KR0185354B1 - Preheating equipment of automatic molding press for semiconductor package manufacture - Google Patents
Preheating equipment of automatic molding press for semiconductor package manufactureInfo
- Publication number
- KR0185354B1 KR0185354B1 KR1019950065469A KR19950065469A KR0185354B1 KR 0185354 B1 KR0185354 B1 KR 0185354B1 KR 1019950065469 A KR1019950065469 A KR 1019950065469A KR 19950065469 A KR19950065469 A KR 19950065469A KR 0185354 B1 KR0185354 B1 KR 0185354B1
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- preheating
- plate
- molding press
- semiconductor package
- Prior art date
Links
Classifications
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
Abstract
본 발명은 반도체패키지 제조용 자동몰딩프레스의 예일장치에 관한 것으로, 와이어본딩된 리드프레임올 몰딩하기 전에 리드프레임에 일정온도(150℃)로 예열시켜 주는 장치로서, 예열판에 리드프레임이 위치될 때 리드프레임의 상면 일측을 고정하는 고정바를 설치하여 리드프레임이 위로 들뜨는 현상을 방지하고, 리드프레임의 이탈을 방지하는 스톱핑거릍 설치하여 정확한 위치에 리드프레임이 지지고정 되도록 하고, 리드프레임의 진행방향을 체크하는 센서에는 열 전달이 되지 않도록 띄어서 설치하고, 스테핑모터에 의해 180°회전시켜 줌으로 정위치에서 정지하도록 하며, 예열된 리드프레임을 운반할 때 리드프레임의 손상을 방지하여 물량을 없애고, 생산성을 향상시키도록 된 반도체패키지 제조용 자동몰딩프레스의 예일장치이다.The present invention relates to a yale device for an automatic molding press for manufacturing a semiconductor package, wherein the device is preheated to a predetermined temperature (150 ° C.) in a lead frame before molding the wire-bonded lead frame. Install a fixed bar that fixes one side of the upper surface of the lead frame to prevent the lead frame from lifting up, and install a stop finger to prevent the lead frame from falling off so that the lead frame is fixed in the correct position, and the lead frame travel direction. The sensor that checks is installed so that it does not transmit heat, and it rotates by 180 ° by stepping motor to stop at the right position, and removes the quantity by preventing the damage of the lead frame when transporting the preheated lead frame. Yale device of automatic molding press for manufacturing semiconductor package to improve productivity.
Description
제1도는 본 발명이 적용된 자동몰딩프레스의 전체구성을 도시한 정면도1 is a front view showing the overall configuration of the automatic molding press to which the present invention is applied
제2도는 본 발명의 예열장치에 대한 구조를 나타낸 단면도2 is a cross-sectional view showing the structure of the preheating apparatus of the present invention.
제3도는 본 발명의 예열판을 도시한 명면도Figure 3 is a bright side view showing the preheating plate of the present invention
제4도는 본 발명의 예열판의 요부를 나타낸 단면도4 is a cross-sectional view showing the main parts of the preheating plate of the present invention.
제5도는 본 발명의 예열판올 제거한 상태의 명면도Figure 5 is a bright side view of the preheating plate removed state of the present invention
제6도는 본 발명의 스톱핑거에 대한 요부 확대 정면도6 is an enlarged front view of main parts of the stop finger of the present invention;
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
10 : 예열판 11 : 삽입부10: preheating plate 11: insertion portion
12 : 고정바 15 : 푸셔핀12: fixing bar 15: pusher pin
18 : 스톱핑거 20 : 가열판18: stop finger 20: heating plate
21 : 히터 31 : 로테이션로드21: heater 31: rotation rod
32 : 서포트홀더 33 : 로터리 디텍터32: support holder 33: rotary detector
40 : 지지판 41 : 서포트바40: support plate 41: support bar
본 발명은 반도체패키지 제조용 자동몰딩프레스의 예열장치에 관한 것으로, 더욱 상세하게는 와이어본딩된 리드프레임을 몰딩하기 전에 리드프레임을 일정온도(150℃)로 예열시켜 몰딩력을 향상시킴으로써 용이한 몰딩을 할 수 있도록 된 반도체패키지 제조용 자동몰딩프레스의 예열장치에 관한 것이다.The present invention relates to a preheating apparatus for an automatic molding press for manufacturing a semiconductor package, and more particularly, to facilitate molding by preheating the leadframe to a predetermined temperature (150 ° C.) before molding the wirebonded leadframe. The present invention relates to a preheating apparatus for an automatic molding press for manufacturing a semiconductor package.
