KR100562964B1 - Combi card and method for making the same - Google Patents

Abstract

The present invention relates to a combination card that can be used in contact or contactless, more specifically, the conductive convex contact 68 made of lead, lead alloy, solder paste or conductive adhesive, etc. to the COB pad 64 And an insertion groove 106 corresponding to the convex contact is formed in the antenna terminal 32 of the card main body 100. The present invention provides a convex contact inserted into the insertion groove when the chip module is attached to the card main body. As the adhesion is made in a state, the durability is improved to not only have excellent adhesion between the card body and the chip module, but also maintain the excellent electrical conductivity even when various deformations such as bending, torsion or change of physical properties of the adhesive material occur. have.

Card Body, Insertion Groove, Chip Module, COB Pad, Convex Contact

Description

Combi card and method for making the same

1 is a process chart showing a conventional combination card manufacturing process,

2 is a plan view schematically showing another example of a conventional combination card,

Figure 3 is a cross-sectional view showing the groove and chip module formed separately in the card body to explain another example of the conventional combination card,

4 is a cross-sectional view illustrating a method of bonding a chip module to a recess of a card body in another example of a conventional combination card;

5 is a plan view showing a combination card according to the present invention,

Figure 6 is a cross-sectional view showing the recessed portion formed in the card body and the chip module in the present invention,

Figure 7 is a cross-sectional view illustrating a method for bonding the chip module to the groove portion of the card body in the present invention.

◎ Explanation of symbols for main part of drawing

3: thermocompression head 5: cooling head

10: lower protective layer 20: lower printed layer

30: antenna coil insertion layer 32: antenna coil

34: contact 36: antenna terminal

40: upper printed layer 50: upper protective layer

60: chip module 62: IC chip

64: COB pad 66: metallic terminal

68: conductive convex contact 100: card body

102: groove portion 104: conductive adhesive

106: insertion groove

The present invention relates to a combination card that can be used in contact or non-contact type, and more particularly, to form a conductive convex contact on the COB pad and the corresponding insertion groove in the metal terminal portion of the card body to form a corresponding COB pad and metallic terminal It's about a combi card that lets you connect more seamlessly.

A typical card is a contact IC card (integrated circuit card) that transmits and receives data through the contact exposed to the surface, and a contactless card is an RF card (radio frequency non) that transmits and receives data wirelessly using an internal antenna coil. -contact card).

Of course, at present, a combination card that can be used in both wired and wireless devices and has high compatibility has been widely used, and a combination card that can be used as a contact and a contactless type is widely used. Both antenna coils are provided.

In general, the Combi card is a lower protective layer, a lower printed layer, the antenna coil insertion layer, the upper printed layer and the upper protective layer of the card made of a synthetic resin sheet of PVC, PC, PETG, etc. sequentially from the bottom to the top It has a laminated structure.

1 shows a manufacturing process of a conventional combination card.

Referring to the conventional combination card manufacturing method with reference to this, first, the antenna coil 32 is wound around the edge of the antenna coil insertion layer 30, a portion of the contact 34 is formed to be connected to the antenna coil.

Then, each card lower protective layer 10, the lower printed layer 20, the antenna coil insertion layer 30, the upper printed layer 40 and the card upper protective layer 50 are sequentially stacked, and then one Press to form a thin film layer of the card body 100 is configured.

Then, the recess 102 is formed by cutting the recess 102 in the portion where the contact 34 of the antenna coil 32 is positioned in the card body 100, and the contact of the antenna coil 32 exposed into the recess 102 is formed. After applying the viscous conductive adhesive 104 to the 34, the rectangular chip module 60 on which the IC chip and the IC terminal are mounted is inserted into the recess 102.

Then, heat and pressure are applied to the chip module 60 and the contact 34 of the antenna coil 32 and the COB pad of the chip module 60 are electrically connected by curing the conductive adhesive 104 accordingly. If you do, one combi card is completed.

However, in the case of the combination card manufactured in this way, when the bending or torsion is applied, the elongation and elastic modulus of the card material is cracked at the adhesive part of the conductive adhesive due to the physical property difference with the conductive adhesive. There was a problem that a defective contact occurs between.

Thus, in order to overcome the above problem, FIGS. 2 to 4 show another example of the conventional method according to bonding the chip module to the card body.

First, this will be described with reference to FIGS. 2 and 3, and a recess 102 in which the chip module 60 is inserted is formed in a portion of the card body 100.

An antenna coil 32 is formed around the antenna coil insertion layer constituting the card body 100, and an antenna terminal 36 is provided at a contact 34 of the antenna coil 32 exposed to the recess 102. Attachment is formed.

