KR100992651B1 - Apparatus of treating a substrate in a single wafer type and method of the same - Google Patents

Abstract

The present invention provides a sheet type substrate processing apparatus and a method thereof. The single wafer type substrate processing apparatus includes a cleaning chamber for cleaning the substrate, a drying chamber provided at one side of the cleaning chamber to dry the substrate on which the cleaning is completed, the substrate being placed, and rotating and linearly in the cleaning chamber or the drying chamber. A spin chuck for movement and a door formed between the cleaning chamber and the drying chamber to open and close the spin chuck in a linear motion or to seal the drying chamber while the substrate is dried. This can increase the drying efficiency of the substrate.

Cleaning chamber, drying chamber, stainless steel

Description

Sheet type substrate processing apparatus and its method {APPARATUS OF TREATING A SUBSTRATE IN A SINGLE WAFER TYPE AND METHOD OF THE SAME}

The present invention relates to a sheet type substrate processing apparatus and a method thereof. The present invention relates to a sheet type substrate processing apparatus and a substrate processing method in which a chamber for cleaning a substrate and a chamber for drying the substrate are separated to improve drying efficiency.

In general, a semiconductor device may be manufactured by repeatedly performing deposition, photography, and etching processes using a substrate, for example, a silicon wafer. Contaminants such as various particles, metal impurities, organic impurities, and the like may remain on the substrate during the processes. Since the contaminants adversely affect the yield and reliability of the semiconductor device, a process for removing contaminants remaining on the substrate is performed during semiconductor manufacturing.

Substrate processing method for the process can be largely divided into a dry processing method and a wet (Wet) processing method, the wet processing method is a method using a variety of chemical solutions, batch processing (batch) to process a plurality of substrates at the same time type) It is divided into device and single wafer type device that processes the substrate by sheet.

The batch processing apparatus removes contaminants by immersing a plurality of substrates at once in a cleaning tank containing a cleaning liquid. However, the conventional batch processing apparatus has a disadvantage in that it is not easy to cope with the trend of increasing the size of the substrate, and the use of the cleaning solution is large. In addition, when the substrate is broken during the process in the batch type processing apparatus, since the entire substrate in the cleaning tank is affected, a large amount of substrate defects may occur.

For these reasons, sheetfed processing devices have been preferred in recent years.

Single wafer processing apparatus is a method of processing by a single substrate unit, by spraying the cleaning liquid or dry gas on the surface of the substrate rotated at high speed, by using the centrifugal force by the rotation of the substrate and the pressure according to the injection of the cleaning liquid to remove the contamination source Cleaning is performed by the spinning method.

In general, the sheet processing apparatus includes a spin chuck rotating in a state in which a substrate is accommodated and a substrate in which a cleaning process is performed, and a nozzle assembly for supplying a cleaning liquid including chemical liquid, rinse liquid and dry gas to the substrate. Include.

By the way, the conventional sheet processing apparatus has a problem that the drying efficiency is not good because both the cleaning and drying of the substrate is made in the upper process chamber.

That is, in the conventional sheet type processing apparatus, since the drying process, which is the final stage of the cleaning process, is performed in the process chamber in which the upper part is opened, dry gas is not uniformly formed in the ultrapure water by the gas introduced through the open upper part of the process chamber. There was a problem in which the drying performance was deteriorated.

In addition, since the process chamber is formed of a resin material, when the substrate is rotated at a high speed, static electricity may occur, resulting in a fire, a gate pattern deteriorating, and a problem in that the copper wiring may not be used. When rotating at a low speed there was also a problem that the dry gas is recovered to the wrong place.

In addition, when an operation error occurs in any of a portion required for the cleaning process or a portion required for the drying process, there is an inconvenience in that the entire substrate processing apparatus needs to be replaced or maintained.

The present invention is to solve the problems according to the prior art as described above, by separating the chamber for performing the cleaning process and the chamber for performing the drying process so that the interface of the dry material such as isopropyl alcohol on the surface of the ultrapure water evenly It is an object of the present invention to provide a sheet type substrate processing apparatus and method for improving the drying performance of a substrate.

In addition, the present invention provides a sheet-fed substrate processing apparatus and a method for improving stability by forming a drying chamber made of stainless steel and having a drying chamber closed at a lower portion of the cleaning chamber separately from an open cleaning chamber at an upper portion thereof. do.