일반적으로 반도체패키지 제조용 자동몰딩프레스에서 와이어본딩된 리드페레이에 몰딩을 하기위해서는 예열장치에서 리드프레임을 일정온도로 예열시켜 리드프레임에 열팽창이 이루어지도록 함으로써, 몰드다이에서 리드프레임의 정확한 셋팅이 이루어지도록 하고, 또한 몰딩시 몰딩컴파운드가 미리 예열된 리드프레임에 잘 흐르도록 하여 결합력을 향상시킬 수 있도록 한다.In general, in order to mold the lead-bonded wires in the automatic molding press for manufacturing a semiconductor package, the lead frame is preheated to a predetermined temperature in the preheating device so that the thermal expansion occurs in the leadframe, so that the correct setting of the leadframe in the mold die is performed. In addition, during molding, the molding compound flows well in the preheated lead frame to improve the bonding force.
그러나, 종래의 예열장치는 와이어본딩된 리드프레임을 정렬시켜주는 예열판의 가공이 어렵고, 예열판이 일정온도를 유지할 수 있도록 하는 히터가 내장된 기판에 있어서, 리드프레임의 진행방향을 체크하는 센서(Sensor)는 고온(150℃)에 견디어야 하는 고온용 센서를 사용해야 되므로 가격 상승의 용인이 되었고, 예열판을 180°회전시켜주는 회전체 구조는 리드프레임의 유동 및 이탈을 방지하는 고정바가 없어서 예열판이 180°회전되었을때, 리드프레임이 이탈되거나, 실린더가 회전하면서 리드프레임에 충격 및 흔들림을 주게되어 리드프레임을 정확한 위치에 셋팅하기 어렵고, 또한 예열된 리드프레임을 운반하는 그립퍼아암이 리드프레임에 손상을 입히는 경우가 발생되어 제품의 불량을 일으키는 등의 문제점이 있었다.However, the conventional preheating device is difficult to process the preheating plate for aligning the wire-bonded lead frame, and in the substrate with a heater that enables the preheating plate to maintain a constant temperature, the sensor for checking the direction of the lead frame ( Sensor) is a price increase because it must use a high temperature sensor that must withstand high temperature (150 ℃), and the rotating body structure that rotates the preheating plate by 180 ° has no fixed bar to prevent the flow and detachment of the lead frame. When the plate is rotated 180 °, the lead frame is dislodged or the cylinder rotates, causing shock and shaking to the lead frame, making it difficult to set the lead frame in the correct position, and the gripper arm carrying the preheated lead frame There was a problem such as causing damage to the product caused by damage.
따라서, 본 발명은 이와같은 문제점을 해소하기 위하여 발명된 것으로, 예열판에 리드프레임이 위치될 때 리드프레임의 상면 일측을 고정하는 고정바를 설치하여 리드프레임이 위로 들뜨는 현상을 방지하고, 리드프레임의 이탈을 방지하는 스톱핑거를 설치하여 정확한 위치에 리드프레임이 지지고정 되도록 하고, 리드프레임의 진행방향을 체크하는 센서에는 열 전달이 되지 않도록 띄어서 설치하고, 스테핑모터에 의해 180°회전시켜 줌으로 정위치에서 정지하도록 하며, 예열된 리드프레임을 운반할 때 리드프레임의 손상을 방지하여 불량을 없애고, 생산성을 향사시키도록 된 반도체패키지 제조용 자동몰딩프레스의 예열장치를 제공함에 그 목적이 있다.Therefore, the present invention has been invented to solve such a problem, by installing a fixing bar for fixing one side of the upper surface of the lead frame when the lead frame is located on the preheating plate to prevent the lead frame from lifting up, A stop finger is installed to prevent release and the lead frame is fixed at the correct position.The sensor that checks the lead frame's direction of travel is spaced so as not to transmit heat and rotated 180 ° by the stepping motor. An object of the present invention is to provide a pre-heating apparatus for an automatic molding press for manufacturing a semiconductor package, which stops at a position, prevents damage of the lead frame when carrying the preheated lead frame, and improves productivity.
