KR100551527B1 - 취성재료기판의 스크라이브 방법 및 스크라이브 장치 - Google Patents

취성재료기판의 스크라이브 방법 및 스크라이브 장치 Download PDF

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Publication number
KR100551527B1
KR100551527B1 KR1020037017188A KR20037017188A KR100551527B1 KR 100551527 B1 KR100551527 B1 KR 100551527B1 KR 1020037017188 A KR1020037017188 A KR 1020037017188A KR 20037017188 A KR20037017188 A KR 20037017188A KR 100551527 B1 KR100551527 B1 KR 100551527B1
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KR
South Korea
Prior art keywords
region
cooling
laser spot
brittle material
scribe
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KR1020037017188A
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English (en)
Korean (ko)
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KR20040017249A (ko
Inventor
와카야마하루오
Original Assignee
미쓰보시 다이야몬도 고교 가부시키가이샤
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Publication of KR20040017249A publication Critical patent/KR20040017249A/ko
Application granted granted Critical
Publication of KR100551527B1 publication Critical patent/KR100551527B1/ko

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    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/38—Removing material by boring or cutting
    • B23K26/382—Removing material by boring or cutting by boring
    • B23K26/386—Removing material by boring or cutting by boring of blind holes
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • C03B33/093—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam using two or more focussed radiation beams
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/14—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor
    • B23K26/146—Working by laser beam, e.g. welding, cutting or boring using a fluid stream, e.g. a jet of gas, in conjunction with the laser beam; Nozzles therefor the fluid stream containing a liquid
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K26/00—Working by laser beam, e.g. welding, cutting or boring
    • B23K26/36—Removing material
    • B23K26/40—Removing material taking account of the properties of the material involved
    • C—CHEMISTRY; METALLURGY
    • C03—GLASS; MINERAL OR SLAG WOOL
    • C03B—MANUFACTURE, SHAPING, OR SUPPLEMENTARY PROCESSES
    • C03B33/00—Severing cooled glass
    • C03B33/09—Severing cooled glass by thermal shock
    • C03B33/091—Severing cooled glass by thermal shock using at least one focussed radiation beam, e.g. laser beam
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K2103/00—Materials to be soldered, welded or cut
    • B23K2103/50—Inorganic material, e.g. metals, not provided for in B23K2103/02 – B23K2103/26

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Optics & Photonics (AREA)
  • Plasma & Fusion (AREA)
  • Mechanical Engineering (AREA)
  • Chemical & Material Sciences (AREA)
  • Toxicology (AREA)
  • Health & Medical Sciences (AREA)
  • Thermal Sciences (AREA)
  • Materials Engineering (AREA)
  • Organic Chemistry (AREA)
  • Re-Forming, After-Treatment, Cutting And Transporting Of Glass Products (AREA)
  • Processing Of Stones Or Stones Resemblance Materials (AREA)
  • Laser Beam Processing (AREA)
KR1020037017188A 2001-08-10 2002-08-08 취성재료기판의 스크라이브 방법 및 스크라이브 장치 KR100551527B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JPJP-P-2001-00244749 2001-08-10
JP2001244749 2001-08-10

Publications (2)

Publication Number Publication Date
KR20040017249A KR20040017249A (ko) 2004-02-26
KR100551527B1 true KR100551527B1 (ko) 2006-02-13

Family

ID=19074634

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020037017188A KR100551527B1 (ko) 2001-08-10 2002-08-08 취성재료기판의 스크라이브 방법 및 스크라이브 장치

Country Status (5)

Country Link
JP (1) JPWO2003013816A1 (zh)
KR (1) KR100551527B1 (zh)
CN (1) CN1242458C (zh)
TW (1) TW583046B (zh)
WO (1) WO2003013816A1 (zh)

Families Citing this family (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100794284B1 (ko) * 2001-09-29 2008-01-11 삼성전자주식회사 비금속 기판 절단 방법
EP1806202B1 (en) * 2004-10-25 2011-08-17 Mitsuboshi Diamond Industrial Co., Ltd. Method and device for forming crack
DE102005024497B4 (de) * 2005-05-27 2008-06-19 Schott Ag Verfahren zum mechanischen Brechen von geritzten flachen Werkstücken aus sprödbrüchigem Material
JP2008183599A (ja) * 2007-01-31 2008-08-14 Japan Steel Works Ltd:The 高脆性非金属材料製の被加工物の加工方法及びその装置
JP2008246808A (ja) * 2007-03-30 2008-10-16 Japan Steel Works Ltd:The 高脆性非金属材料製の被加工物の加工方法及びその装置
JP5060880B2 (ja) * 2007-09-11 2012-10-31 三星ダイヤモンド工業株式会社 脆性材料基板の分断装置および分断方法
CN101513692B (zh) * 2008-02-21 2011-09-07 富士迈半导体精密工业（上海）有限公司 激光切割脆性材料的方法及装置
KR20100107253A (ko) 2009-03-25 2010-10-05 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
KR101041137B1 (ko) 2009-03-25 2011-06-13 삼성모바일디스플레이주식회사 기판 절단 장치 및 이를 이용한 기판 절단 방법
JP2011079690A (ja) * 2009-10-06 2011-04-21 Leo:Kk 回折格子を用いた厚板ガラスのレーザ熱応力割断
KR200451896Y1 (ko) * 2010-02-12 2011-01-18 주식회사 예림임업 문틀 체결용 브래킷
DE102015104802A1 (de) * 2015-03-27 2016-09-29 Schott Ag Verfahren zum Trennen von Glas mittels eines Lasers, sowie verfahrensgemäß hergestelltes Glaserzeugnis
US11420894B2 (en) 2015-04-24 2022-08-23 Nanoplus Ltd. Brittle object cutting apparatus and cutting method thereof
JP6904567B2 (ja) * 2017-09-29 2021-07-21 三星ダイヤモンド工業株式会社 スクライブ加工方法及びスクライブ加工装置

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
RU2024441C1 (ru) * 1992-04-02 1994-12-15 Владимир Степанович Кондратенко Способ резки неметаллических материалов
JPH0912327A (ja) * 1995-06-26 1997-01-14 Corning Inc ガラス切断方法および装置
JPH1034364A (ja) * 1996-07-25 1998-02-10 Souei Tsusho Kk 複数点熱源による脆性材料の割断加工方法
MY120533A (en) * 1997-04-14 2005-11-30 Schott Ag Method and apparatus for cutting through a flat workpiece made of brittle material, especially glass.
US6327875B1 (en) * 1999-03-09 2001-12-11 Corning Incorporated Control of median crack depth in laser scoring

Also Published As

Publication number Publication date
KR20040017249A (ko) 2004-02-26
WO2003013816A1 (en) 2003-02-20
TW583046B (en) 2004-04-11
JPWO2003013816A1 (ja) 2004-11-25
CN1242458C (zh) 2006-02-15
CN1541155A (zh) 2004-10-27

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