KR100388294B1 - 회로기판용 폴리이미드 위에 금속 박막을 증착하는 방법 - Google Patents
회로기판용 폴리이미드 위에 금속 박막을 증착하는 방법 Download PDFInfo
- Publication number
- KR100388294B1 KR100388294B1 KR10-2000-0062949A KR20000062949A KR100388294B1 KR 100388294 B1 KR100388294 B1 KR 100388294B1 KR 20000062949 A KR20000062949 A KR 20000062949A KR 100388294 B1 KR100388294 B1 KR 100388294B1
- Authority
- KR
- South Korea
- Prior art keywords
- polyimide
- thin film
- metal thin
- depositing
- circuit board
- Prior art date
Links
Classifications
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/35—Sputtering by application of a magnetic field, e.g. magnetron sputtering
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/06—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the coating material
- C23C14/14—Metallic material, boron or silicon
-
- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C14/00—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material
- C23C14/22—Coating by vacuum evaporation, by sputtering or by ion implantation of the coating forming material characterised by the process of coating
- C23C14/34—Sputtering
- C23C14/3407—Cathode assembly for sputtering apparatus, e.g. Target
Landscapes
- Chemical & Material Sciences (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Materials Engineering (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Organic Chemistry (AREA)
- Manufacturing Of Printed Wiring (AREA)
Abstract
Description
Claims (5)
- (삭제)
- (삭제)
- (삭제)
- (정정) 회로기판용 폴리이미드 위에 금속 박막을 증착하는 방법에 있어서,회로기판용 폴리이미드에는 100~400W 범위내에서 RF 바이어스 파워(Bias Power)를 변화시키며 인가하고,상기 폴리이미드 표면에 알루미늄(Al), 티타늄(Ti), 탄탈륨(Ta), 크롬(Cr) 또는 지르코늄(Zr)중 어느 하나인 반응성 금속 타겟을 DC 마그네트론(Magnetron) 방식으로 증착시켜 접착층을 형성하며,상기 접착층 표면에 구리(Cu)와 같은 금속 박막을 DC 마그네트론 방식으로 증착함을 특징으로 하는 회로기판용 폴리이미드 위에 금속 박막을 증착하는 방법.
- (정정) 제4항에 있어서, 상기 반응성 금속 타겟에 의해 형성되는 접착층의 두께는 10~100nm 범위로 형성함을 특징으로 하는 회로기판용 폴리이미드 위에 금속 박막을 증착하는 방법.
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1020000050858 | 2000-08-30 | ||
KR20000050858 | 2000-08-30 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20020017892A KR20020017892A (ko) | 2002-03-07 |
KR100388294B1 true KR100388294B1 (ko) | 2003-06-19 |
Family
ID=19686188
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR10-2000-0062949A KR100388294B1 (ko) | 2000-08-30 | 2000-10-25 | 회로기판용 폴리이미드 위에 금속 박막을 증착하는 방법 |
Country Status (1)
Country | Link |
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KR (1) | KR100388294B1 (ko) |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
TWI294155B (en) | 2002-06-21 | 2008-03-01 | Applied Materials Inc | Transfer chamber for vacuum processing system |
KR100813564B1 (ko) * | 2006-09-11 | 2008-03-17 | 배상열 | 전압가변형 박막증착 방법 및 장치 |
CN101827953A (zh) * | 2007-10-10 | 2010-09-08 | 艾细饰株式会社 | 电压可变型薄膜沉积方法及其设备 |
KR101664840B1 (ko) * | 2015-05-29 | 2016-10-11 | 세메스 주식회사 | 기판 처리 장치 |
Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0334431A (ja) * | 1989-06-30 | 1991-02-14 | Fuji Xerox Co Ltd | 半導体装置の配線方法 |
JPH0610125A (ja) * | 1992-06-26 | 1994-01-18 | Sony Corp | 薄膜形成方法 |
JPH06283442A (ja) * | 1993-03-29 | 1994-10-07 | Kawasaki Steel Corp | アルミニウム合金薄膜の形成方法及びその装置 |
US5693197A (en) * | 1994-10-06 | 1997-12-02 | Hmt Technology Corporation | DC magnetron sputtering method and apparatus |
JPH1046332A (ja) * | 1996-07-30 | 1998-02-17 | Nec Corp | 金属薄膜形成装置 |
KR100277849B1 (ko) * | 1996-04-12 | 2001-01-15 | 김영환 | 챔버를 갖는 스퍼터 장치를 이용한 박막형성방법 |
-
2000
- 2000-10-25 KR KR10-2000-0062949A patent/KR100388294B1/ko active IP Right Grant
Patent Citations (6)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPH0334431A (ja) * | 1989-06-30 | 1991-02-14 | Fuji Xerox Co Ltd | 半導体装置の配線方法 |
JPH0610125A (ja) * | 1992-06-26 | 1994-01-18 | Sony Corp | 薄膜形成方法 |
JPH06283442A (ja) * | 1993-03-29 | 1994-10-07 | Kawasaki Steel Corp | アルミニウム合金薄膜の形成方法及びその装置 |
US5693197A (en) * | 1994-10-06 | 1997-12-02 | Hmt Technology Corporation | DC magnetron sputtering method and apparatus |
KR100277849B1 (ko) * | 1996-04-12 | 2001-01-15 | 김영환 | 챔버를 갖는 스퍼터 장치를 이용한 박막형성방법 |
JPH1046332A (ja) * | 1996-07-30 | 1998-02-17 | Nec Corp | 金属薄膜形成装置 |
Also Published As
Publication number | Publication date |
---|---|
KR20020017892A (ko) | 2002-03-07 |
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