이러한 본 발명의 목적을 달서하기 위해서는 스테핑모터에 의해 회전되는 예열판과, 상기 예열판의 상면에 형성되며 리드프레임이 위치되고, 예열판이 180°회전되었을 때 동일하게 위치되는 두개의 삽입부와, 상기 삽입부의 일측에 형성되며 스프링이 설치되고, 하부에는 링크블럭이 결합되어 위치한 리드프레이의 상면일측을 지지하도록 된 고정바와, 상기 고정바의 하부에 위치되도록 설치되며 링크블럭의 하부를 밀어 고정바를 상부로 개폐시키는 푸셔핀과, 상기 삽입부의 단부에 설치되어 리드프레임의 유·유 및 리드프레임이 제대로 위치되었는지를 감지하는 감지센서와, 상기 삽입부에 리드프레임이 완전히 이송된 후, 리드프레임이 역으로 이탈되는 것을 방지하기 위하여 설치된 스톱핑거와, 상기 삽입부에 위치한 리드프레임을 예열하기 위해 예열판의 하부에 설치되며 히터가 결합된 가열판으로 구성된 것을 특징으로 하는 반도체패키지 제조용 자동몰딩프레스의 예열장치에 의해 가능하다.In order to achieve the object of the present invention, a preheating plate rotated by a stepping motor, the lead frame is formed on the upper surface of the preheating plate is positioned, the two insertion parts are the same position when the preheating plate is rotated 180 °, The fixing bar is formed on one side of the insertion portion and has a spring installed thereon, and a lower fixing bar configured to support one side of the upper surface of the lead play having a link block coupled thereto, and is installed to be positioned below the fixing bar and pushes the lower portion of the link block. A pusher pin for opening and closing to an upper portion, a detection sensor installed at an end of the insertion part to detect whether the lead frame is positioned or not, and a lead frame is completely transferred to the insertion part. To pre-heat the stop finger and the lead frame located in the insertion section to prevent it from falling off It is possible by the preheating device of the automatic molding press for manufacturing a semiconductor package, characterized in that the heating plate is installed on the lower portion of the preheating plate is configured to combine the heater.
이하, 본 발명을 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
제1도는 자동몰딩프레스의 전체구성을 도시한 정면도로서, 몰딩프레스(A)의 일측에는 온로더유니트(B), 예열장치(C), 펠렛로딩유니트(D)를 설치하고, 몰딩프레스(A)의 전방에는 인풋아암유니트를 설치하며, 후방에 아웃풋아암유니트와 크리너를 일체형으로 설치하고, 상기 인풋·아웃풋유니트에는 리드프레임을 집는 그립퍼유니트를 설치하며, 몰딩프레스(A)의 타측에는 디컬링유니트(E), 픽 플레이스유니트(F) 및 언로더유니트(G)가 각각 설치되어 있다.FIG. 1 is a front view showing the overall configuration of an automatic molding press. On one side of the molding press A, an on-loader unit B, a preheating device C and a pellet loading unit D are installed, and a molding press A Input arm unit is installed at the front of the unit, and the output arm unit and the cleaner are integrally installed at the rear, and the gripper unit for holding the lead frame is installed at the input output unit, and the decaling on the other side of the molding press (A). Unit (E), pick place unit (F) and unloader unit (G) are provided respectively.
본 발명의 리드프레임 예열장치(C)는 본딩된 리드프레임(LF)을 몰딩프레스(A)에서 몰딩하기 전에 일정온도(150℃)로 예열하여 주는 장치로서, 제2도에서와 같이 예열판(10)의 상면에는 몰딩된 리드프레임(LF)이 위치되는 삽입부(11)가 두개 형성되어 있고, 상기 삽입부(11)에는 리드프레임(LF)의 상면 일측을 고정하는 고정바(12)가 설치되어 있으며, 상기 예열판(10)의 하부에는 예열판(10)을 일정온도로 가열시키기 위한 히터(21)가 삽입된 가열판(20)이 결합되어 있다.Lead frame preheating apparatus (C) of the present invention is a device for preheating the bonded lead frame (LF) at a predetermined temperature (150 ℃) before molding in the molding press (A), as shown in FIG. 10, two inserting portions 11 are formed on the upper surface of the molded lead frame LF, and the fixing portion 12 fixing the one side of the upper surface of the lead frame LF is formed on the inserting portion 11. The heating plate 20 in which the heater 21 for heating the preheating plate 10 to a predetermined temperature is inserted into the lower portion of the preheating plate 10.
