KR100523629B1 - Wafer guide device of a cleaner - Google Patents
Wafer guide device of a cleaner Download PDFInfo
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- KR100523629B1 KR100523629B1 KR10-2003-0006833A KR20030006833A KR100523629B1 KR 100523629 B1 KR100523629 B1 KR 100523629B1 KR 20030006833 A KR20030006833 A KR 20030006833A KR 100523629 B1 KR100523629 B1 KR 100523629B1
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67017—Apparatus for fluid treatment
- H01L21/67028—Apparatus for fluid treatment for cleaning followed by drying, rinsing, stripping, blasting or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/68—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for positioning, orientation or alignment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68728—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a plurality of separate clamping members, e.g. clamping fingers
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68742—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a lifting arrangement, e.g. lift pins
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Cleaning Or Drying Semiconductors (AREA)
Abstract
본 발명의 크리너의 웨이퍼 가이드 장치는 상부면에 형성된 테두리부와, 이 테두리부의 내측면에 소정간격으로 형성된 복수개의 개구부와, 내측면의 하단부에서 내측으로 연장된 로딩부로 각각 구성되어, 웨이퍼의 로딩/언로딩시 이동가능한 한쌍의 바아와, 상기 바아의 테두리부내에 이동가능하게 각각 수납되어, 상기 바아에 로딩된 웨이퍼를 정렬 위치로 가이드 하는 가이드 수단과, 상기 바아와 상기 가이드 수단을 구동하는 구동 수단으로 이루어진 것을 특징으로 한다.The wafer guide apparatus of the cleaner according to the present invention is composed of an edge portion formed on an upper surface, a plurality of openings formed at predetermined intervals on an inner side of the edge portion, and a loading portion extending inwardly from a lower end portion of the inner surface, so as to load a wafer. A pair of bars movable during unloading, guide means movably housed in the rim of the bar to guide the wafer loaded in the bar to an alignment position, and driving the bar and the guide means It is characterized by consisting of means.
본 발명에 의하면, 로딩핀이 웨이퍼의 로딩/언로딩을 안내하고, 로딩부에 안착된 웨이퍼는 바아의 이동과 롤러축에 삽입된 고무의 돌출로 인하여 정확하게 위치되므로서, 로봇의 툴 포인트 불량으로 인한 웨이퍼의 배드 포지션 에러의 발생을 방지하고, 웨이퍼가 롤러의 밑으로 들어감으로서 깨지는 것을 방지하여 장비의 가동율을 향상하는 효과를 가진다. According to the present invention, the loading pin guides the loading / unloading of the wafer, and the wafer seated on the loading portion is accurately positioned due to the movement of the bar and the protrusion of the rubber inserted into the roller shaft, thereby resulting in a poor tool point of the robot. It is possible to prevent the occurrence of bad position error of the wafer, and to prevent the wafer from being broken by entering the bottom of the roller, thereby improving the operation rate of the equipment.
Description
본 발명은 크리너의 웨이퍼 가이드 장치에 관한 것으로, 더욱 상세하게는 웨이퍼가 안전하게 로딩될 수 있고, 그 로딩 위치를 바로 잡아주어 웨이퍼의 파손을 방지할 수 있는 크리너의 웨이퍼 가이드 장치에 관한 것이다.The present invention relates to a wafer guide device of a cleaner, and more particularly, to a wafer guide device of a cleaner that can safely load the wafer, to correct the loading position to prevent breakage of the wafer.
반도체 제조 장비에 있어서, 크리너(cleaner)는 폴리싱이 끝난 후 웨이퍼의 표면에 묻은 파티클들을 제거하는 장비로서, 제 1 브러쉬 모듈, 제 2 브러쉬 모듈 및 SRD(spin rinse dry)으로 구성되어 로봇에 의해 순서대로 웨이퍼가 이동된다. 제 1 및 제 2 브러쉬 모듈은 브러쉬를 통해서 웨이퍼의 앞뒤면을 클린하고, SRD는 웨이퍼의 표면에 묻은 케미칼등을 강한 회전을 통해서 제거한다.In semiconductor manufacturing equipment, a cleaner is a device that removes particles on the surface of a wafer after polishing. The cleaner consists of a first brush module, a second brush module, and a spin rinse dry (SRD) to be processed by a robot. The wafer is moved as soon as possible. The first and second brush modules clean the front and back surfaces of the wafer through the brush, and the SRD removes the chemicals and the like deposited on the surface of the wafer through a strong rotation.