On the other hand, the chip module 60 inserted into the recess 102 is composed of a COB pad (Chip On Board Pad) 64, the IC chip 62 is mounted, the antenna terminal 36 on the COB pad 64 The metallic terminal 66 corresponding to the attachment is formed.

The antenna terminal and the metallic terminal are configured to be bonded using the conductive adhesive 104.

Here, the conductive adhesive 104 is formed by incorporating a steel plate plated with gold or silver into the adhesive, which is formed between the antenna terminal 36 of the antenna coil 32 and the metallic terminal 66 of the chip module 60. So that both sides are glued and energized at the same time.

Of course, instead of the conductive adhesive, it may be bonded using a conductive thermal adhesive tape.

In addition, the antenna coil 32 and the antenna terminal 36 may be formed by corrosion on a copper plate formed of a card material.

Referring to FIG. 4, the chip module 60 is inserted into and adhered to the recess 102 of the card body 100 by the above configuration, and the recess 102 of the card body 100 is described. After applying the conductive adhesive 104 to the antenna terminal 36 of the antenna coil 32 exposed to the chip module 60 is inserted into the recess.

At this time, the antenna terminal 36 and the metallic terminal 66 are positioned to correspond to each other.

Then, the chip module 60 is pressurized through the thermocompression head 3 to apply heat and pressure, and then cured while pressing through the cooling head 5.

However, since the conductive adhesive 104 or the conductive thermal adhesive tape used therein is a steel material that is a conductive material is irregularly arranged, in order to prevent contact failure due to the point contact, the antenna terminal 36 of the antenna coil 32 is provided. A contact area of at least 2 mm2 should be secured. However, for this purpose, if a separate antenna terminal 36 on the antenna coil 32 is soldered with a conductive adhesive member or both the antenna coil and the antenna terminal pattern are formed by corrosion on a copper plate formed of a card material, contact failure occurs. There was a problem that the production cost is increased.

In order to solve the above problems, Korean Patent Laid-Open Publication No. 2002-69766 can more easily bond the antenna coil and IC terminal of a combi card and improve the electrical conductivity by increasing the adhesiveness with the conductive thermal adhesive tape. An antenna coil contact structure of a combination card is disclosed.

In view of the configuration, a conductive adhesive member was applied to both ends of the antenna coil, wound, and crossed to the starting point and the end point to form a loop portion, and a conductive adhesive member film was formed inside the ring portion by surface tension.

Although the formation of the conductive adhesive member film in the above invention is effective for increasing the adhesion according to the increase in the contact area of the conductive adhesive, the adhesive strength of the COB pad to which the conductive adhesive adheres and the surface of the metal material of the conductive adhesive member film is conductive adhesive. Or there was a problem that can not solve the structural problem of poor physical properties with the conductive thermal adhesive tape.

The present invention has been made in order to solve the problems described above, the object is to form a conductive convex contact on the COB pad, and to form an insertion groove corresponding to the convex contact in the antenna coil exposed to the recess of the card body Thus, the convex contact is bonded so as to be inserted into the insertion groove to provide a combination card with enhanced adhesion and electrical conductivity.

Another object of the present invention to provide a method of manufacturing a combination card as described above.

Combi card according to the present invention for achieving the above object is a chip module is inserted into the groove portion formed in a portion of the card body to the combination card bonded to the antenna terminal connected to the antenna coil of the card body and the COB pad of the chip module is energized The insertion groove is formed at the antenna terminal position of the card body, and the conductive convex contact is formed at the position corresponding to the insertion groove in the COB pad so that the conductive convex contact is inserted when the chip module is inserted into the recess of the card body. It is characterized in that it is fitted in the groove and bonded.

Combi card manufacturing method according to the present invention for achieving the above another object is to sequentially compress the lower protective layer, the lower printed layer, the antenna coil insertion layer, the upper printed layer and the upper protective layer provided with an antenna coil, Constructing a thin film card body; Cutting and forming a recess in the card body; Drilling an insertion groove in a portion where the antenna terminal is located in the antenna coil exposed as the recess; Putting a conductive adhesive on the insertion groove; Protruding a conductive convex contact at a position corresponding to the insertion groove in the COB pad of the chip module; Inserting the chip module into the recess of the card body so that the conductive convex contact is inserted into the insertion groove; And applying heat and pressure to the chip module, and curing and firmly bonding the chip module.

And, the conductive convex contact is made of any one of lead, lead alloy, solder fest or conductive adhesive.

The conductive convex contact may have a diameter of 1 mm to 4 mm, a height of 100 μm to 350 μm, and the insertion groove may have a diameter of 1 mm to 4 mm and a depth of 100 μm to 350 μm. .