According to an aspect of the present invention, there is provided a sheet type substrate processing apparatus for removing impurities in a substrate, the apparatus comprising: a cleaning chamber configured to open an upper portion and a lower portion thereof so as to enter and exit the substrate; A drying chamber provided at a lower side of the cleaning chamber, the top of which is opened to allow the substrate to enter and exit, and a drying chamber for drying the substrate having been cleaned; A spin chuck on which the substrate is placed and which rotates and lifts in the cleaning chamber or the drying chamber; And a door formed between the cleaning chamber and the drying chamber to open and close the spin chuck to move up and down, and to close the drying chamber while the substrate is dried.

Here, the door may include a first door formed at an opened lower portion of the cleaning chamber to close the opened lower portion of the cleaning chamber when the substrate is cleaned; And a second door formed in the opened upper portion of the drying chamber to open the opened upper portion of the drying chamber when the substrate is moved in and out.

By configuring as described above, a dry material can be evenly formed on the processing surface of the substrate existing in the drying chamber by the gas present in the cleaning chamber, it is possible to improve the drying efficiency. In addition, by providing a door between the cleaning chamber and the drying chamber it is possible to seal or open the drying chamber depending on the presence or absence of a substrate.

In addition, the cleaning chamber may be connected to a cleaning material supply unit for supplying a cleaning material, the drying chamber may be connected to a dry material supply unit for supplying a dry material. That is, by supplying the cleaning material supplied to the cleaning chamber and the drying material supplied to the drying chamber into an independent space, it is possible to prevent the dry material from being supplied to the drying chamber after passing through the cleaning chamber, in this process It is also possible to prevent the external gas present in the cleaning chamber from mixing with the dry matter.

On the other hand, the cleaning material supply unit is a linear and rotational movement through the open upper portion of the cleaning chamber, it is preferable that the dry material supply unit is capable of moving forward or backward toward the center of the drying chamber. In other words, the cleaning material supply unit is also lifted in accordance with the position of the substrate or the spin chuck to be lifted in the cleaning chamber so that the cleaning material can be accurately supplied to the processing surface of the substrate. In addition, by advancing / retracting toward the center of the drying chamber, the dry matter supply unit may prevent the substrate or spin chuck from colliding with the dry matter supply unit when the substrate is transferred from the cleaning chamber to the drying chamber.

In addition, the sheet type substrate processing apparatus includes: first door opening and closing means formed in the cleaning chamber to open and close the first door; And a second door opening and closing means formed in the drying chamber to open and close the second door. Here, the first door opening and closing means and the second door opening and closing means are preferably operated in conjunction with each other.

On the other hand, the cleaning chamber and the drying chamber may be formed integrally. That is, the drying chamber is formed as a separate part from the opened cleaning chamber, and a door means is provided between the cleaning chamber and the drying chamber to separate the two chambers, and to separate the space in the one-part process chamber. It is also possible to form a cleaning and drying chamber. At this time, it is preferable that the door is formed between the cleaning chamber and the drying chamber so that the spin chuck can linearly move within the cleaning chamber or the drying chamber. In this way, by integrally forming the cleaning chamber and the drying chamber into one component, the configuration of the sheet type substrate processing apparatus can be simplified, and the productivity can be increased.

In addition, the material of the drying chamber is preferably stainless steel. By using stainless steel as the material of the drying chamber in which the substrate rotates at a higher speed than the cleaning process, static electricity or the like can be prevented even when the substrate or the spin chuck rotates at a high speed.

On the other hand, according to another field of the invention, in order to achieve the above object, the present invention, a single-sheet substrate processing method for removing impurities in the substrate, comprising the steps of: loading the substrate into the cleaning chamber of the upper opening; Cleaning the substrate in the cleaning chamber; Opening a first door provided under the cleaning chamber; Opening a second door provided at an upper portion of the drying chamber provided at the lower portion of the cleaning chamber; Transferring the substrate to the drying chamber by lowering the substrate from the cleaning chamber to the drying chamber; Closing the second door to seal the drying chamber; Drying the substrate in the drying chamber; Opening the second door; And unloading the substrate from the drying chamber to an upper side of the cleaning chamber.

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As described above, the present invention is provided with a cleaning chamber in which a chemical liquid and ultrapure water are sprayed, and a drying chamber in which dry materials such as isopropyl alcohol are sprayed, and the drying chamber is formed in a sealed type, so as to bury the processing surface of the substrate. The isopropyl alcohol may be evenly coated on the surface of the ultrapure water, thereby improving the drying efficiency.