도 1 및 도 2에는 종래의 크리너의 브러쉬 모듈을 도시하고 있다. 도시된 바와 같이, 웨이퍼가 놓이는 중앙의 브러쉬 삽입부(2)를 중심으로 원통상의 바아(4)위에 모두 6개의 롤러(6)가 소정 간격으로 회전가능하게 설치된다. 이러한 롤러(6)의 상부에는 웨이퍼(W)의 마모를 줄이기 위해 고무캡(8)이 삽입되고 또한, 단턱부(9)가 제공되며, 이 단턱부(9)에 웨이퍼가 로딩된다. 이후, 상하의 브러쉬(10,12)가 각각 화살표의 방향으로 업다운되어 웨이퍼를 맞물고 회전하면, 웨이퍼의 회전에 의해 롤러(6)가 회전된다.1 and 2 show a brush module of a conventional cleaner. As shown, all six rollers 6 are rotatably installed at predetermined intervals on the cylindrical bar 4 around the center brush insert 2 on which the wafer is placed. The rubber cap 8 is inserted in the upper portion of the roller 6 to reduce the wear of the wafer W, and the step 9 is provided, and the wafer 9 is loaded on the step 9. Thereafter, when the upper and lower brushes 10 and 12 respectively move up and down in the direction of the arrow to engage and rotate the wafer, the roller 6 is rotated by the rotation of the wafer.
하지만, 이러한 종래의 크리너 브러쉬 모듈은 로봇(도시하지 않음)이 웨이퍼를 롤러(6)에 로딩할 때, 로봇의 툴 포이트 불량으로 인하여 웨이퍼가 롤러(6)의 단턱부에 정확하게 로딩되지 못하는 경우, 소위, 배드 포지션 에러(bad position error)가 발생하거나, 또는 롤러(6)의 단턱부(9)밑으로 웨이퍼가 들어가게 되면, 웨이퍼가 파손되어, 장비의 가동율이 저하되는 문제가 있었다.However, such a conventional cleaner brush module, when the robot (not shown) loads the wafer on the roller 6, when the wafer is not loaded correctly on the stepped portion of the roller 6 due to the tool point defect of the robot, When a so-called bad position error occurs or the wafer enters under the step 9 of the roller 6, there is a problem that the wafer is broken and the operation rate of the equipment is lowered.
따라서, 본 발명은 이에 따라 안출된 것으로, 그 목적은 웨이퍼가 안전하게 로딩될 수 있고, 그 로딩 위치를 바로 잡아주어 웨이퍼의 파손을 방지할 수 있는 크리너의 웨이퍼 가이드 장치를 제공하는 것이다.Accordingly, the present invention has been devised accordingly, and an object thereof is to provide a wafer guide apparatus of a cleaner which can safely load a wafer and correct the loading position to prevent breakage of the wafer.
이러한 목적을 달성하기 위한 수단으로서, 본 발명의 크리너의 웨이퍼 가이드 장치는 상부면에 형성된 테두리부와, 이 테두리부의 내측면에 소정간격으로 형성된 복수개의 개구부와, 내측면의 하단부에서 내측으로 연장된 로딩부로 각각 구성되어, 웨이퍼의 로딩/언로딩시 이동가능한 한쌍의 바아와, 상기 바아의 테두리부내에 이동가능하게 각각 수납되어, 상기 바아에 로딩된 웨이퍼를 정렬 위치로 가이드 하는 가이드 수단과, 상기 바아와 상기 가이드 수단을 구동하는 구동 수단으로 이루어진 것을 특징으로 한다.As a means for achieving the above object, the wafer guide apparatus of the cleaner of the present invention includes an edge portion formed on an upper surface, a plurality of openings formed at predetermined intervals on an inner surface of the edge portion, and extending inwardly from a lower end portion of the inner surface. A pair of bars, each of which is configured as a loading part and movable in loading / unloading of the wafer, and guiding means which are respectively accommodated in the bar portion of the bar to be movable to guide the wafer loaded in the bar to an alignment position; And a driving means for driving the bar and the guide means.
본 발명에 의하면, 웨이퍼가 크리너에 안전하게 로딩/언로딩하며, 로딩시 정확하게 위치되는 효과를 가진다.According to the present invention, the wafer is safely loaded / unloaded into the cleaner and has the effect of being accurately positioned upon loading.
