), Field Emission Display (FED), Plasma Display Panel (PDP) and Electro-luminescence (EL). Display elements; PDPs are most advantageous for large screens due to their relatively simple structure and manufacturing process, but they have low luminous efficiency, low luminance, and high power consumption. Because LCD uses semiconductor process, large screen is difficult and power consumption is high due to backlight unit. In addition, LCD has a disadvantage of high light loss and a narrow viewing angle due to optical elements such as a polarizing filter, a prism sheet, and a diffusion plate. In contrast, EL display devices are classified into inorganic ELs and organic ELs, and have advantages of fast response speed and high luminous efficiency, brightness, and viewing angle. The organic EL display element can display an image with a high luminance of tens of thousands [cd / m 2] at a voltage of about 10 [V].

1 is a plan view illustrating a conventional organic EL display device, and FIG. 2 is a cross-sectional view illustrating an organic EL display device taken along a line "I-I '" in FIG.

The conventional organic EL display device shown in FIGS. 1 and 2 has a ratio in which a display area P1 in which an organic EL array is formed and a pad portion 25 for supplying driving signals to driving electrodes in the display area P1 are formed. The display area P2 is provided.

In the organic EL array formed in the display area P1, an anode electrode 4 formed on the substrate 2 and a cathode electrode 12 formed in a direction crossing the anode electrode 4 are formed.

A plurality of anode electrodes 4 are spaced apart at predetermined intervals on the substrate 2. On the substrate 2 on which the anode electrode 4 is formed, an insulating film 6 having an opening for each EL cell EL region is formed. On the insulating film 6, a partition 8 for separating the organic light emitting layer 10 and the cathode electrode 12 to be formed thereon is positioned. The partition wall 8 is formed in a direction crossing the anode electrode 4 and has an overhang structure in which the upper end portion has a wider width than the lower end portion. The organic light emitting layer 10 made of an organic compound is formed on the insulating film 6 on which the partition 8 is formed, and the cathode electrode 12 is entirely deposited on the substrate 2 on which the organic light emitting layer 10 is formed. The organic light emitting layer 10 is formed by stacking a hole transporting layer, a light emitting layer, and an electron transporting layer on the insulating film 6.

The non-display area P2 includes a first line 54 extending from the anode electrode 4 of the display area P1 and a data pad for supplying a data voltage to the anode electrode 4 through the first line 54. 22 are formed, and a second line 52 connected to the cathode electrode 12 and a scan pad 20 for supplying a scan voltage through the second line 52 are provided. Here, the second line 52 is composed of a double layer of the transparent conductive layer 52a and the opaque conductive layer 52b. An insulating film 6 extending from the display area P1 is formed to cover the first and second lines 54 and 52 in the area except the pad part 25 of the non-display area P2. The insulating film 6 is formed to partially expose the second line 52 in the boundary area between the display area P1 and the non-display area P1, so that the cathode electrode 12 and the second line on the display area P1 are exposed. (152) is contacted. On the insulating film 6, the partition 8 extending in the display area P1 is formed to cross the second line 52. The partition 8 located in the non-display area P2 serves to electrically separate the metal layer 12a of the non-display area P2.

The data pad 22 is connected to a TCP in which a first driving circuit for generating a data voltage is mounted to supply a data voltage to each anode electrode 4. The scan pads 20 are formed on both sides of the data pads 22. The scan pad 22 is connected to the TCP in which the second driving circuit which generates the scan voltage is connected to supply the scan voltage to each cathode line 12.

In the organic EL display device, when the first driving signal is applied to the anode electrode 4 through the data pad 22 and the second driving signal is applied to the cathode electrode 12 through the scan pad 20, electrons and Holes are emitted, and electrons and holes emitted from the anode electrode 4 and the cathode electrode 12 generate visible light while recombining in the organic light emitting layer 10. At this time, the generated visible light comes out through the anode electrode 4 to display a predetermined image or image.

3A through 3E are cross-sectional views illustrating a method of manufacturing the organic light emitting display device illustrated in FIG. 2.