In addition, the present invention can prevent the adverse effects of static electricity even when the substrate or spin chuck is rotated at high speed by the material of the drying chamber of the hermetic drying chamber, stainless steel, dry matter such as isopropyl alcohol even at low speed rotation This wrong recovery can be prevented.

In addition, the present invention can provide a separate chamber for cleaning and a chamber for drying, so that the entire system can be maintained even if only one chamber is replaced, thereby improving maintenance convenience of the sheet type substrate processing apparatus.

In addition, the present invention can prevent the wrong recovery of the dry material can extend the service life of the dry material, it is possible to reduce the cost required for maintenance.

Hereinafter, with reference to the accompanying drawings will be described in detail with respect to the configuration and operation according to an embodiment of the present invention. The following description is one of several aspects of the patentable invention and the following description forms part of the detailed description of the invention.

However, in describing the present invention, a detailed description of known functions or configurations will be omitted for clarity of the gist of the present invention.

1 is a perspective view schematically showing a sheet type substrate processing apparatus according to an embodiment of the present invention, and FIG. 2 is a perspective view showing a state in which a cleaning chamber and a drying chamber of the sheet type substrate processing apparatus according to FIG. 1 are separated. 3 and 4 are schematic cross-sectional views of a sheet type substrate processing apparatus according to an embodiment of the present invention. FIG. 3 is a schematic cross-sectional view showing a state in which a substrate is in a cleaning chamber. Is a schematic cross sectional view showing a state in which the substrate is in a drying chamber.

As shown in FIG. 1, the sheet type substrate processing apparatus 100 according to an exemplary embodiment of the present invention includes a cleaning chamber 130 formed at an upper portion thereof and a drying chamber 150 formed at one side of the cleaning chamber. At this time, the cleaning chamber 130 and the drying chamber 150 has a substantially cylindrical shape, the cleaning chamber 130 and the drying chamber 150 is spatially separated. The upper part of the cleaning chamber 130 is open, so that the cleaning chamber 130 has the form of an open chamber. In addition, the cleaning chamber 130 and the drying chamber 150 may be disposed vertically or horizontally. Hereinafter, a case in which the cleaning chamber 130 and the drying chamber 150 are disposed up and down for convenience of description will be described, but is not limited thereto.

The cleaning material is supplied through the opening of the cleaning chamber 130. To this end, the cleaning material supply unit 170 is provided at one side of the cleaning chamber 130. The cleaning material supply unit 170 may include a first chemical supply unit 171 for supplying a first chemical solution, a second chemical supply unit 173 for supplying a second chemical solution, and an ultrapure water supply unit 175 for supplying ultrapure water.

First, the first and second chemical liquid supply parts 171 and 173 may pivot or rotate in a fixed state with respect to the cleaning chamber 130, and the nozzle parts formed at the ends of the first and second chemical liquid supply parts 171 and 173. (Not shown) may be lowered or raised toward the inside of the cleaning chamber 130. In order for the first and second chemical liquid supply parts 171 and 173 to move in this manner, separate chemical liquid supply part driving means (not shown) may be provided.

In addition, the ultrapure water supply unit 175 is mounted at an external point of the cleaning chamber 130, the nozzle portion (not shown) formed at the end may be moved forward or backward toward the open portion of the cleaning chamber 130, To this end, a separate ultrapure water supply unit driving means (not shown) may be provided.

On the other hand, the supply of the chemical liquid and ultrapure water is made in a certain order and the remaining supply portion that does not supply is waiting in the standby position. For example, in FIG. 1, the first chemical solution supply unit 171 is in a position to supply the first chemical solution into the cleaning chamber 130, and the second chemical solution supply unit 173 is in a standby position where the second chemical solution is not supplied. Is in.

Here, the first and second chemical liquid supply parts 171 and 173 and the ultrapure water supply part 175 are connected to the first and second chemical liquid supply sources (not shown) and the ultrapure water supply source (not shown), respectively.

In addition, as shown in FIG. 2, the upper end of the cleaning chamber 130 has an opening 131, and recovery lines 148 and 149 for recovering chemical liquid and ultrapure water are connected to the side wall of the cleaning chamber 130. The drying chamber 150 is positioned below the cleaning chamber 130, and unlike the cleaning chamber 130, the drying chamber 150 performs a drying process in a sealed state. For this, the cleaning chamber 130 and the drying chamber are provided. Preferably, the door 151 is provided between the 150.

