GB2397173B - Distributive capacitor for high density applications - Google Patents

Distributive capacitor for high density applications

Info

Publication number
GB2397173B
GB2397173B GB0329180A GB0329180A GB2397173B GB 2397173 B GB2397173 B GB 2397173B GB 0329180 A GB0329180 A GB 0329180A GB 0329180 A GB0329180 A GB 0329180A GB 2397173 B GB2397173 B GB 2397173B
Authority
GB
United Kingdom
Prior art keywords
high density
density applications
distributive capacitor
distributive
capacitor
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
GB0329180A
Other languages
English (en)
Other versions
GB2397173A (en
GB0329180D0 (en
Inventor
Thomas D Nagode
Gregory Redmond Black
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Motorola Solutions Inc
Original Assignee
Motorola Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Motorola Inc filed Critical Motorola Inc
Publication of GB0329180D0 publication Critical patent/GB0329180D0/en
Publication of GB2397173A publication Critical patent/GB2397173A/en
Application granted granted Critical
Publication of GB2397173B publication Critical patent/GB2397173B/en
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01P—WAVEGUIDES; RESONATORS, LINES, OR OTHER DEVICES OF THE WAVEGUIDE TYPE
    • H01P5/00—Coupling devices of the waveguide type
    • H01P5/02—Coupling devices of the waveguide type with invariable factor of coupling
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/16—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors
    • H05K1/162—Printed circuits incorporating printed electric components, e.g. printed resistors, capacitors or inductors incorporating printed capacitors
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10D—INORGANIC ELECTRIC SEMICONDUCTOR DEVICES
    • H10D84/00—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers
    • H10D84/201—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits
    • H10D84/204—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors
    • H10D84/212—Integrated devices formed in or on semiconductor substrates that comprise only semiconducting layers, e.g. on Si wafers or on GaAs-on-Si wafers characterised by the integration of only components covered by H10D1/00 or H10D8/00, e.g. RLC circuits of combinations of diodes or capacitors or resistors of only capacitors
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K1/00—Printed circuits
    • H05K1/02—Details
    • H05K1/0213—Electrical arrangements not otherwise provided for
    • H05K1/0237—High frequency adaptations
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/01—Dielectrics
    • H05K2201/0183—Dielectric layers
    • H05K2201/0187—Dielectric layers with regions of different dielectrics in the same layer, e.g. in a printed capacitor for locally changing the dielectric properties
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/095—Conductive through-holes or vias
    • H05K2201/09509—Blind vias, i.e. vias having one side closed
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2201/00—Indexing scheme relating to printed circuits covered by H05K1/00
    • H05K2201/09—Shape and layout
    • H05K2201/09209—Shape and layout details of conductors
    • H05K2201/09654—Shape and layout details of conductors covering at least two types of conductors provided for in H05K2201/09218 - H05K2201/095
    • H05K2201/09727—Varying width along a single conductor; Conductors or pads having different widths

Landscapes

  • Engineering & Computer Science (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Parts Printed On Printed Circuit Boards (AREA)
  • Production Of Multi-Layered Print Wiring Board (AREA)
  • Waveguides (AREA)
GB0329180A 2002-12-30 2003-12-17 Distributive capacitor for high density applications Expired - Fee Related GB2397173B (en)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
US10/331,901 US6760208B1 (en) 2002-12-30 2002-12-30 Distributive capacitor for high density applications

Publications (3)

Publication Number Publication Date
GB0329180D0 GB0329180D0 (en) 2004-01-21
GB2397173A GB2397173A (en) 2004-07-14
GB2397173B true GB2397173B (en) 2005-04-20

Family

ID=30770802

Family Applications (1)

Application Number Title Priority Date Filing Date
GB0329180A Expired - Fee Related GB2397173B (en) 2002-12-30 2003-12-17 Distributive capacitor for high density applications

Country Status (6)