Hereinafter, the present invention will be described in detail with reference to the accompanying drawings. The same components as in the prior art will be described using the same names and symbols as in the prior art.

Figure 5 is a plan view showing a combination card according to the present invention, Figure 6 is a cross-sectional view showing the recess and chip module formed in the card body in the present invention, Figure 7 is a chip module in the recess of the card body in the present invention It is sectional drawing shown in order to demonstrate the method of bonding.

5 and 6, the combination card according to the present invention is provided with both the contact of the contact IC card and the antenna coil of the non-contact RF card, the chip module 60 is a portion of the card body 100 Adhesive is formed.

The card body 100 is a card lower protective layer 10, lower printed layer 20, the antenna coil insertion layer 30, the antenna coil 32 is positioned, made of synthetic resin sheets, such as PVC, PC, PETG, top printing The layer 40 and the card upper protective layer 50 are sequentially stacked from the bottom to the top.

In addition, a recess 102 in which the chip module 60 is inserted is formed in a portion of the card body 100.

In addition, the antenna coil 32 is wound around the antenna coil insertion layer 30 constituting the card body 100, and the antenna coil 32 exposed to the recess 102 is electrically conductive by using an inlay. An antenna terminal 36 on which an adhesive member film is formed is attached.

In the antenna terminal 36, an insertion groove 106 formed between 1 mm and 4 mm in diameter is drilled to a depth of 100 µm to 350 µm.

Then, a predetermined amount of conductive adhesive 104 is injected into the inlet of the insertion groove 106.

Here, the conductive adhesive 104 is formed by mixing steel balls plated with gold or silver into the adhesive, and conducting electricity simultaneously with the adhesion.

On the other hand, the chip module 60 inserted in the recess 102 is composed of a COB pad (Chip On Board Pad) (64) on which the IC chip 62 is mounted.

In addition, a heat adhesive or a heat-adhesive tape is applied or adhered to a portion of the chip module 60 except for the COB pad 64, and the insertion groove (the ICB 62 is mounted on the COB pad 64). The conductive convex contact 68 protrudes from the position corresponding to 106.

That is, the conductive convex contact 68 may be directly attached to the COB pad 64, and the thermal terminal is applied to the COB pad 64 to attach the metallic terminal 66, and then the conductive convex contact ( 68) may be attached.

The conductive convex contact 68 is made of lead, a lead alloy, a solder paste, a conductive adhesive, or the like, and is configured to have a height of 100 µm to 350 µm.

Now, the method according to the configuration of the chip module is inserted into the recessed portion of the card body and bonded by the configuration according to the present invention or the effect thereof accordingly.

First, referring to the attached FIG. 7, a method in which the chip module 60 is inserted into and adhered to the recess 102 of the card body 100 is exposed to the recess 102 of the card body 100. After applying the conductive adhesive 104 to the insertion groove 106 formed in the antenna terminal 36 of the antenna coil 32, the chip module 60 is inserted into the groove portion.

At this time, the chip module 60 is inserted such that the conductive convex contact 68 of the COB pad 64 is inserted into the insertion groove 106 of the antenna terminal 36.

Then, the chip module 60 through the thermocompression head 3 is bonded by applying heat and pressure at an appropriate time and then cured through the cooling head 5.

The card body 100 and the chip module 60 bonded and configured as described above may be bonded while the conductive convex contact 68 of the COB pad 64 is fitted into the insertion groove 106 of the antenna terminal 36. Therefore, not only has excellent adhesive strength, but also maintains excellent electrical conductivity even when various deformations such as bending, torsion or change in physical properties of the adhesive material occur.

Now, the process of manufacturing the combination card according to the present invention through the configuration and bonding method as described above.

First, the antenna coil 32 is wound around the antenna coil insertion layer 30 along the edge, and a portion of the antenna coil insertion layer 30 forms a contact point connected to the antenna coil.

Then, each card lower protective layer 10, the lower printed layer 20, the antenna coil insertion layer 30, the upper printed layer 40 and the card upper protective layer 50 are sequentially stacked, and then one Press to form a thin film layer of the card body 100 is configured.

Then, the recess 102 is formed by cutting the recess 102 in the portion of the card body 100 where the contact point of the antenna coil 32 is located, and conducts conductive bonding to the contacts of the antenna coil 32 exposed into the recess 102. An antenna terminal 36 having a member film formed thereon is attached, and an insertion groove 106 having a diameter between 1 mm and 4 mm is drilled in this portion to a depth of 100 µm to 350 µm, and then the conductive adhesive 104 is inserted into the insertion groove. ) Is applied.