The door 151 should be able to be opened enough to allow the substrate to pass through. The door 151 is preferably formed in two parts. Two parts of the door 151 are connected to the door opening and closing means 153 for opening and closing of the door 151, and the door opening and closing means 153 is mounted to the door frame 155.

Here, the door opening and closing means 153 may include a lead screw (not shown), a motor (not shown) for driving it, and a guide part (not shown) for guiding the movement of the door 151. That is, the lead screw is installed to penetrate the door 151, and the door 151 can be moved by driving the motor. In order to automatically control the opening and closing of the door 151, a control unit (not shown) for controlling the current supplied to the motor may be further provided. However, the door opening and closing means 153 is not necessarily limited thereto, and may be variously configured.

Hereinafter, the sheet type substrate processing apparatus 100 according to an embodiment of the present invention will be described in more detail with reference to FIGS. 3 and 4.

3 is a cross-sectional view showing a state in which the substrate W is in the cleaning chamber 130 for the cleaning process.

Referring to FIG. 3, the substrate W is loaded inside the cleaning chamber 130 to remove impurities present in the substrate W. Referring to FIG. Here, the substrate W is cleaned while descending from the top along the height direction of the cleaning chamber 130.

The first or second chemical liquid supply parts 171 and 175 may be located or the ultrapure water supply part 173 may be positioned in the first opening 131 to clean the substrate W. For convenience of description, only the first chemical supply unit 171 is shown in FIGS. 3 and 4.

At this time, the position of the substrate W in the state where the first chemical is supplied, the position of the substrate W in the state where the second chemical is supplied, and the position of the substrate W in the state where ultrapure water is supplied are different from each other. In the sheet type substrate processing apparatus 100 according to the exemplary embodiment of the present invention, the substrate W is at the highest position when the first chemical is supplied, and the substrate W is positioned at the height of the middle when the second chemical is supplied. When ultrapure water is supplied, the substrate W is preferably located at the bottom.

As described above, as the substrate W descends, the nozzle 172 of the first supply unit 171 also descends along the substrate W to supply the cleaning material to the processing surface of the substrate W. As shown in FIG.

Meanwhile, the used first and second chemical liquids and ultrapure water are recovered for reuse, for which the cleaning material recovery unit 140 is formed on the inner surface of the side wall of the cleaning chamber 130.

That is, the cleaning material recovery unit 140 is formed to overlap the inner wall surface of the cleaning chamber 130 vertically. For example, the cleaning material recovery unit 140 may be formed at the top of the first recovery unit 142 for recovering the first chemical solution, and the first recovery unit 142 may be formed under the first recovery unit 142 to recover the second chemical solution. It may include a third recovery unit 146 formed below the second recovery unit 144 and the second recovery unit 144, that is, the bottom of the second recovery unit 144 to recover the ultrapure water. Here, the aforementioned recovery lines 148 and 149 may be connected to the cleaning material recovery unit 140, and the recovery lines 148 and 149 may be connected to the treatment liquid regeneration unit (not shown).

In the cleaning process, the substrate W is supplied with each cleaning material at positions corresponding to the recovery parts 142, 144, and 146. That is, when the first chemical is supplied, the substrate W is supplied with the first chemical at substantially the same height as the height at which the first recovery part 142 is formed. When the second chemical liquid is supplied, the substrate W is supplied with the second chemical liquid at substantially the same height as the height at which the second recovery part 144 is formed. When ultrapure water is supplied, the substrate W is supplied with ultrapure water at almost the same height as the height at which the third recovery portion 146 is formed. As such, by supplying the cleaning material in a state where the substrate W is located at the position corresponding to each of the recovery parts 142, 144, and 146, the cleaning material may be separated and recovered, and the cleaning material may be reused. At this time, the number of recovery portions may be appropriately changed depending on the number of cleaning substances to be recovered.

Here, although it is preferable that the 3rd collection part 146 is provided in the lowest part, it can be surely prevented that ultrapure water flows into another collection part by this structure.

Meanwhile, the substrate W moves linearly along the height direction inside the cleaning chamber 130, and rotates at a high speed during the cleaning process. For this purpose, the support member 120 penetrates through the center portion of the cleaning chamber 130. Is provided.