또한, 예열판(10)의 하부에는 고정바(12)를 개폐시키는 푸셔핀(15)이 설치되어 있고, 예열판(10)이 회전할 때 예열판(10)의 떨림을 방지하며 회전할 수 있도록 로테이션로드(31)와 서포트홀더(32)가 서로 결합되어 있으며, 상기 서포트홀더(32)에는 예열판(10)의 하중과 회전할 때 로테이션로드(31)를 가이드할 수 있도록 베어링(34)이 설치되어 있다.In addition, the lower portion of the preheating plate 10 is provided with a pusher pin 15 for opening and closing the fixing bar 12, and when the preheating plate 10 rotates to prevent shaking of the preheating plate 10 can be rotated. The rotation rod 31 and the support holder 32 are coupled to each other, and the support holder 32 has a bearing 34 to guide the rotation rod 31 when rotating with the load of the preheating plate 10. Is installed.
상기 예열판(10)의 방향과 위치를 감지하여 스테핑모터(M)가 정확한 위치를 찾을 수 있도록 로테이션로드(31)의 하단부에는 센서(S1)가 감지되는 로터리 디텍터(33)를 결합하였다. 이러한 예열장치(C)는 지지판(40)에 결합되어 있고, 이 지지판(40)은 서포트바(41)에 의해 지지되어 있다.The rotary detector 33, which senses the sensor S1, is coupled to the lower end of the rotation rod 31 to detect the direction and position of the preheating plate 10 so that the stepping motor M can find the correct position. This preheating device C is coupled to the support plate 40, and the support plate 40 is supported by the support bar 41.
도면중 미설명부호 22는 히터(21)에 의해 가열되는 열을 하부로 전달되지 않도록 하는 단열판을 시도한다.In the drawing, reference numeral 22 attempts a heat insulating plate to prevent heat transferred by the heater 21 from being lowered.
제3도는 본 발명의 예열판(10)에 대한 평면도를 도시한 것으로, 예열판(10)의 상면에 형성된 삽입부(11)의 일측으로 리드프레임(LF)이 이송되는 위치에 일치되는데, 상기 삽입부(11)의 선단에는 리드프레임(LF)의 원활한 이송을 위해 베어링(19)이 설치되어 있고, 상기 삽입부(11)의 길이방향과 고정바(12)의 길이방향으로는 다수의 홈(16)이 형성되어 그립퍼(도시되지 않음)에 의해 리드프레임(LF)을 양호하게 집을 수 있도록 하며, 삽입부(11)의 단부에는 감지센서(S2)를 결합하여 이 센서에서 리드프레임(LF)의 유·무 리드프레임(LF)이 뒤집히지 않고 제대로 위치되었는지 검사하는 것이다. 또한, 상기 두개의 삽입부(11)는 예열판(10)이 180°회전되었을 때 동일한 위치에 오도록 형성되어 있다.3 is a plan view of the preheating plate 10 of the present invention, which corresponds to a position where the lead frame LF is transferred to one side of the insertion part 11 formed on the upper surface of the preheating plate 10. A bearing 19 is installed at the tip of the insertion portion 11 for smooth transfer of the lead frame LF, and a plurality of grooves are provided in the longitudinal direction of the insertion portion 11 and the longitudinal direction of the fixing bar 12. 16 is formed to allow the lead frame LF to be picked up well by a gripper (not shown), and the sensor part S2 is coupled to the end of the inserting portion 11 to lead frame LF in this sensor. ) Is to check if the lead frame (LF) is properly positioned without being flipped. In addition, the two insertion portions 11 are formed to be in the same position when the preheating plate 10 is rotated 180 °.
