KR100444262B1 - 시료의 처리시스템 - Google Patents

시료의 처리시스템 Download PDF

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Publication number
KR100444262B1
KR100444262B1 KR10-1999-0049121A KR19990049121A KR100444262B1 KR 100444262 B1 KR100444262 B1 KR 100444262B1 KR 19990049121 A KR19990049121 A KR 19990049121A KR 100444262 B1 KR100444262 B1 KR 100444262B1
Authority
KR
South Korea
Prior art keywords
sample
substrate
plate
processing system
separation
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR10-1999-0049121A
Other languages
English (en)
Korean (ko)
Other versions
KR20000035284A (ko
Inventor
야나기타카즈타카
오오미카즈아키
사카구치키요후미
Original Assignee
캐논 가부시끼가이샤
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 캐논 가부시끼가이샤 filed Critical 캐논 가부시끼가이샤
Publication of KR20000035284A publication Critical patent/KR20000035284A/ko
Application granted granted Critical
Publication of KR100444262B1 publication Critical patent/KR100444262B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67155—Apparatus for manufacturing or treating in a plurality of work-stations
    • H01L21/67161—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers
    • H01L21/67167—Apparatus for manufacturing or treating in a plurality of work-stations characterized by the layout of the process chambers surrounding a central transfer chamber
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02—Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/04—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer
    • H01L21/18—Manufacture or treatment of semiconductor devices or of parts thereof the devices having potential barriers, e.g. a PN junction, depletion layer or carrier concentration layer the devices having semiconductor bodies comprising elements of Group IV of the Periodic Table or AIIIBV compounds with or without impurities, e.g. doping materials
    • H01L21/20—Deposition of semiconductor materials on a substrate, e.g. epitaxial growth solid phase epitaxy
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67092—Apparatus for mechanical treatment

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Container, Conveyance, Adherence, Positioning, Of Wafer (AREA)
  • Weting (AREA)
KR10-1999-0049121A 1998-11-06 1999-11-06 시료의 처리시스템 Expired - Fee Related KR100444262B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP31657598A JP4343295B2 (ja) 1998-11-06 1998-11-06 試料の処理システム
JP1998-316575 1998-11-06

Publications (2)

Publication Number Publication Date
KR20000035284A KR20000035284A (ko) 2000-06-26
KR100444262B1 true KR100444262B1 (ko) 2004-08-11

Family

ID=18078631

Family Applications (1)

Application Number Title Priority Date Filing Date
KR10-1999-0049121A Expired - Fee Related KR100444262B1 (ko) 1998-11-06 1999-11-06 시료의 처리시스템

Country Status (5)

Country Link
EP (1) EP0999578A3 (enExample)
JP (1) JP4343295B2 (enExample)
KR (1) KR100444262B1 (enExample)
CN (1) CN1160761C (enExample)
TW (1) TW459299B (enExample)

Families Citing this family (16)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0989593A3 (en) * 1998-09-25 2002-01-02 Canon Kabushiki Kaisha Substrate separating apparatus and method, and substrate manufacturing method
US6672358B2 (en) 1998-11-06 2004-01-06 Canon Kabushiki Kaisha Sample processing system
JP2000150836A (ja) 1998-11-06 2000-05-30 Canon Inc 試料の処理システム
TW484184B (en) 1998-11-06 2002-04-21 Canon Kk Sample separating apparatus and method, and substrate manufacturing method
DE10108369A1 (de) * 2001-02-21 2002-08-29 B L E Lab Equipment Gmbh Verfahren und Vorrichtung zum Ablösen eines Halbleiterwafers von einem Träger
JP2002353081A (ja) 2001-05-25 2002-12-06 Canon Inc 板部材の分離装置及び分離方法
JP2002353423A (ja) 2001-05-25 2002-12-06 Canon Inc 板部材の分離装置及び処理方法
JP4740414B2 (ja) * 2007-04-24 2011-08-03 東京エレクトロン株式会社 基板搬送装置
US8443863B2 (en) * 2008-10-23 2013-05-21 Corning Incorporated High temperature sheet handling system and methods
JP2011047515A (ja) * 2009-07-28 2011-03-10 Canon Anelva Corp 駆動装置及び真空処理装置
JP5538282B2 (ja) * 2010-08-23 2014-07-02 東京エレクトロン株式会社 接合装置、接合方法、プログラム及びコンピュータ記憶媒体
JP5374462B2 (ja) * 2010-08-23 2013-12-25 東京エレクトロン株式会社 剥離システム、剥離方法、プログラム及びコンピュータ記憶媒体
JP6404828B2 (ja) * 2013-11-25 2018-10-17 リソテック ジャパン株式会社 小型回転アームを有する処理室および小型製造装置
JP6612648B2 (ja) * 2016-02-17 2019-11-27 東京応化工業株式会社 支持体分離装置及び支持体分離方法
EP3499556B1 (en) * 2016-08-09 2021-04-07 Kondoh Industries, Ltd. Semiconductor manufacturing apparatus
DE102023122888B4 (de) * 2023-08-25 2025-04-24 Leica Biosystems Nussloch Gmbh Anordnung mit Eindeckautomat und Vorratsbehälter für Eindeckmedium oder Reinigungsbehälter

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR19980046273A (ko) * 1995-12-12 1998-09-15 미타라이 후지오 Soi기판의 제조방법 및 제조장치
KR19990049122A (ko) * 1997-12-11 1999-07-05 오상수 쇽업소버의 충격완화장치
US5934856A (en) * 1994-05-23 1999-08-10 Tokyo Electron Limited Multi-chamber treatment system

Family Cites Families (8)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5292393A (en) * 1986-12-19 1994-03-08 Applied Materials, Inc. Multichamber integrated process system
JPH06268051A (ja) * 1993-03-10 1994-09-22 Mitsubishi Electric Corp ウエハ剥し装置
US5928389A (en) * 1996-10-21 1999-07-27 Applied Materials, Inc. Method and apparatus for priority based scheduling of wafer processing within a multiple chamber semiconductor wafer processing tool
SG55413A1 (en) * 1996-11-15 1998-12-21 Method Of Manufacturing Semico Method of manufacturing semiconductor article
US5855681A (en) * 1996-11-18 1999-01-05 Applied Materials, Inc. Ultra high throughput wafer vacuum processing system
US6382292B1 (en) * 1997-03-27 2002-05-07 Canon Kabushiki Kaisha Method and apparatus for separating composite member using fluid
JPH115064A (ja) * 1997-06-16 1999-01-12 Canon Inc 試料の分離装置及びその方法並びに基板の製造方法
US6321134B1 (en) * 1997-07-29 2001-11-20 Silicon Genesis Corporation Clustertool system software using plasma immersion ion implantation

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5934856A (en) * 1994-05-23 1999-08-10 Tokyo Electron Limited Multi-chamber treatment system
KR19980046273A (ko) * 1995-12-12 1998-09-15 미타라이 후지오 Soi기판의 제조방법 및 제조장치
KR19990049122A (ko) * 1997-12-11 1999-07-05 오상수 쇽업소버의 충격완화장치

Also Published As

Publication number Publication date
EP0999578A2 (en) 2000-05-10
CN1258091A (zh) 2000-06-28
JP2000150610A (ja) 2000-05-30
TW459299B (en) 2001-10-11
KR20000035284A (ko) 2000-06-26
JP4343295B2 (ja) 2009-10-14
CN1160761C (zh) 2004-08-04
EP0999578A3 (en) 2005-04-13

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