First, a transparent conductive material is deposited on a substrate 2 formed using soda lime or hardened glass, and then patterned by a photolithography process and an etching process. Accordingly, the anode electrode 4 is formed as shown in FIG. 3A, and the transparent electrode 52a of the non-display area P2 is formed. In this case, indium tin oxide or SnO 2 may be used as the transparent conductive material. On the other hand, in the non-display area P2, in order to increase the conductivity of the transparent electrode 52a, the second line 52 is formed by further forming an opaque conductive layer 52b having high conductivity on the transparent electrode 52a.

The photosensitive insulating material is coated on the substrate 2 on which the anode electrode 4 and the second line 52 are formed by spin-coating and then patterned by a photolithography process. As a result, as shown in FIG. 3B, an insulating layer 6 exposing the light emitting area of the display area P1, the pad part 25 of the non-display area P2, and the second line 52 is partially formed. Here, the second line 52 partially exposed through the insulating film 6 of the non-display area P2 is connected to the cathode electrode 12 of the display area P1 to be formed later.

The photosensitive organic material is deposited on the substrate 2 on which the insulating film 6 is formed and then patterned by a photolithography process. As a result, the partition 8 is formed as shown in FIG. 3C. The partition 8 is formed in the non-light emitting area and the non-display area P2 of the display area P1 so as to intersect the plurality of anode electrodes 4 so as to distinguish the pixels.

As the organic light emitting material is deposited on the display area P1 of the substrate 2 having the partition 8 formed thereon, the organic light emitting layer 10 is formed as shown in FIG. 3D. Here, the organic light emitting layer 10 may be formed in a light emitting area partitioned by the insulating layer 106 of the display area P1 using a shadow mask, or may be formed in a region divided by the partition wall 8.

A metal material, for example, aluminum (Al), is deposited on the substrate 2 on which the organic light emitting layer 10 is formed, so that the cathode electrode 12 is formed in the display area P1 as shown in FIG. 3E. do. The cathode electrode 12 is connected to the partially exposed second line 52 through the insulating film 6 of the non-display area P2.

Meanwhile, in the organic light emitting display device as described above, when the insulating film 6 is formed, holes 35 are formed in the insulating film 6 formed on the second line 52 as shown in FIGS. 4 and 5 during the spin coating process. ) Occurs frequently. That is, the minute hole 35 is generated in the insulating film 6 by the chemical liquid or the bubble generated during the rotation of the substrate during the spin coating process. As such, when the minute hole 35 is generated, the metal layer 12a formed entirely in the non-display area P2 and the second line 52 positioned below the insulating layer 6 are connected to each other (or short-circuited) through the hole 35. Short)} happen. As a result, the second line 52 of the non-display area P2 is electrically connected to the unspecified cathode electrode 12 of the display area P1 via the metal layer 12a formed thereon, thereby causing abnormality in an undesired area. Light emission will occur. As a result, the image quality of the organic light emitting display device is degraded.

Accordingly, an object of the present invention is to provide an electroluminescent display device and a method of manufacturing the same, which can prevent deterioration of image quality caused by abnormal light emission.

