KR100208405B1 - 페놀화합물 및 시클릭테르펜의 부가물, 그의 유도체 및 이들의 이용 - Google Patents

페놀화합물 및 시클릭테르펜의 부가물, 그의 유도체 및 이들의 이용 Download PDF

Info

Publication number
KR100208405B1
KR100208405B1 KR1019910008259A KR910008259A KR100208405B1 KR 100208405 B1 KR100208405 B1 KR 100208405B1 KR 1019910008259 A KR1019910008259 A KR 1019910008259A KR 910008259 A KR910008259 A KR 910008259A KR 100208405 B1 KR100208405 B1 KR 100208405B1
Authority
KR
South Korea
Prior art keywords
reaction
adducts
phenol
epoxy
compound
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired - Fee Related
Application number
KR1019910008259A
Other languages
English (en)
Korean (ko)
Other versions
KR910019942A (ko
Inventor
야수유키 무라타
료오헤이 타나카
타쿠야 쿠리오
요시노리 나카니시
후미오 고토오
와사쿠 미네마츠
Original Assignee
알베르투스 빌헬무스 요아네스 ㅔ스트라텐
셀 인터나쵸나아레 레사아치 마아츠샤피 비이.브이.
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Priority claimed from JP2131416A external-priority patent/JP2572293B2/ja
Priority claimed from JP2152845A external-priority patent/JP2981759B2/ja
Priority claimed from JP16417990A external-priority patent/JP2511316B2/ja
Application filed by 알베르투스 빌헬무스 요아네스 ㅔ스트라텐, 셀 인터나쵸나아레 레사아치 마아츠샤피 비이.브이. filed Critical 알베르투스 빌헬무스 요아네스 ㅔ스트라텐
Publication of KR910019942A publication Critical patent/KR910019942A/ko
Application granted granted Critical
Publication of KR100208405B1 publication Critical patent/KR100208405B1/ko
Anticipated expiration legal-status Critical
Expired - Fee Related legal-status Critical Current

Links

Classifications

    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G8/00Condensation polymers of aldehydes or ketones with phenols only
    • C08G8/28Chemically modified polycondensates
    • C08G8/30Chemically modified polycondensates by unsaturated compounds, e.g. terpenes
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C39/00Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring
    • C07C39/02Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring monocyclic with no unsaturation outside the aromatic ring
    • C07C39/06Alkylated phenols
    • CCHEMISTRY; METALLURGY
    • C07ORGANIC CHEMISTRY
    • C07CACYCLIC OR CARBOCYCLIC COMPOUNDS
    • C07C39/00Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring
    • C07C39/12Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings
    • C07C39/17Compounds having at least one hydroxy or O-metal group bound to a carbon atom of a six-membered aromatic ring polycyclic with no unsaturation outside the aromatic rings containing other rings in addition to the six-membered aromatic rings, e.g. cyclohexylphenol
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/02Polycondensates containing more than one epoxy group per molecule
    • C08G59/04Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof
    • C08G59/06Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols
    • C08G59/063Polycondensates containing more than one epoxy group per molecule of polyhydroxy compounds with epihalohydrins or precursors thereof of polyhydric phenols with epihalohydrins
    • CCHEMISTRY; METALLURGY
    • C08ORGANIC MACROMOLECULAR COMPOUNDS; THEIR PREPARATION OR CHEMICAL WORKING-UP; COMPOSITIONS BASED THEREON
    • C08GMACROMOLECULAR COMPOUNDS OBTAINED OTHERWISE THAN BY REACTIONS ONLY INVOLVING UNSATURATED CARBON-TO-CARBON BONDS
    • C08G59/00Polycondensates containing more than one epoxy group per molecule; Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups
    • C08G59/18Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing
    • C08G59/20Macromolecules obtained by polymerising compounds containing more than one epoxy group per molecule using curing agents or catalysts which react with the epoxy groups ; e.g. general methods of curing characterised by the epoxy compounds used
    • C08G59/22Di-epoxy compounds
    • C08G59/226Mixtures of di-epoxy compounds

