KR100499601B1 - 개선된 연마용 패드 및 연마 방법 - Google Patents

개선된 연마용 패드 및 연마 방법 Download PDF

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Publication number
KR100499601B1
KR100499601B1 KR10-2000-7001162A KR20007001162A KR100499601B1 KR 100499601 B1 KR100499601 B1 KR 100499601B1 KR 20007001162 A KR20007001162 A KR 20007001162A KR 100499601 B1 KR100499601 B1 KR 100499601B1
Authority
KR
South Korea
Prior art keywords
pad
polishing
thermoforming
workpiece
die
Prior art date
Application number
KR10-2000-7001162A
Other languages
English (en)
Korean (ko)
Other versions
KR20010022571A (ko
Inventor
존 브이. 에이치. 로버츠
촬스 더블유. 젠킨스
데이비드 비. 제임스
Original Assignee
롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드 filed Critical 롬 앤드 하스 일렉트로닉 머티리얼스 씨엠피 홀딩스, 인코포레이티드
Publication of KR20010022571A publication Critical patent/KR20010022571A/ko
Application granted granted Critical
Publication of KR100499601B1 publication Critical patent/KR100499601B1/ko

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24B—MACHINES, DEVICES, OR PROCESSES FOR GRINDING OR POLISHING; DRESSING OR CONDITIONING OF ABRADING SURFACES; FEEDING OF GRINDING, POLISHING, OR LAPPING AGENTS
    • B24B37/00—Lapping machines or devices; Accessories
    • B24B37/11—Lapping tools
    • B24B37/20—Lapping pads for working plane surfaces
    • B24B37/24—Lapping pads for working plane surfaces characterised by the composition or properties of the pad materials
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B24—GRINDING; POLISHING
    • B24D—TOOLS FOR GRINDING, BUFFING OR SHARPENING
    • B24D3/00—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents
    • B24D3/02—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent
    • B24D3/20—Physical features of abrasive bodies, or sheets, e.g. abrasive surfaces of special nature; Abrasive bodies or sheets characterised by their constituents the constituent being used as bonding agent and being essentially organic
    • B24D3/22—Rubbers synthetic or natural
    • B24D3/26—Rubbers synthetic or natural for porous or cellular structure

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Mechanical Treatment Of Semiconductor (AREA)
  • Manufacture Of Macromolecular Shaped Articles (AREA)
  • Finish Polishing, Edge Sharpening, And Grinding By Specific Grinding Devices (AREA)
  • Polishing Bodies And Polishing Tools (AREA)
KR10-2000-7001162A 1997-08-06 1998-08-05 개선된 연마용 패드 및 연마 방법 KR100499601B1 (ko)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
US5490697P 1997-08-06 1997-08-06
US60/054,906 1997-08-06
PCT/US1998/016289 WO1999007515A1 (en) 1997-08-06 1998-08-05 Improved polishing pads and methods relating thereto

Publications (2)

Publication Number Publication Date
KR20010022571A KR20010022571A (ko) 2001-03-26
KR100499601B1 true KR100499601B1 (ko) 2005-07-07

Family

ID=21994291

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-2000-7001162A KR100499601B1 (ko) 1997-08-06 1998-08-05 개선된 연마용 패드 및 연마 방법

Country Status (6)

Country Link
EP (1) EP1011919B1 (id)
JP (1) JP2001513450A (id)
KR (1) KR100499601B1 (id)
CN (1) CN1265618A (id)
DE (1) DE69827147T2 (id)
WO (1) WO1999007515A1 (id)