The support member 120 includes a spin chuck 121 on which the substrate W is seated, a drive shaft 123 for rotating the spin chuck 121, and at the lower end of the drive shaft 123, the drive shaft 123 is rotated and straightened. The driving unit 125 is provided to move. The spin chuck 121 is provided with a chucking pin (not shown) for fixing the substrate (W).

The cleaning of the substrate W proceeds with the first opening 131 of the cleaning chamber 130 opened, and the substrate 130 having been cleaned is a drying chamber 150 provided separately under the cleaning chamber 130. Is passed to. That is, the substrate W may be loaded into the drying chamber 150 by lowering the spin chuck 121 and the driving shaft 122 downward. The cleaning chamber 130 and the drying chamber 150 may have a form surrounding the spin chuck 121.

On the other hand, a second opening 133 is formed in the lower portion of the cleaning chamber 130 to unload the substrate W from the cleaning chamber 130, and the second opening 133 is formed in the second opening 133. A first door 135 for opening and closing is provided.

The lower portion of the cleaning chamber 130 is provided with a drying chamber 150 which is a hermetic drying chamber. In this case, a third opening 152 is provided at an upper portion of the drying chamber 150 facing the first door 135, which is opened and closed by the second door 151. As such, two doors 135 and 151 may be provided to separate the cleaning chamber 130 and the drying chamber 150. In this case, the second door 151 described above with reference to FIG. 2 is provided on the drying chamber 150 side.

Thus, by forming the doors 135 and 151 in the cleaning chamber 130 and the drying chamber 150, respectively, the sealing performance of the drying chamber 150 can be improved. That is, in the process in which the substrate W, which has been cleaned, is transferred from the cleaning chamber 130 to the drying chamber 150, an external gas or the like present in the cleaning chamber 130 flows into the drying chamber 150. You can stop it for sure.

If there is only one door, since the substrate W is transferred from the cleaning chamber 130 to the drying chamber 150 with the door open, external gas, etc., which were in the cleaning chamber 130 through the open door, etc. It is introduced into the drying chamber 150 can reduce the drying efficiency.

However, when there are two doors, it is possible to more reliably prevent the inflow of external gas into the drying chamber 150. First, the substrate W is out of the cleaning chamber 130, but before flowing into the drying chamber 150, only the first door 135 of the cleaning chamber 130 is opened and the second door of the drying chamber 150 is opened. 151 is still closed. After that, when the substrate W is approximately between the cleaning chamber 130 and the drying chamber 150, the first door 135 is closed, and then the second door 151 is opened to open the substrate W. 150). In this case, the external gas of the cleaning chamber 130 may be prevented from entering the drying chamber 150.

On the other hand, when there are two doors are provided with a first door opening and closing means (not shown) for opening and closing the first door 135, the configuration is the same as the configuration of the door opening and closing means 153 described in FIG. desirable. In this case, the first and second doors 135 and 151 may be opened and closed to interlock with each other by the same controller (not shown). As such, by separately providing a chamber for cleaning and a chamber for drying, the whole system can be maintained even if only one chamber is replaced, thereby improving maintenance convenience of the sheet type substrate processing apparatus.

In addition, the cleaning chamber 130 and the drying chamber 150 may be integrally formed. In this case, only one door may be formed between the cleaning chamber 130 and the drying chamber 150. That is, the drying chamber 150 may be formed as a separate component from the cleaning chamber 130 having an open upper portion, and doors 135 and 151 may be provided between the cleaning chamber 130 and the drying chamber 150 to separate the two. In addition, the cleaning chamber 130 and the drying chamber 150 may be formed by partitioning a space in a process chamber or a housing having a single component. At this time, between the cleaning chamber 130 and the drying chamber 150, the spin chuck 121 and the cleaning chamber 130 and the drying chamber 150 so as to linearly move in the cleaning chamber 130 or the drying chamber 150 It is preferable to form one door in between. As described above, by integrally forming the cleaning chamber 130 and the drying chamber 150 as one component, the configuration of the sheet type substrate processing apparatus may be simplified, and the productivity may be increased.

Sealing means (not shown) or bearing means (not shown) for sealing may be formed on the contact surfaces of the drive shaft 123 and the first and second doors 135 and 151.