이하, 첨부된 도면을 참조로 하여 본 발명의 바람직한 일실시예에 따른 를 상세히 설명한다.Hereinafter, with reference to the accompanying drawings will be described in detail according to a preferred embodiment of the present invention.
도 3 및 도 4는 본 발명의 크리너의 웨이퍼 가이드 장치를 도시하고 있다. 도시된 바와 같이, 웨이퍼 가이드 장치는 웨이퍼의 로딩/언로딩시 이동가능한 한쌍의 바아(20)와, 로딩된 웨이퍼를 정렬 위치로 가이드 하는 가이드 수단(30)과, 바아(20)와 가이드 수단(30)을 구동하고자, 예를 들어 공기 실린더와 같은 구동수단(40)으로 구성된다.3 and 4 show the wafer guide apparatus of the cleaner of the present invention. As shown, the wafer guide device comprises a pair of bars 20 that are movable during loading / unloading of the wafer, guide means 30 for guiding the loaded wafer to the alignment position, bars 20 and guide means ( To drive 30, it consists of a drive means 40, for example an air cylinder.
한쌍의 바아(20)는 그 상부면에 테두리부(22)가 형성되고, 이 테두리부(22)의 내측면에 소정간격으로 복수개, 도면에서는 각각 3개씩의 개구부(24)가 형성되며, 내측면의 하단부에서 내측으로 로딩부(26)가 연장되어 있다.The pair of bars 20 has edge portions 22 formed on the upper surface thereof, and a plurality of openings 24 are formed on the inner side surface of the edge portion 22 at predetermined intervals, and three openings 24 are shown in the drawing. The loading part 26 extends inward from the lower end of the side surface.
가이드 수단(30)은 각 바아(20)의 테두리부(22)내에 이동가능하게 설치된 롤러축(32)과, 바아(20)에 로딩된 웨이퍼를 정렬위치로 가이드할 때 바아(20)의 개구부(24)에 노출가능하도록 롤러축(32)에 삽입된 고무(34)로 구성된다.The guide means 30 includes a roller shaft 32 movably installed in the rim 22 of each bar 20 and an opening of the bar 20 when guiding the wafer loaded on the bar 20 to an alignment position. And a rubber 34 inserted into the roller shaft 32 so as to be exposed to the 24.
한편, 바아(20)의 로딩부(26)에는 한쌍의 구멍(28)이 형성되고, 이 구멍(28)을 통해 웨이퍼의 로딩/언로딩을 안내하는 로딩핀(52)이 장착된다. 로딩핀(52)은 구동수단(도시하지 않음)에 의해 로봇(도시하지 않음)의 그리퍼가 웨이퍼를 로딩하고자 하면, 상승한 다음 웨이퍼를 안내하여 하강하면서 바아(20)의 로딩부(26)에 웨이퍼를 안착시킨다. 예시하지는 않았지만, 바아(20)와 가이드 수단(30)을 구동하는 구동수단(40)이 도시하지 않은 제어장치의 제어하에서 로딩핀(52)을 작동하도록 할 수 있음은 물론이다.On the other hand, a pair of holes 28 are formed in the loading part 26 of the bar 20, and the loading pins 52 for guiding loading / unloading of the wafer through the holes 28 are mounted. When the gripper of the robot (not shown) attempts to load the wafer by the driving means (not shown), the loading pin 52 moves up and then guides and lowers the wafer to the loading portion 26 of the bar 20. Seat. Although not illustrated, the driving means 40 for driving the bar 20 and the guide means 30 may allow the loading pin 52 to operate under the control of a control device (not shown).
이와 같이 구성된 본 발명의 크리너의 웨이퍼 가이드 방법을 설명하면 다음과 같다.The wafer guide method of the cleaner of the present invention configured as described above is as follows.
