KR100542846B1 - 고 밀도 어플리케이션을 위한 분산 커패시터 - Google Patents

고 밀도 어플리케이션을 위한 분산 커패시터 Download PDF

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Publication number
KR100542846B1
KR100542846B1 KR1020030100466A KR20030100466A KR100542846B1 KR 100542846 B1 KR100542846 B1 KR 100542846B1 KR 1020030100466 A KR1020030100466 A KR 1020030100466A KR 20030100466 A KR20030100466 A KR 20030100466A KR 100542846 B1 KR100542846 B1 KR 100542846B1
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KR
South Korea
Prior art keywords
conductive layer
disposed
dielectric material
layer
printed circuit
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Expired - Lifetime
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KR1020030100466A
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English (en)
Korean (ko)
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KR20040062413A (ko
Inventor
나고드토마스디.
블랙그레고리레드몬드
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모토로라 인코포레이티드
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Publication of KR20040062413A publication Critical patent/KR20040062413A/ko
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Publication of KR100542846B1 publication Critical patent/KR100542846B1/ko
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    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistor, capacitor, inductor incorporating printed capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
    • H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
    • H10D84/212—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Waveguides (AREA)
KR1020030100466A 2002-12-30 2003-12-30 고 밀도 어플리케이션을 위한 분산 커패시터 Expired - Lifetime KR100542846B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US10/331,901 US6760208B1 (en) 2002-12-30 2002-12-30 Distributive capacitor for high density applications
US10/331,901 2002-12-30

Publications (2)

Publication Number Publication Date
KR20040062413A KR20040062413A (ko) 2004-07-07
KR100542846B1 true KR100542846B1 (ko) 2006-01-20

Family

ID=30770802

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1020030100466A Expired - Lifetime KR100542846B1 (ko) 2002-12-30 2003-12-30 고 밀도 어플리케이션을 위한 분산 커패시터

Country Status (6)

Country Link
US (1) US6760208B1 (enExample)
JP (1) JP4417095B2 (enExample)
KR (1) KR100542846B1 (enExample)
CN (1) CN100472676C (enExample)
GB (1) GB2397173B (enExample)
TW (1) TWI326459B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100645625B1 (ko) * 2004-12-01 2006-11-15 삼성전기주식회사 커패시터 내장형 인쇄회로기판 및 그 제조방법
KR100598118B1 (ko) 2005-01-12 2006-07-10 삼성전자주식회사 적층형 인쇄회로기판
US20070153490A1 (en) * 2005-12-30 2007-07-05 Benham John R Methods and apparatus for electromagnetically sampling signals using socket-package interface based interposer
US8094429B2 (en) * 2009-06-22 2012-01-10 Industrial Technology Research Institute Multilayer capacitors and methods for making the same
CN102412913B (zh) * 2011-10-24 2016-09-14 惠州Tcl移动通信有限公司 一种测试系统和移动通讯终端的天线调试方法
US9035714B2 (en) * 2012-07-03 2015-05-19 Cisco Technology, Inc. Parasitic capacitance compensating transmission line
US9595217B2 (en) 2013-12-05 2017-03-14 Samsung Display Co., Ltd. Trace structure for improved electrical signaling
US10153238B2 (en) 2014-08-20 2018-12-11 Samsung Display Co., Ltd. Electrical channel including pattern voids
US9461810B2 (en) 2014-09-18 2016-10-04 Samsung Display Co., Ltd. Multi-drop channels including reflection enhancement
KR102293487B1 (ko) * 2014-10-31 2021-08-25 현대모비스 주식회사 차량용 레이더의 임피던스 매칭 회로를 결정하기 위한 방법
CN104617081B (zh) * 2015-01-30 2018-07-27 天津中科海高微波技术有限公司 应用于单片微波集成电路的连接线以及连接线的设计方法
TWI584526B (zh) 2015-12-04 2017-05-21 財團法人工業技術研究院 積層式天線結構
CN107995770B (zh) * 2017-11-10 2021-04-02 惠科股份有限公司 一种柔性扁平排线和显示面板
WO2020132187A1 (en) * 2018-12-20 2020-06-25 Avx Corporation Multilayer electronic device including a high precision inductor
DE102020125942A1 (de) * 2020-10-05 2022-04-07 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Elektrisches oder elektronisches Steuergerät
KR102826542B1 (ko) * 2022-03-18 2025-06-26 삼성전자주식회사 다층 기판을 갖는 전자 장치 및 그 제조 방법

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1273267A (en) * 1968-04-01 1972-05-03 Itek Corp Photographic process for producing electrical components
DE3714672A1 (de) * 1987-05-02 1988-11-17 Telefunken Electronic Gmbh Rc-leitung
US6185354B1 (en) * 1998-05-15 2001-02-06 Motorola, Inc. Printed circuit board having integral waveguide
US6103134A (en) * 1998-12-31 2000-08-15 Motorola, Inc. Circuit board features with reduced parasitic capacitance and method therefor
JP2002033560A (ja) * 2000-07-17 2002-01-31 Alps Electric Co Ltd 電子回路基板の製造方法
US6606793B1 (en) * 2000-07-31 2003-08-19 Motorola, Inc. Printed circuit board comprising embedded capacitor and method of same

Also Published As

Publication number Publication date
GB2397173B (en) 2005-04-20
KR20040062413A (ko) 2004-07-07
TWI326459B (en) 2010-06-21
JP2004214652A (ja) 2004-07-29
CN100472676C (zh) 2009-03-25
JP4417095B2 (ja) 2010-02-17
GB2397173A (en) 2004-07-14
US6760208B1 (en) 2004-07-06
CN1534698A (zh) 2004-10-06
GB0329180D0 (en) 2004-01-21
TW200425180A (en) 2004-11-16
US20040125526A1 (en) 2004-07-01

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