Country Link
US (1) US6760208B1 (enExample)
JP (1) JP4417095B2 (enExample)
KR (1) KR100542846B1 (enExample)
CN (1) CN100472676C (enExample)
GB (1) GB2397173B (enExample)
TW (1) TWI326459B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100645625B1 (ko) * 2004-12-01 2006-11-15 삼성전기주식회사 커패시터 내장형 인쇄회로기판 및 그 제조방법
KR100598118B1 (ko) 2005-01-12 2006-07-10 삼성전자주식회사 적층형 인쇄회로기판
US20070153490A1 (en) * 2005-12-30 2007-07-05 Benham John R Methods and apparatus for electromagnetically sampling signals using socket-package interface based interposer
US8094429B2 (en) * 2009-06-22 2012-01-10 Industrial Technology Research Institute Multilayer capacitors and methods for making the same
CN102412913B (zh) * 2011-10-24 2016-09-14 惠州Tcl移动通信有限公司 一种测试系统和移动通讯终端的天线调试方法
US9035714B2 (en) * 2012-07-03 2015-05-19 Cisco Technology, Inc. Parasitic capacitance compensating transmission line
US9595217B2 (en) * 2013-12-05 2017-03-14 Samsung Display Co., Ltd. Trace structure for improved electrical signaling
US10153238B2 (en) 2014-08-20 2018-12-11 Samsung Display Co., Ltd. Electrical channel including pattern voids
US9461810B2 (en) 2014-09-18 2016-10-04 Samsung Display Co., Ltd. Multi-drop channels including reflection enhancement
KR102293487B1 (ko) * 2014-10-31 2021-08-25 현대모비스 주식회사 차량용 레이더의 임피던스 매칭 회로를 결정하기 위한 방법
CN104617081B (zh) * 2015-01-30 2018-07-27 天津中科海高微波技术有限公司 应用于单片微波集成电路的连接线以及连接线的设计方法
TWI584526B (zh) 2015-12-04 2017-05-21 財團法人工業技術研究院 積層式天線結構
CN107995770B (zh) * 2017-11-10 2021-04-02 惠科股份有限公司 一种柔性扁平排线和显示面板
US11595013B2 (en) * 2018-12-20 2023-02-28 KYOCERA AVX Components Corporation Multilayer electronic device including a high precision inductor
DE102020125942A1 (de) * 2020-10-05 2022-04-07 Dr. Ing. H.C. F. Porsche Aktiengesellschaft Elektrisches oder elektronisches Steuergerät
KR102826542B1 (ko) * 2022-03-18 2025-06-26 삼성전자주식회사 다층 기판을 갖는 전자 장치 및 그 제조 방법

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1273267A (en) * 1968-04-01 1972-05-03 Itek Corp Photographic process for producing electrical components
US4866502A (en) * 1987-05-02 1989-09-12 Telefunken Electronic Gmbh RC line
JP2002033560A (ja) * 2000-07-17 2002-01-31 Alps Electric Co Ltd 電子回路基板の製造方法

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US6185354B1 (en) * 1998-05-15 2001-02-06 Motorola, Inc. Printed circuit board having integral waveguide
US6103134A (en) * 1998-12-31 2000-08-15 Motorola, Inc. Circuit board features with reduced parasitic capacitance and method therefor
US6606793B1 (en) * 2000-07-31 2003-08-19 Motorola, Inc. Printed circuit board comprising embedded capacitor and method of same

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
GB1273267A (en) * 1968-04-01 1972-05-03 Itek Corp Photographic process for producing electrical components
US4866502A (en) * 1987-05-02 1989-09-12 Telefunken Electronic Gmbh RC line
JP2002033560A (ja) * 2000-07-17 2002-01-31 Alps Electric Co Ltd 電子回路基板の製造方法

Also Published As

Publication number Publication date
US6760208B1 (en) 2004-07-06
CN100472676C (zh) 2009-03-25
JP4417095B2 (ja) 2010-02-17
GB2397173A (en) 2004-07-14
US20040125526A1 (en) 2004-07-01
TW200425180A (en) 2004-11-16
JP2004214652A (ja) 2004-07-29
TWI326459B (en) 2010-06-21
CN1534698A (zh) 2004-10-06
GB0329180D0 (en) 2004-01-21
KR20040062413A (ko) 2004-07-07
KR100542846B1 (ko) 2006-01-20

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Legal Events

Date Code Title Description
732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20110127 AND 20110202

732E Amendments to the register in respect of changes of name or changes affecting rights (sect. 32/1977)

Free format text: REGISTERED BETWEEN 20170831 AND 20170906

PCNP Patent ceased through non-payment of renewal fee

Effective date: 20211217