On the other hand, the side wall of the drying chamber 150 is provided with a dry material supply unit 180 for supplying isopropyl alcohol, etc., the nozzle unit 181 of the dry material supply unit 180 is a dry material as the processing surface of the substrate (W) It extends into the drying chamber 150 to supply the. At this time, the nozzle unit 181 of the dry matter supply unit 180 may move forward or backward toward the center of the drying chamber 150. That is, when the nozzle portion 181 of the dry material supply unit 180 moves forward / reverse toward the center of the drying chamber 150, the substrate W is transferred from the cleaning chamber 130 to the drying chamber 150. (W) or the spin chuck 121 and the nozzle portion 181 may be prevented from colliding with each other.

In addition, the lower portion of the drying chamber 150 is provided with a dry material recovery unit 190 for recovering a dry material such as isopropyl alcohol. Here, the drying chamber 150 is formed of a stainless steel (SUS) material, and since the drying chamber 150 is sealed, external gas cannot affect the drying process.

As such, the drying chamber 150 is hermetically formed and provided separately from the cleaning chamber 130, so that an interface of isopropyl alcohol can be evenly formed on the surface of the ultrapure water (DIW) buried in the processing surface of the substrate W during the drying process. Since the drying efficiency is improved, and the material of the drying chamber 150 is made of stainless steel, even if the substrate W is rotated at high speed, adverse effects due to static electricity can be prevented.

In addition, since dry material recovery units 190 and 192 for recovering dry materials such as isopropyl alcohol are formed under the drying chamber 150, the isopropyl alcohol is recovered to the wrong place even when the substrate W is rotated at a low speed. Can be prevented. That is, when the substrate W rotates at a low speed, isopropyl alcohol may flow down the chucking pin (not shown). In this case, isopropyl alcohol is incorrect because it is recovered through the dry matter recovery units 190 and 192. It can be prevented from entering the recovery part.

On the other hand, the substrate W after the drying process is unloaded from the drying chamber 150 for the next process, for this purpose it is preferable that the drying chamber 150 is provided with a substrate loading / unloading door (not shown). If the substrate W is unloaded through the opening 131 of the cleaning chamber 130 again after the drying is completed, moisture may be generated in the substrate W again by the gas or the like present in the cleaning chamber 130.

Therefore, a throughput (not shown) may be formed in the drying chamber 150 to allow the substrate W to enter and exit.

Hereinafter, a method of processing a substrate using the sheet type substrate processing apparatus 100 according to an embodiment of the present invention will be described with reference to the drawings. 5 is a flowchart illustrating a substrate processing method using a sheet type substrate processing apparatus according to an embodiment of the present invention, and FIG. 6 is a flowchart illustrating a substrate transfer method among the methods according to FIG. 5.

As shown in Figure 5 and 6, the substrate processing method according to an embodiment of the present invention is a step (S110), the cleaning chamber 130 of loading the substrate (W) to the upper cleaning chamber 130 is open Cleaning the substrate (W) at step S120, transferring the cleaned substrate (W) to the drying chamber 150 provided at the lower portion of the cleaning chamber 130 (S130), and drying chamber 150. Single sheet processing including a sealing step (S140), drying the substrate (W) in the drying chamber 150 (S150) and unloading the substrate (W) from the drying chamber 150 (S160) Provide a method.

In addition, the step S130 of transferring the substrate W to the drying chamber 150 further includes opening and closing the doors 135 and 151 provided between the cleaning chamber 130 and the drying chamber 150 (S131 and S133). can do.

Meanwhile, in the step S130 of transferring the substrate W to the drying chamber 130, opening the door S131 provided between the cleaning chamber 130 and the drying chamber 150, and drying the cleaning chamber 130 from the cleaning chamber 130. The spin chuck 121 or the substrate W may be lowered into the chamber 150 (S132) and the doors 135 and 151 may be closed (S133).

Here, it is preferable that the substrate W is loaded through the drying chamber 150 and unloaded from the drying chamber 150. That is, when the substrate W is first loaded into the drying chamber 150, the spin chuck 121 is raised to the cleaning chamber 130 so that the substrate W is loaded into the cleaning chamber 130, and the cleaning chamber 130 is disposed in the cleaning chamber 130. The cleaning process is performed. The cleaning process is performed by spraying the chemical liquid and the ultrapure water while descending along the height of the cleaning chamber 130. The ultrapure water may be supplied when the substrate W is under the cleaning chamber 130.

