KR100359954B1 - 피복아크 용접봉용 도포제 - Google Patents
피복아크 용접봉용 도포제 Download PDFInfo
- Publication number
- KR100359954B1 KR100359954B1 KR1019990062596A KR19990062596A KR100359954B1 KR 100359954 B1 KR100359954 B1 KR 100359954B1 KR 1019990062596 A KR1019990062596 A KR 1019990062596A KR 19990062596 A KR19990062596 A KR 19990062596A KR 100359954 B1 KR100359954 B1 KR 100359954B1
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- South Korea
- Prior art keywords
- coating agent
- arc
- welding
- powder
- graphite
- Prior art date
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- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D1/00—Coating compositions, e.g. paints, varnishes or lacquers, based on inorganic substances
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/04—Carbon
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/40—Glass
-
- C—CHEMISTRY; METALLURGY
- C09—DYES; PAINTS; POLISHES; NATURAL RESINS; ADHESIVES; COMPOSITIONS NOT OTHERWISE PROVIDED FOR; APPLICATIONS OF MATERIALS NOT OTHERWISE PROVIDED FOR
- C09D—COATING COMPOSITIONS, e.g. PAINTS, VARNISHES OR LACQUERS; FILLING PASTES; CHEMICAL PAINT OR INK REMOVERS; INKS; CORRECTING FLUIDS; WOODSTAINS; PASTES OR SOLIDS FOR COLOURING OR PRINTING; USE OF MATERIALS THEREFOR
- C09D7/00—Features of coating compositions, not provided for in group C09D5/00; Processes for incorporating ingredients in coating compositions
- C09D7/40—Additives
- C09D7/60—Additives non-macromolecular
- C09D7/61—Additives non-macromolecular inorganic
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- C—CHEMISTRY; METALLURGY
- C23—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; CHEMICAL SURFACE TREATMENT; DIFFUSION TREATMENT OF METALLIC MATERIAL; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL; INHIBITING CORROSION OF METALLIC MATERIAL OR INCRUSTATION IN GENERAL
- C23C—COATING METALLIC MATERIAL; COATING MATERIAL WITH METALLIC MATERIAL; SURFACE TREATMENT OF METALLIC MATERIAL BY DIFFUSION INTO THE SURFACE, BY CHEMICAL CONVERSION OR SUBSTITUTION; COATING BY VACUUM EVAPORATION, BY SPUTTERING, BY ION IMPLANTATION OR BY CHEMICAL VAPOUR DEPOSITION, IN GENERAL
- C23C4/00—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge
- C23C4/04—Coating by spraying the coating material in the molten state, e.g. by flame, plasma or electric discharge characterised by the coating material
- C23C4/06—Metallic material
-
- C—CHEMISTRY; METALLURGY
- C01—INORGANIC CHEMISTRY
- C01P—INDEXING SCHEME RELATING TO STRUCTURAL AND PHYSICAL ASPECTS OF SOLID INORGANIC COMPOUNDS
- C01P2004/00—Particle morphology
- C01P2004/60—Particles characterised by their size
- C01P2004/61—Micrometer sized, i.e. from 1-100 micrometer
-
- C—CHEMISTRY; METALLURGY
- C08—ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
- C08K—Use of inorganic or non-macromolecular organic substances as compounding ingredients
- C08K3/00—Use of inorganic substances as compounding ingredients
- C08K3/02—Elements
- C08K3/08—Metals
- C08K2003/0812—Aluminium
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- Chemical & Material Sciences (AREA)
- Organic Chemistry (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Engineering & Computer Science (AREA)
- Polymers & Plastics (AREA)
- Health & Medical Sciences (AREA)
- Medicinal Chemistry (AREA)
- Materials Engineering (AREA)
- Inorganic Chemistry (AREA)
- Life Sciences & Earth Sciences (AREA)
- Wood Science & Technology (AREA)
- Physics & Mathematics (AREA)
- Plasma & Fusion (AREA)
- Mechanical Engineering (AREA)