In order to achieve the above objects, the organic electroluminescent display device according to the present invention comprises an organic electroluminescent array formed in the display area of the substrate; A first pad formed in a non-display area of the substrate and configured to supply a first driving signal to the organic light emitting array; Second pads for supplying a second driving signal to the organic light emitting array and positioned on both sides of the first pad; A first signal line formed on the non-display area of the substrate and supplying the first driving signal from the first pad to the organic light emitting array; A second signal line for bypassing the organic light emitting array and supplying the second driving signal from the second pad to the organic light emitting array, wherein the first and second signals are provided in the non-display area. A first insulating film formed to cover the line; And a second insulating film formed on the entire surface of the first insulating film.
The second insulating film is characterized in that the same material as the first insulating film.
The organic light emitting array includes first and second electrodes formed to cross each other with an organic light emitting layer interposed therebetween; A partition wall parallel to the second electrode is provided.
The second insulating film is characterized in that the same material as the partition wall.
The second insulating film is characterized in that it has a thickness of about 3 ~ 5㎛.
A method of manufacturing an organic light emitting display device according to the present invention includes forming a display area in which an organic light emitting array is formed and supply pads and signal lines positioned in a non-display area except for the organic light emitting array. In the method of manufacturing a light emitting display device, forming the supply pads and the signal lines in the non-display area may include a first pad for supplying a first driving signal to the organic light emitting array and a second to the organic light emitting array. Supplying a driving signal and forming second pads respectively positioned on both sides of the first pad; Forming a first signal line for supplying the first driving signal from the first pad to the organic light emitting array; Bypassing the organic light emitting array and forming a second signal line for supplying the second driving signal from the second pad to the organic light emitting array; Forming a first insulating layer on the non-display area to cover the first and second signal lines; Forming a second insulating film on the entire surface of the first insulating film.

delete

delete

delete

delete

delete

The second insulating layer may be formed of the same material as the first insulating layer.

The forming of the organic light emitting array may include forming a first electrode on the substrate; Forming a partition wall to intersect the first electrode; Forming an organic light emitting layer on the first electrode; And forming a second electrode to cross the first electrode with the organic light emitting layer interposed therebetween.

The second insulating layer is formed of the same material as the partition wall.

And forming a metal layer formed on the second insulating film, wherein the second insulating film electrically separates any one of the first and second electrodes from the metal layer.

Other objects and features of the present invention in addition to the above object will be apparent from the description of the embodiments with reference to the accompanying drawings.

Hereinafter, exemplary embodiments of the present invention will be described with reference to FIGS. 6 to 10.

6 is a plan view illustrating an organic light emitting display device according to a first embodiment of the present invention, and FIG. 7 is a cross-sectional view taken along line II-II ′ of the organic light emitting display device of FIG. 6.

6 and 7 show a display area P1 in which an organic EL array is formed and a non-display in which a pad portion 25 and the like are provided to supply driving signals to driving electrodes in the display area P1. The area P2 is provided.

In the organic EL array formed in the display area P1, an anode electrode 104 formed on the substrate 102 and a cathode electrode 112 formed in a direction crossing the anode electrode 104 are formed.

A plurality of anode electrodes 104 are formed on the substrate 102 spaced apart from each other at predetermined intervals. On the substrate 102 on which the anode electrode 104 is formed, a first insulating film 106 having an opening for each EL cell EL region is formed. The partition 108 is disposed on the first insulating layer 106 to separate the organic light emitting layer 110 and the cathode electrode 112 to be formed thereon. The partition 108 is formed in a direction crossing the anode electrode 104 and has an overhang structure in which the upper end portion has a wider width than the lower end portion. An organic light emitting layer 110 made of an organic compound is formed on the first insulating layer 106 on which the partition 108 is formed, and the cathode electrode 112 is entirely deposited on the substrate 102 on which the organic light emitting layer 110 is formed. The organic light emitting layer 110 is formed by stacking a hole transporting layer, a light emitting layer, and an electron transporting layer on the insulating film 106.

The non-display area P2 includes a first line 154 extending from the anode electrode 104 of the display area P1, and a data pad for supplying a data voltage to the anode electrode 104 through the first line 154. 122 are formed, and a second line 152 connected to the cathode electrode 112 and a scan pad 120 supplying a scan voltage through the second line 152 are provided. Here, the second line 152 is composed of a double layer of the transparent conductive layer 152a and the opaque conductive layer 152b.

In the regions other than the pad portion 125 of the non-display area P2, the first insulating layer 106 formed to extend from the display area P1 and cover the first and second lines 154 and 152 and the non-display area ( A second insulating film 107 overlapping with the first insulating film 106 located at P2 is formed.

The second insulating layer 107 is positioned between the first insulating layer 106 and the metal layer 112a even though the hole 35 is formed in the first insulating layer 106, so that the second line 52 and the metal layer 112a are formed. It serves to prevent conduction. That is, the second insulating film 107 serves to cover the holes of the first insulating film 106.