제4도는 예열판(10)의 단면도로서, 삽입부(11)에 설치된 고정바(12)는 하부에 링크블럭(13)이 하부일측을 지점으로 회전되도록 설치되어 있고, 이 링크블럭(13)의 하부에서 상기한 푸셔핀(15)이 밀어서 동작시키므로 고정바(12)를 개폐할 수 있는 것이며, 상기 고정바(12)에는 스프링(14)이 설치되어 있어 푸셔핀(15)에 의해 고정바(12)가 개방된 후, 푸셔핀(15)이 하강하게 되면 상기 스프링(14)에 의해 고정바(12)가 원위치로 복원되는 것이다. 이때, 상기 푸셔핀(15)의 최선단은 예열판(10) 보다 아래에 위치하고 있어야 예열판(10)의 회전이 가능한 것이고, 상기 예열판(10)이 180°회전되어 두개의 삽입부(11)에 모두 리드프레임(LF)이 위치되면 푸셔핀(15)이 상승하여 링크블럭(13)을 동작시켜 고정바(12)를 개방하는 것이다.4 is a cross-sectional view of the preheating plate 10, the fixing bar 12 provided in the insertion portion 11 is installed in the lower portion so that the link block 13 is rotated to the lower side to the point, this link block 13 Since the pusher pin 15 is pushed to operate at the lower portion of the pusher pin 15, the fixing bar 12 can be opened and closed, and the fixing bar 12 is provided with a spring 14 to fix the bar by the pusher pin 15. After the 12 is opened and the pusher pin 15 is lowered, the fixing bar 12 is restored to its original position by the spring 14. At this time, the uppermost end of the pusher pin 15 should be located below the preheating plate 10 so that the preheating plate 10 can be rotated, and the preheating plate 10 is rotated 180 ° so that the two inserting portions 11 can be rotated. When the lead frame LF is positioned at both ends, the pusher pin 15 is raised to operate the link block 13 to open the fixing bar 12.
제6도는 예열판(10)에 형성된 삽입부(11)에 리드프레임(LF)이 완전히 이송된 후, 리드프레임(LF)이 역으로 이탈되는 것을 방지하기 위하여 설치된 스톱핑거(18)에 대한 확대도로서, 상기 스톱핑거(18)는 자유낙하 되도록 힌지결합 되어 있으며 리드프레임(LF)이 진행되면서 리드프레임(LF)에 의해 스톱핑거(18)가 상부로 회전되어 리드프레임(LF)의 진행이 완료되면 스톱핑거(18)는 자유낙하 하여 원위치로 복원되어 리드프레임(LF)이 역으로 빠지는 것을 방지한다.6 is an enlarged view of the stop finger 18 installed to prevent the lead frame LF from being reversed after the lead frame LF is completely transferred to the insertion portion 11 formed in the preheating plate 10. As shown in FIG. 2, the stop finger 18 is hinged to free fall, and as the lead frame LF progresses, the stop finger 18 is rotated upward by the lead frame LF, thereby advancing the lead frame LF. When completed, the stop finger 18 is free fall and restored to its original position to prevent the lead frame LF from falling out.
이와같이 구성된 본 발명의 예열장치(C)는 리드프레임(LF)이 예열판(10)의 삽입부(11)로 슬라이딩되어 위치되면 스톱핑거(18)에 의해 역으로 이탈이 방지되며, 고정바(12)에 의해 상부로 들뜨는 현상이 없이 정확한 위치에 있는 것이다. 이와같이 리드프레임(LF)이 하나의 삽입부(11)에 위치되면 스테핑모터(M)에 의해 예열판(10)을 정확하게 180°회전시켜 나머지 삽입부(11)에도 리드프레임(LF)을 위치시키는 것이다.The preheating apparatus C of the present invention configured as described above is prevented from being separated by the stop finger 18 when the lead frame LF is slid to the insertion part 11 of the preheating plate 10 and fixed bars ( 12) is in the correct position without lifting up. As such, when the lead frame LF is positioned at one inserting portion 11, the preheating plate 10 is rotated precisely by 180 ° by the stepping motor M to position the lead frame LF at the other inserting portion 11. will be.