Landscapes

  • Chemical & Material Sciences (AREA)
  • Organic Chemistry (AREA)
  • Health & Medical Sciences (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Medicinal Chemistry (AREA)
  • Polymers & Plastics (AREA)
  • General Chemical & Material Sciences (AREA)
  • Epoxy Resins (AREA)
  • Phenolic Resins Or Amino Resins (AREA)
  • Epoxy Compounds (AREA)
  • Manufacturing Of Micro-Capsules (AREA)
  • Organic Low-Molecular-Weight Compounds And Preparation Thereof (AREA)
KR1019910008259A 1990-05-23 1991-05-22 페놀화합물 및 시클릭테르펜의 부가물, 그의 유도체 및 이들의 이용 Expired - Fee Related KR100208405B1 (ko)

Applications Claiming Priority (7)

Application Number Priority Date Filing Date Title
JPHEI-2-131416 1990-05-23
JP2-131416 1990-05-23
JP2131416A JP2572293B2 (ja) 1990-05-23 1990-05-23 エポキシ樹脂硬化剤及び硬化性エポキシ樹脂組成物
JPHEI-2-152845 1990-06-13
JP2152845A JP2981759B2 (ja) 1990-06-13 1990-06-13 エポキシ化合物及びエポキシ樹脂組成物
JP16417990A JP2511316B2 (ja) 1990-06-25 1990-06-25 半導体封止用エポキシ樹脂組成物
JPHEI-2-164179 1990-06-25

Publications (2)

Publication Number Publication Date
KR910019942A KR910019942A (ko) 1991-12-19
KR100208405B1 true KR100208405B1 (ko) 1999-07-15

Family

ID=27316305

Family Applications (1)

Application Number Title Priority Date Filing Date
KR1019910008259A Expired - Fee Related KR100208405B1 (ko) 1990-05-23 1991-05-22 페놀화합물 및 시클릭테르펜의 부가물, 그의 유도체 및 이들의 이용

Country Status (7)

Country Link
EP (1) EP0458417B1 (https=)
KR (1) KR100208405B1 (https=)
CA (1) CA2043076A1 (https=)
DE (1) DE69118746T2 (https=)
ES (1) ES2086474T3 (https=)
SG (1) SG54212A1 (https=)
TW (1) TW224474B (https=)

Families Citing this family (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5416138A (en) * 1992-09-24 1995-05-16 Sumitomo Bakelite Company Limited Epoxy resin composition
JP3808542B2 (ja) * 1996-06-26 2006-08-16 ジャパンエポキシレジン株式会社 新規ポリフェノール化合物及びその製造方法
WO2002068495A1 (en) * 2001-02-23 2002-09-06 Nippon Kayaku Kabushiki Kaisha Composition for protective film, method of using the same, and use thereof
JP6137559B2 (ja) * 2014-03-20 2017-05-31 荒川化学工業株式会社 ロジン変性フェノール樹脂、印刷インキ用樹脂ワニス及び印刷インキ
CN107001580A (zh) 2014-12-04 2017-08-01 三菱化学株式会社 四甲基联苯酚型环氧树脂、环氧树脂组合物、固化物和半导体封装材料

Family Cites Families (6)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
FR792623A (fr) * 1934-07-17 1936-01-07 Beckacite Kunstharzfabrik Ges Préparation de produits de condensation résineux
DE712701C (de) * 1934-11-07 1941-10-23 Beckacite Kunstharzfabrik G M Verfahren zur Herstellung von als Lackgrundstoffe geeigneten Phenolaldehydharzen
FR1323858A (fr) * 1962-04-20 1963-04-12 Heyden Newport Chemical Corp Perfectionnements apportés aux produits de condensation terpène-phénol, et aux procédés pour leur préparation
US3692844A (en) * 1968-06-24 1972-09-19 Pennsylvania Ind Chem Corp Process for preparing a terpene phenolic condensation product
FR2307836A1 (fr) * 1975-04-16 1976-11-12 Derives Resiniques Terpenique Procede de preparation de resines terpene-phenol
DE2552175C3 (de) * 1975-11-21 1980-01-24 Hoechst Ag, 6000 Frankfurt Verfahren zur Herstellung hellfarbener Terpenphenole

Also Published As

Publication number Publication date
ES2086474T3 (es) 1996-07-01
EP0458417A3 (en) 1993-03-31
DE69118746T2 (de) 1996-10-31
SG54212A1 (en) 1998-11-16
CA2043076A1 (en) 1991-11-24
KR910019942A (ko) 1991-12-19
DE69118746D1 (de) 1996-05-23
EP0458417A2 (en) 1991-11-27
EP0458417B1 (en) 1996-04-17
TW224474B (https=) 1994-06-01