The first and second insulating layers 106 and 107 are formed to partially expose the second line 152 in the boundary area between the display area P1 and the non-display area P1 to form the cathode electrode 112 on the display area P1. And the second line 152 are in contact.

On the second insulating layer 107, the partition 108 extending in the display area P1 is formed to cross the second line 152. Here, the partition 108 serves to electrically separate the metal layer 112a formed on the non-display area P1.

The data pad 122 is connected to a TCP in which a first driving circuit for generating a data voltage is mounted to supply a data voltage to each anode electrode 104. The scan pads 120 are formed at both sides of the data pad 122. The scan pad 122 is connected to a TCP in which a second driving circuit for generating a scan voltage is mounted to supply a scan voltage to each cathode line 112.

As described above, in the organic light emitting display according to the first exemplary embodiment, the second insulating layer 107 is formed between the first insulating layer 106 and the metal layer 112a on the non-display area P2.

Accordingly, even when the hole 135 is formed when the first insulating film 106 is formed by the spin coating method, the second insulating film 107 is positioned between the first insulating film 106 and the metal layer 112a so that the second line 152 is formed. ) And the metal layer 112a can be prevented.

8A through 8F are cross-sectional views illustrating a method of manufacturing the organic light emitting display device illustrated in FIG. 7.

First, a transparent conductive material is deposited on a substrate 102 formed using soda lime or hardened glass, and then patterned by a photolithography process and an etching process. Accordingly, as shown in FIG. 8A, the anode electrode 104 is formed, and the transparent electrode 152a of the non-display area P2 is formed. In this case, indium tin oxide or SnO 2 may be used as the transparent conductive material. Meanwhile, in order to increase the conductivity of the transparent electrode 152a, a non-transparent opaque metal layer 152b is further formed on the transparent electrode 152a to form the second line 152 in the non-display area P2.

The photosensitive insulating material is coated on the substrate 102 on which the anode electrode 104 and the second line 152 are formed by spin-coating and then patterned by a photolithography process. Accordingly, as illustrated in FIG. 8B, a first insulating layer 106 is formed to partially expose the light emitting area of the display area P1, the pad part 125 of the non-display area P2, and the second line 152. do.

The photosensitive insulating material is coated on the substrate 102 on which the first insulating layer 106 is formed by spin-coating and then patterned by a photolithography process. Accordingly, as illustrated in FIG. 8C, a second insulating film 107 overlapping the first insulating film 106 on the non-display area P2 is formed. The first and second insulating layers 106 and 107 partially expose the light emitting area of the display area P1, the pad portion 125 of the non-display area P2, and the second line 152.

The second line 152 partially exposed through the first and second insulating layers 106 and 107 of the non-display area P2 is connected to the cathode electrode 112 of the display area P1 to be formed later.

The photosensitive organic material is deposited on the substrate 102 on which the first and second insulating layers 106 and 107 are formed and then patterned by a photolithography process. Accordingly, the partition 108 is formed as shown in FIG. 8D. The partition 108 is formed in the non-light emitting area of the display area P1 so as to intersect the plurality of anode electrodes 104 so as to distinguish the pixels, and extends in the display area P1 and is formed in the non-display area P2. .

As the organic light emitting material is deposited on the display area P1 of the substrate 102 on which the partition 108 is formed, the organic light emitting layer 110 is formed as shown in FIG. 8E. The organic light emitting layer 110 may be formed in a light emitting region partitioned by the first insulating layer 106 of the display area P1 using a shadow mask or in a region divided by the partition 108.

A metal material, for example, aluminum (Al), is deposited on the substrate 102 on which the organic light emitting layer 110 is formed, so that the cathode electrode 112 is formed in the display area P1 as shown in FIG. 8F. The metal layer 112a is formed in the non-display area P2. The cathode electrode 112 is connected to the partially exposed second line 152 through the first and second insulating layers 106 and 107 of the non-display area P2. The metal layer 112a is electrically separated by the partition 108 located below it.