Then, the conductive convex contact 68 is protruded to a height between 100 µm and 350 µm on the COB pad 64 of the chip module 60.

Then, the chip module 60 on which the IC chip 62 is mounted is inserted into the recess 102 so that the convex contact 68 of the COB pad 64 is inserted into the insertion groove 106 of the card body 100. do.

Then, after applying the heat and pressure to the chip module 60 through the thermocompression head 3 at an appropriate time, and then hardened through the cooling head (5), a combination card capable of bonding and energizing at the same time is manufactured. .

Now, an embodiment of the combination card according to the present invention having such a manufacturing process is as follows.

Example 1

In the first process, a transparent lower protective layer of 60 µm to 130 µm, a lower printed layer of 120 µm to 320 µm, an antenna coil insertion layer having a terminal coil inserted therein, and a terminal inserted therein, 120 µm to 320 µm An upper printed layer of 탆 and a transparent upper protective layer of 60 탆 to 130 탆 are stacked in this order and stacked.

In the second step, the antenna coil and the thermo-compression and cooling by adding or subtracting the heat of 130 ℃ to 160 ℃ and the pressure of 10 kg / ㎠ to 20 kg / ㎠ for a predetermined time to the film-type card body manufactured and laminated in the first process Produce a card with a terminal inserted.

In a third step, a recess suitable for the chip specification is cut and formed so that the chip module can be inserted into a part of the card body manufactured in the second step.

At this time, an insertion groove having a diameter of 1 mm to 4 mm and a depth of 100 μm to 350 μm is formed at the position of the antenna terminal exposed to the recess, thereby making the coupling and adhesive force of the chip module larger.

In the fourth step, the conductive adhesive is introduced into the insertion groove formed in the third step using a conventional metered discharge device of about 0.01 to 0.02 g.

In the fifth process, a heat adhesive tape is attached to the backside of the chip module except for the COB pads separately from the first to fourth processes, and then the diameter 1 of lead, lead alloy solder paste, or conductive adhesive is applied to the COB pads. A convex contact shape of 4 mm to 4 mm and a height of 100 µm to 350 µm is formed and cured.

In the sixth step, the chip module manufactured in the fifth step is inserted into the recess of the plastic card main body finished up to the fourth step, and then heated with a heat compression head of 130 ° C. to 160 ° C. and a pressure of 4 bar to 12 bar. Tightly glued heads produce contact and contactless combination cards.

As described above, the combination card according to the present invention has excellent adhesion between the card body and the chip module due to durability improvement because the adhesive is made while the conductive convex contact point of the COB pad is inserted into the insertion groove of the antenna terminal. In addition, even if various deformations such as bending, torsion, or change in physical properties of the adhesive material occur, there is an effect of maintaining excellent electrical conductivity.

Claims (7)

In the combination card, the chip module is inserted into the recess formed in the portion of the card body, and the antenna terminal connected to the antenna coil of the card body and the COB pad of the chip module are energized. An insertion groove is formed at the antenna terminal position of the card body, and a conductive convex contact is formed at the position corresponding to the insertion groove in the COB pad so that the conductive convex contact is the insertion groove when the chip module is inserted into the recess of the card body. Inserted into and bonded together, The conductive convex contact has a diameter of 1 mm to 4 mm, a height of 100 m to 350 m, and the insertion groove has a diameter of 1 mm to 4 mm and a depth of 100 m to 350 m. . The method of claim 1, And the conductive convex contact attaches a metallic terminal to the COB pad and protrudes from the metallic terminal. The method according to claim 1 or 2, The conductive convex contact is a combination card, characterized in that consisting of any one of lead, lead alloy, solder fest or conductive adhesive. delete Sequentially stacking a lower protective layer, a lower printed layer, an antenna coil insertion layer having an antenna coil, an upper printed layer, and an upper protective layer, and then compressing them to form a thin film card body; Cutting and forming a recess in the card body; Drilling an insertion groove in a portion where an antenna terminal is located in the antenna coil exposed to the groove portion; Injecting a conductive adhesive onto the insertion groove; Protruding a conductive convex contact at a position corresponding to the insertion groove in a COB pad of a chip module; Inserting the chip module into the recess of the card body so that the conductive convex contact is inserted into the insertion groove; And After applying heat and pressure to the chip module, it comprises a step of curing and firmly bonding, wherein The conductive convex contact has a diameter of 1 mm to 4 mm, a height of 100 m to 350 m, and the insertion groove has a diameter of 1 mm to 4 mm and a depth of 100 m to 350 m. Manufacturing method. The method of claim 5, The conductive convex contact is made of any one of lead, lead alloy, solder fest or conductive adhesive. delete

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