상기 예열판(10)에 두개의 리드프레임(LF)이 모두 삽입되면, 그립퍼에 의해 리드프레임(LF)을 집어서 몰딩프레스(A)에 위치시키기 위하여 상기 예열판(10)을 90°회전시킨다. 이때, 상기 리드프레임(LF)을 히터(21)에 의해 일정온도(150°)로 예열시켜 주는 것이다.When both lead frames LF are inserted into the preheating plate 10, the preheating plate 10 is rotated by 90 ° in order to pick up the lead frame LF by a gripper and to position the molding press A. FIG. . At this time, the lead frame LF is preheated to a predetermined temperature (150 °) by the heater 21.
이때, 리드프레임(LF)이 예열되어 열팽창이 되어도 고정바(12)와 스톱핑거(18)에 의해 리드프레임(LF)이 들뜨거나 유동이 발생되지 않는 것이며, 그립퍼에 의해 리드프레임(LF)이 운반될 때는 푸셔핀(15)에 의해 고정바(12)를 개방함으로 상부로 용이하게 리드프레임(LF)을 들어 운반할 수 있으므로 리드프레임(LF)에 손상 및 변형을 방지할 수 있다.At this time, even when the lead frame LF is preheated and thermally expanded, the lead frame LF is not lifted or flow is generated by the fixing bar 12 and the stop finger 18, and the lead frame LF is caused by the gripper. When transported, the lead frame LF can be easily lifted and transported upward by opening the fixing bar 12 by the pusher pin 15, thereby preventing damage and deformation to the lead frame LF.
이상의 설명에서와 같이 본 발명은 와이어본딩된 리드프레임을 예열할 때 리드프레임의 변형 및 손상을 방지하여 불량을 방지하고, 이송을 원할히하여 몰딩작업시 리드프레임을 용이하게 공급할 수 있어 생산성을 향상시킬 수 있는 효과가 있다.As described above, the present invention prevents deformation and damage of the lead frame when preheating the wire-bonded lead frame, prevents defects, and smoothly feeds the lead frame during molding, thereby improving productivity. It can be effective.
Claims (4)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950065469A KR0185354B1 (en) | 1995-12-29 | 1995-12-29 | Preheating equipment of automatic molding press for semiconductor package manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950065469A KR0185354B1 (en) | 1995-12-29 | 1995-12-29 | Preheating equipment of automatic molding press for semiconductor package manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970053149A KR970053149A (en) | 1997-07-29 |
| KR0185354B1 true KR0185354B1 (en) | 1999-04-15 |
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Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950065469A KR0185354B1 (en) | 1995-12-29 | 1995-12-29 | Preheating equipment of automatic molding press for semiconductor package manufacture |
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| Country | Link |
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| KR (1) | KR0185354B1 (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7173181B2 (en) | 2002-11-08 | 2007-02-06 | Joon-Young Park | Coupling set for connecting ground plate for arrest of lightning |
| KR100815134B1 (en) * | 2006-10-16 | 2008-03-20 | 세크론 주식회사 | Preheating device for semiconductor device, and method for preheating semiconductor device using the same |
| KR20210124786A (en) | 2020-04-07 | 2021-10-15 | 유재현 | Grounding device for distribution lines |
| KR20220051491A (en) | 2020-10-19 | 2022-04-26 | 유재현 | Leadless grounding device of distribution line and its construction method |
| KR20220063589A (en) | 2020-11-10 | 2022-05-17 | 유재현 | Construction method of the leadless grounding device for distribution lines |
-
1995
- 1995-12-29 KR KR1019950065469A patent/KR0185354B1/en not_active IP Right Cessation
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US7173181B2 (en) | 2002-11-08 | 2007-02-06 | Joon-Young Park | Coupling set for connecting ground plate for arrest of lightning |
| KR100815134B1 (en) * | 2006-10-16 | 2008-03-20 | 세크론 주식회사 | Preheating device for semiconductor device, and method for preheating semiconductor device using the same |
| KR20210124786A (en) | 2020-04-07 | 2021-10-15 | 유재현 | Grounding device for distribution lines |
| KR20220051491A (en) | 2020-10-19 | 2022-04-26 | 유재현 | Leadless grounding device of distribution line and its construction method |
| KR20220063589A (en) | 2020-11-10 | 2022-05-17 | 유재현 | Construction method of the leadless grounding device for distribution lines |
Also Published As
| Publication number | Publication date |
|---|---|
| KR970053149A (en) | 1997-07-29 |
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