When the cleaning process is completed, the first door 131 and the second door 151 are opened to transfer the substrate W to the drying chamber 150. As soon as the substrate W enters the drying chamber 150, the second door 151 may be closed to seal the drying chamber 150. The substrate W, which has been dried in the sealed drying chamber 150, is unloaded from the drying chamber 150 for the next process.

In this way, by cleaning and drying the substrate, the drying efficiency can be increased, and ultrapure water and the like can be prevented from being erroneously recovered.

The sheet type substrate processing apparatus and method thereof described so far should be understood as the technical idea of the present invention or the minimum description of the present invention which can be grasped from various viewpoints, and should not be understood as the boundary limiting the present invention.

Although the preferred embodiments of the present invention have been described above by way of example, the scope of the present invention is not limited to these specific embodiments, and may be appropriately changed within the scope of the claims.

1 is a perspective view schematically showing a sheet type substrate processing apparatus according to an embodiment of the present invention;

FIG. 2 is a perspective view illustrating a state in which a cleaning chamber and a drying chamber of the sheet type substrate processing apparatus of FIG. 1 are separated;

3 and 4 are cross-sectional views schematically showing a sheet type substrate processing apparatus according to an embodiment of the present invention.

3 is a schematic cross-sectional view showing a state where the substrate is in the cleaning chamber;

4 is a schematic cross-sectional view showing a state in which a substrate is in a drying chamber;

5 is a flowchart illustrating a substrate processing method using a sheet type substrate processing apparatus according to an embodiment of the present invention;

6 is a flow chart illustrating a substrate transfer method of the method according to FIG. 5.

<Explanation of symbols for the main parts of the drawings>

100: sheet type substrate processing apparatus 120: support member

130: washing chamber 135: first door

140: cleaning material recovery unit 150: drying chamber

151: second door 170: cleaning material supply unit

180: dry matter supply portion W: substrate

Claims (13)

In the sheet type substrate processing apparatus which removes the impurity of a board | substrate, An upper and lower openings to allow the substrate to enter and exit, and a cleaning chamber for cleaning the substrate; A drying chamber provided below the cleaning chamber, the upper portion of which is opened to allow the substrate to enter and exit, and a drying chamber for drying the substrate on which the cleaning is completed; A spin chuck on which the substrate is placed and which rotates and lifts in the cleaning chamber or the drying chamber; And And a door formed between the cleaning chamber and the drying chamber to open and close the spin chuck to move up and down, and to seal the drying chamber while the substrate is dried. The door may include a first door formed at an opened lower portion of the cleaning chamber to close the opened lower portion of the cleaning chamber when the substrate is cleaned; And a second door formed on the opened upper portion of the drying chamber to open the opened upper portion of the drying chamber when the substrate is moved in and out of the substrate. delete The method of claim 1, And a cleaning material supply unit supplying a cleaning material to the cleaning chamber, and a dry material supply unit supplying a dry material to the drying chamber. The method of claim 3, And the cleaning material supply unit linearly and rotates through the opening of the cleaning chamber. The method of claim 3, The sheet material processing apparatus of claim 1, wherein the dry material supply unit is capable of moving forward or backward toward the center of the drying chamber. The method of claim 1, The single wafer type substrate processing apparatus, First door opening and closing means formed in the cleaning chamber to open and close the first door; And Second door opening and closing means formed in the drying chamber to open and close the second door; Sheet type substrate processing apparatus further comprising. The method of claim 1, The single wafer type substrate processing apparatus of claim 1, wherein the cleaning chamber and the drying chamber are integrally formed. The method of claim 7, wherein The single wafer type substrate processing apparatus of claim 1, wherein the cleaning chamber and the drying chamber are spatially separated. delete The method according to any one of claims 1 or 3 to 8, The drying chamber is a sheet type substrate processing apparatus, characterized in that made of stainless steel to prevent the generation of static electricity generated during high speed rotation of the spin chuck. In the single wafer processing method for removing impurities in a substrate, Loading the substrate into the cleaning chamber with the top open; Cleaning the substrate in the cleaning chamber; Opening a first door provided under the cleaning chamber; Opening a second door provided at an upper portion of the drying chamber provided at the lower portion of the cleaning chamber; Transferring the substrate to the drying chamber by lowering the substrate from the cleaning chamber to the drying chamber; Closing the second door to seal the drying chamber; Drying the substrate in the drying chamber; Opening the second door; And Unloading the substrate from the drying chamber to an upper side of the cleaning chamber; Single substrate processing method comprising a. delete delete

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