Families Citing this family (30)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO1998045087A1 (en) * 1997-04-04 1998-10-15 Rodel Holdings, Inc. Improved polishing pads and methods relating thereto
JP3918359B2 (ja) * 1998-05-15 2007-05-23 Ｊｓｒ株式会社 研磨パッド用重合体組成物および研磨パッド
JP4954377B2 (ja) * 2000-02-04 2012-06-13 東洋ゴム工業株式会社 研磨パッド及びその製造方法
DE60109601T2 (de) * 2000-05-27 2006-02-09 Rohm and Haas Electronic Materials CMP Holdings, Inc., Wilmington Rillen-polierkissen zum chemisch-mechanischen planarisieren
US6477926B1 (en) 2000-09-15 2002-11-12 Ppg Industries Ohio, Inc. Polishing pad
US6679769B2 (en) 2000-09-19 2004-01-20 Rodel Holdings, Inc Polishing pad having an advantageous micro-texture and methods relating thereto
SG131737A1 (en) * 2001-03-28 2007-05-28 Disco Corp Polishing tool and polishing method and apparatus using same
US6568997B2 (en) 2001-04-05 2003-05-27 Rodel Holdings, Inc. CMP polishing composition for semiconductor devices containing organic polymer particles
US7214623B2 (en) * 2003-10-13 2007-05-08 International Business Machines Corporation Planarization system and method using a carbonate containing fluid
CN101115779B (zh) 2005-03-08 2012-09-19 东洋橡胶工业株式会社 研磨垫及其制造方法
US8304467B2 (en) 2005-05-17 2012-11-06 Toyo Tire & Rubber Co., Ltd. Polishing pad
JP4884725B2 (ja) 2005-08-30 2012-02-29 東洋ゴム工業株式会社 研磨パッド
JP4898172B2 (ja) * 2005-09-08 2012-03-14 日本ミクロコーティング株式会社 研磨パッド及びその製造方法並びに研磨方法
JP5031236B2 (ja) 2006-01-10 2012-09-19 東洋ゴム工業株式会社 研磨パッド
US20070197132A1 (en) 2006-02-15 2007-08-23 Applied Materials, Inc. Dechuck using subpad with recess
US7963827B2 (en) 2006-07-14 2011-06-21 Saint-Gobain Abrastives, Inc. Backingless abrasive article
CN101489721B (zh) 2006-08-28 2014-06-18 东洋橡胶工业株式会社 抛光垫
JP5008927B2 (ja) 2006-08-31 2012-08-22 東洋ゴム工業株式会社 研磨パッド
JP5078000B2 (ja) 2007-03-28 2012-11-21 東洋ゴム工業株式会社 研磨パッド
JP5314353B2 (ja) * 2008-08-05 2013-10-16 旭ダイヤモンド工業株式会社 超砥粒チップ及び超砥粒工具
US8512427B2 (en) * 2011-09-29 2013-08-20 Rohm And Haas Electronic Materials Cmp Holdings, Inc. Acrylate polyurethane chemical mechanical polishing layer
FR3025741B1 (fr) * 2014-09-15 2019-05-24 Airbus Group Sas Film adhesif multifonctionnel pour la protection de surface de pieces
CN104889874B (zh) * 2015-06-25 2017-08-04 蓝思科技（长沙）有限公司 一种蓝宝石抛光用吸附垫及其制备方法
US10562149B2 (en) 2015-09-25 2020-02-18 Cabot Microelectronics Corporation Polyurethane CMP pads having a high modulus ratio
JP6380333B2 (ja) * 2015-10-30 2018-08-29 株式会社Sumco ウェーハ研磨装置およびこれに用いる研磨ヘッド
CN105538047B (zh) * 2015-12-11 2017-09-22 中国航空工业集团公司北京航空材料研究院 一种航空有机透明制件的表面研抛方法
US20180134918A1 (en) * 2016-11-11 2018-05-17 Jh Rhodes Company, Inc. Soft polymer-based material polishing media
SG11202000259RA (en) * 2017-07-11 2020-02-27 3M Innovative Properties Co Abrasive articles including conformable coatings and polishing system therefrom
CN109794863A (zh) * 2019-03-05 2019-05-24 北京国瑞升精机科技有限公司 一种亲水性抛光膜及其制备方法
CN110744444B (zh) * 2019-10-29 2022-02-15 武汉新芯集成电路制造有限公司 研磨垫及研磨装置

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4129457A (en) * 1977-05-23 1978-12-12 International Business Machines Corporation Post-polishing cleaning of semiconductor surfaces
US4581287A (en) * 1984-06-18 1986-04-08 Creative Products Resource Associates, Ltd. Composite reticulated foam-textile cleaning pad
US4787732A (en) * 1986-04-24 1988-11-29 Nick Siviglia Contact lens and method of making same
US5396737B1 (en) * 1989-01-18 1997-12-23 Minnesota Mining & Mfg Compound glazing or polishing pad
US5007128B1 (en) * 1989-01-18 1993-12-07 Minnesota Mining And Manufacturing Company Compounding,glazing or polishing pad
JP2632738B2 (ja) * 1990-04-27 1997-07-23 信越半導体 株式会社 パッキングパッド、および半導体ウェーハの研磨方法
US5157877A (en) * 1990-04-27 1992-10-27 Shin-Etsu Handotai Co., Ltd. Method for preparing a semiconductor wafer
MY114512A (en) * 1992-08-19 2002-11-30 Rodel Inc Polymeric substrate with polymeric microelements
US5704987A (en) * 1996-01-19 1998-01-06 International Business Machines Corporation Process for removing residue from a semiconductor wafer after chemical-mechanical polishing

Also Published As

Publication number Publication date
CN1265618A (zh) 2000-09-06
WO1999007515A1 (en) 1999-02-18
KR20010022571A (ko) 2001-03-26
DE69827147T2 (de) 2006-03-02
DE69827147D1 (de) 2004-11-25
JP2001513450A (ja) 2001-09-04
EP1011919A4 (en) 2000-11-02
EP1011919A1 (en) 2000-06-28
EP1011919B1 (en) 2004-10-20

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