As described above, in the organic light emitting display device and the manufacturing method thereof according to the first embodiment of the present invention, the second insulating film 107 is formed between the first insulating film 106 and the metal layer 112a on the non-display area P2. do. Accordingly, even when the hole 135 is generated due to chemicals or bubbles generated during the rotation of the substrate during the spin coating process when the first insulating film 106 is formed by the spin coating method, the hole 135 is formed between the first insulating film 106 and the metal layer 112a. Since the second insulating film 107 is positioned, abnormal light emission due to the conduction of the second line 152 and the metal layer 112a can be prevented. This makes it possible to prevent the deterioration of the image quality of the organic EL element.

9 is a plan view illustrating an organic light emitting display device according to a second exemplary embodiment of the present invention, and FIG. 10 is a cross-sectional view taken along line II-II ′ of the organic light emitting display device of FIG. 9.

9 and 10, the second barrier rib is formed on the first insulating layer 106 without forming the second insulating layer 107 of the non-display area P2 as compared with FIGS. 6 and 7. Except for forming the entire surface 109 having the same components, the same components as those of FIGS. 6 and 7 will be denoted by the same reference numerals and detailed description thereof will be omitted. In addition, in the second embodiment of the present invention, the second insulating film 106 according to the first embodiment may be further formed between the first insulating film 106 and the second partition wall 109.

The second partition wall 109 is entirely formed on the first insulating film 106 of the organic EL display device non-display area P2 shown in FIGS. 9 and 10. The second partition wall 109 is formed between the first insulating film 106 and the metal layer 112a on the non-display area P2, so that the second line 152 may be formed even when the hole 135 is formed in the first insulating film 106. ) And the metal layer 112a are prevented from being conducted. As a result, it is possible to prevent deterioration in image quality due to abnormal light emission of the organic EL display device.

 Meanwhile, the second partition 109 according to the present invention separates the cathode electrodes 112 deposited on the display area P1 and the metal layer 112a deposited on the second partition 109. That is, the second partition 109 having a height d of about 3 to 5 μm is formed on the entire surface of the non-display area P2, so that a high step is generated between the display area P1 and the non-display area P1. Accordingly, although the cathode electrode material is deposited on the entirety of the substrate 102, the cathode electrode material deposited on the entirety of the substrate 102 due to the step d generated by the second partition wall 109 is the cathode of the display area P1. The metal layer 112a is separated from the electrode 112 and the non-display area P1. As a result, conduction between the second line 152 and the metal layer 112a is not only prevented, and even when the second line 152 and the metal layer 112a are electrically connected, the metal layer 112a and the cathode electrode 112 are electrically separated from each other. Image quality degradation due to abnormal bladder is prevented.

As described above, in the organic electroluminescent display according to the second exemplary embodiment, the second partition 109 is formed between the first insulating layer 106 and the metal layer 112a of the non-display area P2. Accordingly, even when the hole 135 is formed in the first insulating layer 106, the second barrier rib 109 is positioned between the first insulating layer 135 and the metal layer 112a, so that the second insulating layer 106 is positioned below the first insulating layer 106. It is possible to prevent conduction between the two lines 152 and the cathode electrode 112. In addition, the second partition 109 may separate the cathode electrode 112 of the display area P1 and the metal layer 112a of the non-display area P2 due to the high level difference. As a result, abnormal emission of the organic EL display device can be prevented.

In the method of manufacturing the organic EL display device according to the second embodiment of the present invention, forming the second partition wall 109 on the non-display area P2 instead of the second insulating film 107 as compared with FIGS. 8A to 8F. Except for the above, it is formed by the same method as in FIGS. 8A to 8F.