Similar Documents

Publication Publication Date Title
JP5273762B2 (ja) エポキシ樹脂、エポキシ樹脂組成物およびその硬化物
US6255365B1 (en) Epoxy resin composition for semiconductor encapsulation
JP2769590B2 (ja) エポキシ樹脂組成物
KR100208405B1 (ko) 페놀화합물 및 시클릭테르펜의 부가물, 그의 유도체 및 이들의 이용
JP4100791B2 (ja) ナフトール樹脂の製造法
US5185388A (en) Epoxy resin electrical encapsulation composition
EP0682052A1 (en) Composition of epoxy resins based on condensed polynuclear aromatic compounds
JP3196141B2 (ja) エポキシ樹脂組成物
JP6620981B2 (ja) 熱硬化性成形材料、その製造方法および半導体封止材
JP3894628B2 (ja) 変性エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP3318870B2 (ja) エポキシ樹脂組成物
JP3636409B2 (ja) フェノール類樹脂、エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP2572293B2 (ja) エポキシ樹脂硬化剤及び硬化性エポキシ樹脂組成物
JP2887213B2 (ja) 新規化合物、樹脂、樹脂組成物及び硬化物
JPH05214069A (ja) エポキシ化合物及びエポキシ樹脂組成物
JP3318871B2 (ja) エポキシ樹脂組成物
JP2981759B2 (ja) エポキシ化合物及びエポキシ樹脂組成物
JP2511316B2 (ja) 半導体封止用エポキシ樹脂組成物
JP3141960B2 (ja) 新規エポキシ樹脂、樹脂組成物及び硬化物
JPH10251374A (ja) エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP3886060B2 (ja) エポキシ樹脂、エポキシ樹脂組成物及びその硬化物
JP2004244526A (ja) 新規フェノール樹脂、エポキシ樹脂用硬化剤、及びエポキシ樹脂組成物
JP2808034B2 (ja) ポリエポキシ化合物及びエポキシ樹脂組成物
JP3192471B2 (ja) エポキシ樹脂、樹脂組成物及び硬化物
JP2876304B2 (ja) エポキシ樹脂硬化剤及び硬化性エポキシ樹脂組成物

Legal Events

Date Code Title Description
PA0109 Patent application

St.27 status event code: A-0-1-A10-A12-nap-PA0109

R17-X000 Change to representative recorded

St.27 status event code: A-3-3-R10-R17-oth-X000

PG1501 Laying open of application

St.27 status event code: A-1-1-Q10-Q12-nap-PG1501

A201 Request for examination
PA0201 Request for examination

St.27 status event code: A-1-2-D10-D11-exm-PA0201

E902 Notification of reason for refusal
PE0902 Notice of grounds for rejection

St.27 status event code: A-1-2-D10-D21-exm-PE0902

T11-X000 Administrative time limit extension requested

St.27 status event code: U-3-3-T10-T11-oth-X000

P11-X000 Amendment of application requested

St.27 status event code: A-2-2-P10-P11-nap-X000

P13-X000 Application amended

St.27 status event code: A-2-2-P10-P13-nap-X000

E701 Decision to grant or registration of patent right
PE0701 Decision of registration

St.27 status event code: A-1-2-D10-D22-exm-PE0701

GRNT Written decision to grant
PR0701 Registration of establishment

St.27 status event code: A-2-4-F10-F11-exm-PR0701

PR1002 Payment of registration fee

St.27 status event code: A-2-2-U10-U11-oth-PR1002

Fee payment year number: 1

PG1601 Publication of registration

St.27 status event code: A-4-4-Q10-Q13-nap-PG1601

LAPS Lapse due to unpaid annual fee
PC1903 Unpaid annual fee

St.27 status event code: A-4-4-U10-U13-oth-PC1903

Not in force date: 20020416

Payment event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

PC1903 Unpaid annual fee

St.27 status event code: N-4-6-H10-H13-oth-PC1903

Ip right cessation event data comment text: Termination Category : DEFAULT_OF_REGISTRATION_FEE

Not in force date: 20020416

P22-X000 Classification modified

St.27 status event code: A-4-4-P10-P22-nap-X000