먼저, 웨이퍼를 로딩하고자 하면, 로딩핀(52)이 상승한 후 웨이퍼를 안내하면서 하강하여 웨이퍼의 로딩을 가이드한다. 웨이퍼가 로딩위치에 오면, 한쌍의 바아(20)를 내측으로 이동하도록 구동수단(40)을 구동하여 로딩부(26)에 웨이퍼를 로딩한다. 그후, 가이드 수단(30)을 구동하여 롤러축(32)이 도 3의 빗금친 방향으로 이동함으로서 고무(34)를 바아(20)의 개구부(24)에 노출시킨다. 이에 의해 로딩부(26)에 로딩된 웨이퍼가 정확하게 위치된다.First, if the wafer is to be loaded, the loading pin 52 is raised and then guided to the wafer to lower the guide to load the wafer. When the wafer is in the loading position, the driving means 40 is driven to move the pair of bars 20 inward to load the wafer into the loading unit 26. Thereafter, the guide means 30 is driven to move the roller shaft 32 in the hatched direction of FIG. 3 to expose the rubber 34 to the opening 24 of the bar 20. This allows the wafer loaded in the loading section 26 to be positioned accurately.
웨이퍼의 크리닝 공정의 완료후, 다시 승하강 수단(50)에 의해 로딩핀(52)이 상승함과 동시에 한쌍의 바아(20) 및 바아(20)의 개구부(24)에 노출되었던 고무(34)는 원래의 위치로 후퇴함으로서, 웨이퍼의 언로딩을 실행한다.After completion of the cleaning process of the wafer, the rubber 34 which was exposed to the pair of bars 20 and the openings 24 of the bars 20 at the same time as the loading pins 52 were raised by the elevating means 50 again. Retreats to the original position, thereby performing unloading of the wafer.
상술한 바와 같이 본 발명의 크리너의 웨이퍼 가이드 장치는 로딩핀이 웨이퍼의 로딩/언로딩을 안내하고, 로딩부에 안착된 웨이퍼는 바아의 이동과 롤러축에 삽입된 고무의 돌출로 인하여 정확하게 위치되므로서, 로봇의 툴 포인트 불량으로 인한 웨이퍼의 배드 포지션 에러의 발생을 방지하고, 웨이퍼가 롤러의 밑으로 들어감으로서 깨지는 것을 방지하여 장비의 가동율을 향상하는 효과를 가진다. As described above, in the wafer guide apparatus of the cleaner of the present invention, the loading pin guides the loading / unloading of the wafer, and the wafer seated on the loading portion is accurately positioned due to the movement of the bar and the protrusion of the rubber inserted into the roller shaft. Therefore, it is possible to prevent the occurrence of bad position error of the wafer due to the defective tool point of the robot, and to prevent the wafer from being broken by falling under the roller, thereby improving the operation rate of the equipment.
도 1은 종래의 크리너의 브러쉬 모듈을 나타내는 개략 사시도이고,1 is a schematic perspective view showing a brush module of a conventional cleaner;
도 2는 도 1의 브러쉬 모듈의 작동을 설명하기 위한 A-A 단면도이고,Figure 2 is a cross-sectional view A-A for explaining the operation of the brush module of Figure 1,
도 3은 본 발명의 바람직한 일실시예에 따른 크리너의 웨이퍼 가이드 장치의 개략도이고,3 is a schematic view of a wafer guide device of a cleaner according to an embodiment of the present invention,
도 4은 도 3의 롤러부분을 나타내는 개략 단면도이다.4 is a schematic cross-sectional view showing the roller portion of FIG. 3.
<도면의 주요부분에 대한 부호의 설명><Description of the symbols for the main parts of the drawings>
20 : 바아 22 : 테두리부20: bar 22: border
24 : 개구부 26 : 로딩부24: opening 26: loading portion
28 : 구멍 30 : 가이드 수단28: hole 30: guide means
32 : 롤러축 34 : 고무32: roller shaft 34: rubber
40 : 구동수단 52 : 로딩핀40: driving means 52: loading pin
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2003-0006833A KR100523629B1 (en) | 2003-02-04 | 2003-02-04 | Wafer guide device of a cleaner |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR10-2003-0006833A KR100523629B1 (en) | 2003-02-04 | 2003-02-04 | Wafer guide device of a cleaner |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR20040070659A KR20040070659A (en) | 2004-08-11 |
| KR100523629B1 true KR100523629B1 (en) | 2005-10-25 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR10-2003-0006833A KR100523629B1 (en) | 2003-02-04 | 2003-02-04 | Wafer guide device of a cleaner |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR100523629B1 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| CN114803539B (en) * | 2022-05-16 | 2024-07-09 | 中建八局第二建设有限公司 | ALC light partition wall board construction is with shifting positioner |
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- 2003-02-04 KR KR10-2003-0006833A patent/KR100523629B1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR20040070659A (en) | 2004-08-11 |
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