- Metallurgy (AREA)
- Nonmetallic Welding Materials (AREA)
Abstract
Description
구분 | 도포제Flux 조성(중량 %) | Arc스타트성 | Arc안정성 | 용접개시부 결함 | 종합평가 | ||||
흑연 | Al 분말 | Mg-Al분말 | 철분 | ||||||
발명예 | 1 | 90 | 10 | - | - | ◎ | ○ | ○ | ○ |
2 | 93 | 7 | - | - | ◎ | ○ | ○ | ○ | |
3 | 96 | 4 | - | - | ◎ | ◎ | ○ | ◎ | |
4 | 98 | 2 | - | - | ◎ | ◎ | ○ | ◎ | |
5 | 99 | 1 | - | - | ○ | ◎ | ○ | ○ | |
비교예 | 1 | 100 | - | - | - | × | × | × | × |
2 | 85 | 15 | - | - | △ | ○ | ○ | △ | |
3 | 80 | 20 | - | - | △ | △ | × | × | |
4 | 70 | 30 | - | - | △ | △ | × | × | |
5 | 60 | 40 | - | - | × | × | × | × | |
6 | 50 | 50 | - | - | × | × | × | × | |
7 | 90 | - | 10 | - | × | △ | ○ | × | |
8 | 80 | - | 20 | - | △ | △ | ○ | △ | |
9 | 90 | - | - | 10 | × | × | × | × | |
10 | 80 | - | - | 20 | × | × | × | × | |
11 | 70 | - | - | 30 | × | × | × | × |
구 분 | 플럭스조성(중량%) | 고착제몰비 | 도포상태 | 용접개시부 결함 | 종합평가 | ||
흑연 | Al 분말 | ||||||
발명예 | 1 | 95 | 5 | 2.9 | ○ | ○ | ○ |
2 | 3.2 | ○ | ○ | ○ | |||
3 | 3.5 | ○ | ○ | ○ | |||
비교예 | 1 | 2.8 | ○ | △ | △ | ||
2 | 2.5 | ○ | × | × | |||
3 | 3.6 | △ | ○ | △ | |||
4 | 3.8 | × | ○ | × |
Claims (5)
- 분말혼합물과 고착제인 물유리로 구성된 피복아크 용접봉용 도포제에 있어서, 상기 분말혼합물은 중량%로 흑연 90~99%, 알루미늄 분말 1~10%를 포함하여 이루어짐을 특징으로 하는 도포제
- 제 1항에 있어서, 상기 알루미늄 분말이 2~4%임을 특징으로 하는 도포제
- 제 1항 또는 2항에 있어서, 상기 흑연은 그 입경이 44㎛이하인 것이 상기 흑연 전체중량의 90%이상임을 특징으로 하는 도포제
- 제 1항 또는 2항에 있어서, 상기 물유리는 그 몰비[SiO2몰수/(Na2O몰수 + K2O몰수)]가 2.9~3.5인 것을 특징으로 하는 도포제
- 제 4항에 있어서, 상기 물유리는 상기 분말혼합물의 전체중량에 대하여 40~60%범위로 첨가됨을 특징으로 하는 도포제
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019990062596A KR100359954B1 (ko) | 1999-12-27 | 1999-12-27 | 피복아크 용접봉용 도포제 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019990062596A KR100359954B1 (ko) | 1999-12-27 | 1999-12-27 | 피복아크 용접봉용 도포제 |
Publications (2)
Publication Number | Publication Date |
---|---|
KR20010057542A KR20010057542A (ko) | 2001-07-04 |
KR100359954B1 true KR100359954B1 (ko) | 2002-11-04 |
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Application Number | Title | Priority Date | Filing Date |
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KR1019990062596A KR100359954B1 (ko) | 1999-12-27 | 1999-12-27 | 피복아크 용접봉용 도포제 |
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KR (1) | KR100359954B1 (ko) |
Families Citing this family (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US10279435B2 (en) | 2014-06-11 | 2019-05-07 | Lincoln Global, Inc. | Stick electrode |
CN107890975A (zh) * | 2017-11-08 | 2018-04-10 | 山东省科学院海洋仪器仪表研究所 | 适用于水下湿法焊接的防水防潮焊条涂层及其喷涂方法 |
Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58184095A (ja) * | 1982-04-23 | 1983-10-27 | Nippon Steel Weld Prod & Eng Co Ltd | ア−ク溶接用ワイヤ |
JPS594997A (ja) * | 1982-07-02 | 1984-01-11 | Nippon Steel Corp | 低水素系被覆ア−ク溶接棒 |
JPS61216889A (ja) * | 1985-03-22 | 1986-09-26 | Nippon Steel Corp | 被覆ア−ク溶接棒先端塗布剤 |
JPH10202392A (ja) * | 1997-01-21 | 1998-08-04 | Kobe Steel Ltd | 被覆アーク溶接棒用先端塗布剤 |
-
1999
- 1999-12-27 KR KR1019990062596A patent/KR100359954B1/ko active IP Right Grant
Patent Citations (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS58184095A (ja) * | 1982-04-23 | 1983-10-27 | Nippon Steel Weld Prod & Eng Co Ltd | ア−ク溶接用ワイヤ |
JPS594997A (ja) * | 1982-07-02 | 1984-01-11 | Nippon Steel Corp | 低水素系被覆ア−ク溶接棒 |
JPS61216889A (ja) * | 1985-03-22 | 1986-09-26 | Nippon Steel Corp | 被覆ア−ク溶接棒先端塗布剤 |
JPH10202392A (ja) * | 1997-01-21 | 1998-08-04 | Kobe Steel Ltd | 被覆アーク溶接棒用先端塗布剤 |
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KR20010057542A (ko) | 2001-07-04 |
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