KR100453861B1 - 웨이퍼 회전식 도금장치 - Google Patents
웨이퍼 회전식 도금장치 Download PDFInfo
- Publication number
- KR100453861B1 KR100453861B1 KR10-2001-0074462A KR20010074462A KR100453861B1 KR 100453861 B1 KR100453861 B1 KR 100453861B1 KR 20010074462 A KR20010074462 A KR 20010074462A KR 100453861 B1 KR100453861 B1 KR 100453861B1
- Authority
- KR
- South Korea
- Prior art keywords
- wafer
- plating
- rotating
- plating apparatus
- mounting head
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
- H01L21/67207—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process
- H01L21/6723—Apparatus for manufacturing or treating in a plurality of work-stations comprising a chamber adapted to a particular process comprising at least one plating chamber
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68764—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by a movable susceptor, stage or support, others than those only rotating on their own vertical axis, e.g. susceptors on a rotating caroussel
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
- H01L21/68714—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support
- H01L21/68785—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches the wafers being placed on a susceptor, stage or support characterised by the mechanical construction of the susceptor, stage or support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Electroplating Methods And Accessories (AREA)
Abstract
Description
Claims (9)
- 도금액이 저장된 도금조 내에서 수직방향으로 웨이퍼를 침적시켜 도금하는 수직형 웨이퍼 도금장치에 있어서,상기 웨이퍼를 도금조 측면에 수직 방향으로 장착하는 웨이퍼 장착 헤드와,상기 웨이퍼 장착 헤드를 회전시킬 수 있도록 설치되는 웨이퍼 회전지그와,상기 웨이퍼 회전지그를 구동할 수 있도록 설치되는 웨이퍼 구동수단과,수직으로 설치된 애노드에 설치되는 애노드 백을 포함하는 것을 특징으로 하는 웨이퍼 회전식 도금장치.
- 제 1 항에 있어서,상기 웨이퍼 회전지그는 도금조의 측벽에 회전가능하게 관통 설치되는 회전축과, 상기 회전축을 베어링 지지할 수 있도록 고정 설치되는 베어링부와, 상기 웨이퍼 장착 헤드까지 전선을 공급하기 위해 상기 회전축 내부에 형성되는 전선 라인부와, 상기 전선 라인부를 통해 전류를 공급할 수 있도록 설치되는 카본 브러쉬부 및 상기 도금조에 관통 결합되는 회전축의 밀봉결합을 위해 설치되는 밀봉부로 이루어지는 것을 특징으로 하는 웨이퍼 회전식 도금장치.
- 제 1 항에 있어서, 상기 구동수단은 구동모터와, 구동모터의 동력을 상기 회전축에 전달하는 동력전달부재로 이루어지는 것을 특징으로 하는 웨이퍼 회전식 도금장치.
- 삭제
- 제 1 항에 있어서,상기 웨이퍼 회전식 도금장치가 무전해 도금 방식의 도금장치에도 이용되는 것을 특징으로 하는 웨이퍼 회전식 도금장치.
- 제 2 항에 있어서, 상기 회전축 중심부에 상기 웨이퍼 장착 헤드의 공압실린더에 공압을 공급해주기 위한 에어라인(Air Line)이 구비되는 것을 특징으로 하는 웨이퍼 회전식 도금장치.
- 제 2 항에 있어서, 상기 베어링부와 카본 브러쉬부가 일체로 구성되며, 상기 회전축 외주연에 길이방향으로 전극이 설치되고, 상기 회전축 외주연에는 회전 접촉될 수 있는 브러쉬가 설치되며, 상기 브러쉬 바깥쪽으로 카본 브러쉬 하우징이 설치되며, 상기 카본 브러쉬 하우징 양단에 베어링이 각각 설치되는 것을 특징으로 하는 웨이퍼 회전식 도금장치.
- 제 2 항에 있어서, 상기 밀봉부는 회전축과 도금조를 실링(Sealing) 해주는 불소로 치환된 탄화수소 재질의 고무로 제작된 오링(O-ring)으로 구성되는 것을 특징으로 하는 웨이퍼 회전식 도금장치.
- 제 2 항 또는 제 6 항에 있어서, 상기 회전축 일단에 상기 공압실린더를 왕복운동시키기 위한 실린더 하우징부가 형성되는 것을 특징으로 하는 웨이퍼 회전식 도금장치.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2001-0074462A KR100453861B1 (ko) | 2001-11-28 | 2001-11-28 | 웨이퍼 회전식 도금장치 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR10-2001-0074462A KR100453861B1 (ko) | 2001-11-28 | 2001-11-28 | 웨이퍼 회전식 도금장치 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20030044109A KR20030044109A (ko) | 2003-06-09 |
KR100453861B1 true KR100453861B1 (ko) | 2004-10-26 |
Family
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Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
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KR10-2001-0074462A KR100453861B1 (ko) | 2001-11-28 | 2001-11-28 | 웨이퍼 회전식 도금장치 |
Country Status (1)
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KR (1) | KR100453861B1 (ko) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010030954A (ko) * | 1998-09-08 | 2001-04-16 | 마에다 시게루 | 기판도금장치 |
KR20010098930A (ko) * | 2000-04-27 | 2001-11-08 | 마에다 시게루 | 회전유지장치 및 반도체기판처리장치 |
-
2001
- 2001-11-28 KR KR10-2001-0074462A patent/KR100453861B1/ko active IP Right Grant
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR20010030954A (ko) * | 1998-09-08 | 2001-04-16 | 마에다 시게루 | 기판도금장치 |
KR20010098930A (ko) * | 2000-04-27 | 2001-11-08 | 마에다 시게루 | 회전유지장치 및 반도체기판처리장치 |
Also Published As
Publication number | Publication date |
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KR20030044109A (ko) | 2003-06-09 |
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