In the method of manufacturing the organic EL display device according to the second exemplary embodiment of the present invention, a photosensitive organic material is deposited on a substrate 102 on which the first insulating film 106 is formed, as shown in FIG. 8B. By patterning. Accordingly, the partition 108 of the display area P1 is formed and the second partition 109 is formed in the non-display area P2. After the organic light emitting layer 110 is formed on the substrate 102 on which the first and second barrier ribs 108 and 109 are formed, the cathode electrode material is formed on the entire surface, thereby forming the cathode electrode 112 as shown in FIG. 10. Here, the cathode electrode material is separated into the cathode electrode 112 of the display area P1 and the metal layer 112a of the non-display area P2 by the second partition 109.

As described above, the organic light emitting display device and the method of manufacturing the same according to the present invention may include the second insulating film 107 and the second partition wall 109 between the first insulating film 106 and the metal layer 112a of the non-display area P2. At least one is formed. The second insulating film 107 and the second partition wall 109 are formed between the first insulating film 106 and the metal layer 112a even though holes 135 are formed in the first insulating film 106. It is possible to prevent conduction between the second line 152 and the cathode electrode 112 positioned below.

As a result, it is possible to prevent deterioration in image quality due to abnormal light emission of the organic EL display device.

As described above, in the organic electroluminescent display and the method of manufacturing the same according to the present invention, at least one of the second insulating film and the second partition wall is formed between the first insulating film and the metal layer in the non-display area. At least one of the second insulating film and the second partition wall may prevent conduction between the signal line of the non-display area and the cathode electrode of the display area by separating the first insulating film and the metal layer. As a result, it is possible to prevent deterioration in image quality due to abnormal light emission of the organic EL display element.

Those skilled in the art will appreciate that various changes and modifications can be made without departing from the technical spirit of the present invention. Therefore, the technical scope of the present invention should not be limited to the contents described in the detailed description of the specification but should be defined by the claims.

Claims (10)

An organic light emitting array formed in the display area of the substrate; A first pad formed in a non-display area of the substrate and configured to supply a first driving signal to the organic light emitting array; Second pads for supplying a second driving signal to the organic light emitting array and positioned on both sides of the first pad; A first signal line formed on the non-display area of the substrate and supplying the first driving signal from the first pad to the organic light emitting array; A second signal line for bypassing the organic light emitting array and for supplying the second driving signal from the second pad to the organic light emitting array, A first insulating layer formed on the non-display area to cover the first and second signal lines; And a second insulating film formed on an entire surface of the first insulating film. The method of claim 1, And the second insulating film is made of the same material as the first insulating film. The method of claim 1, The organic electroluminescent array is First and second electrodes formed to cross each other with an organic light emitting layer interposed therebetween; And a partition wall parallel to the second electrode. The method of claim 3, wherein And the second insulating layer is made of the same material as the barrier rib. The method of claim 1, The second insulating film has a thickness of about 3 ~ 5㎛ organic light emitting display device. A method of manufacturing an organic light emitting display device, comprising: forming a display area in which an organic light emitting array is formed and a supply pad and signal lines positioned in a non-display area except for the organic light emitting array; Forming supply pads and signal lines in the non-display area Forming a first pad for supplying a first driving signal to the organic light emitting array and a second pad for supplying a second driving signal to the organic light emitting array and positioned on both sides of the first pad; Forming a first signal line for supplying the first driving signal from the first pad to the organic light emitting array; Bypassing the organic light emitting array and forming a second signal line for supplying the second driving signal from the second pad to the organic light emitting array; Forming a first insulating layer on the non-display area to cover the first and second signal lines; And forming a second insulating film on the entire surface of the first insulating film. The method of claim 6, And the second insulating film is formed of the same material as the first insulating film. The method of claim 6, Forming the organic electroluminescent array is Forming a first electrode on the substrate; Forming a partition wall to intersect the first electrode; Forming an organic light emitting layer on the first electrode; And forming a second electrode to cross the first electrode with the organic light emitting layer interposed therebetween. The method of claim 8, And the second insulating layer is formed of the same material as that of the barrier rib. The method of claim 8, Forming a metal layer formed on the second insulating film; And the second insulating layer electrically separates any one of the first and second electrodes from the metal layer.

Images