KR100288330B1 - 밴드형상영역의중심을서치하는방법 - Google Patents

밴드형상영역의중심을서치하는방법 Download PDF

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Publication number
KR100288330B1
KR100288330B1 KR1019940005384A KR19940005384A KR100288330B1 KR 100288330 B1 KR100288330 B1 KR 100288330B1 KR 1019940005384 A KR1019940005384 A KR 1019940005384A KR 19940005384 A KR19940005384 A KR 19940005384A KR 100288330 B1 KR100288330 B1 KR 100288330B1
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KR
South Korea
Prior art keywords
band
center
region
sample
gravity
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Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Lifetime
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KR1019940005384A
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English (en)
Korean (ko)
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KR940022055A (ko
Inventor
다카하시하루오
하세가와기요시
Original Assignee
핫토리 쥰이치
세이코 인스트루먼트 가부시키가이샤
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Publication of KR940022055A publication Critical patent/KR940022055A/ko
Application granted granted Critical
Publication of KR100288330B1 publication Critical patent/KR100288330B1/ko
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Classifications

    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques
    • G01B11/02—Measuring arrangements characterised by the use of optical techniques for measuring length, width or thickness
    • G—PHYSICS
    • G01—MEASURING; TESTING
    • G01B—MEASURING LENGTH, THICKNESS OR SIMILAR LINEAR DIMENSIONS; MEASURING ANGLES; MEASURING AREAS; MEASURING IRREGULARITIES OF SURFACES OR CONTOURS
    • G01B11/00—Measuring arrangements characterised by the use of optical techniques

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  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Length-Measuring Devices Using Wave Or Particle Radiation (AREA)
  • Analysing Materials By The Use Of Radiation (AREA)
  • Image Analysis (AREA)
KR1019940005384A 1993-03-19 1994-03-17 밴드형상영역의중심을서치하는방법 Expired - Lifetime KR100288330B1 (ko)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP06052493A JP3258118B2 (ja) 1993-03-19 1993-03-19 帯状の試料の中心を検出する方法
JP93-60524 1993-03-19

Publications (2)

Publication Number Publication Date
KR940022055A KR940022055A (ko) 1994-10-20
KR100288330B1 true KR100288330B1 (ko) 2002-02-19

Family

ID=13144793

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019940005384A Expired - Lifetime KR100288330B1 (ko) 1993-03-19 1994-03-17 밴드형상영역의중심을서치하는방법

Country Status (5)

Country Link
US (1) US5425066A (enExample)
JP (1) JP3258118B2 (enExample)
KR (1) KR100288330B1 (enExample)
GB (1) GB2276448B (enExample)
TW (1) TW233340B (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012148520A3 (en) * 2011-02-11 2013-01-17 Quality Vision International, Inc. Tolerance evaluation with reduced measured points

Families Citing this family (13)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2964137B2 (ja) * 1997-04-08 1999-10-18 セイコーインスツルメンツ株式会社 試料中心を検出できる蛍光ｘ線分析装置
RU2180439C2 (ru) 2000-02-11 2002-03-10 Кумахов Мурадин Абубекирович Способ получения изображения внутренней структуры объекта с использованием рентгеновского излучения и устройство для его осуществления
US7804934B2 (en) 2004-12-22 2010-09-28 Jordan Valley Semiconductors Ltd. Accurate measurement of layer dimensions using XRF
US7894312B2 (en) 2005-04-25 2011-02-22 Panasonic Corporation Automatic gain control circuit and signal reproducing device
IL180482A0 (en) * 2007-01-01 2007-06-03 Jordan Valley Semiconductors Inspection of small features using x - ray fluorescence
US9390984B2 (en) 2011-10-11 2016-07-12 Bruker Jv Israel Ltd. X-ray inspection of bumps on a semiconductor substrate
US9389192B2 (en) 2013-03-24 2016-07-12 Bruker Jv Israel Ltd. Estimation of XRF intensity from an array of micro-bumps
US9632043B2 (en) 2014-05-13 2017-04-25 Bruker Jv Israel Ltd. Method for accurately determining the thickness and/or elemental composition of small features on thin-substrates using micro-XRF
JP6305247B2 (ja) * 2014-06-13 2018-04-04 株式会社日立ハイテクサイエンス 蛍光ｘ線分析装置
US9829448B2 (en) 2014-10-30 2017-11-28 Bruker Jv Israel Ltd. Measurement of small features using XRF
JP7562324B2 (ja) 2020-07-03 2024-10-07 株式会社日立ハイテクサイエンス Ｘ線分析装置
DE102021116258A1 (de) 2021-06-23 2022-12-29 Helmut Fischer GmbH Institut für Elektronik und Messtechnik Messobjekt, Verfahren und Vorrichtung zum Betreiben einer Röntgenquelle
CN113945591B (zh) * 2021-09-14 2023-10-24 中国电子科技集团公司第十一研究所 一种半峰宽自动化测试工装

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
DE292540C (enExample) *
JP2748128B2 (ja) * 1988-09-07 1998-05-06 キヤノン株式会社 電子線発生装置
JP2613513B2 (ja) * 1991-11-05 1997-05-28 理学電機工業株式会社 蛍光ｘ線の分析方法
JPH0581700U (ja) * 1992-04-07 1993-11-05 セイコー電子工業株式会社 蛍光ｘ線膜厚測定装置

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2012148520A3 (en) * 2011-02-11 2013-01-17 Quality Vision International, Inc. Tolerance evaluation with reduced measured points
US8447549B2 (en) 2011-02-11 2013-05-21 Quality Vision International, Inc. Tolerance evaluation with reduced measured points

Also Published As

Publication number Publication date
US5425066A (en) 1995-06-13
JPH06273146A (ja) 1994-09-30
KR940022055A (ko) 1994-10-20
JP3258118B2 (ja) 2002-02-18
GB9405402D0 (en) 1994-05-04
GB2276448B (en) 1997-08-06
GB2276448A (en) 1994-09-28
TW233340B (enExample) 1994-11-01

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