JP3636000B2 - Test board posture changing device - Google Patents

Description

[0001]
BACKGROUND OF THE INVENTION
The present invention is installed in an IC device test apparatus for testing / measuring the electrical characteristics of an IC device (integrated circuit element), and converts the posture of a test board on which many IC devices are mounted. It is related with the attitude | position change apparatus of a test board.
[0002]
[Prior art]
An apparatus for testing / measuring the electrical characteristics of an IC device includes an IC tester and an IC handler, and the IC handler includes a loader unit, a test / measurement unit, and an unloader unit. In the loader section, a large number of IC devices are installed in a device storage jig such as a tray, and a predetermined number of IC devices are transferred to a test board suitable for testing and measuring with appropriate handling means. The test board is transported to the test / measurement unit. The test / measurement unit is provided with contact / separation means for positioning the test board and contacting / separating the test board with the test head of the IC tester. Accordingly, the IC device is connected to the socket of the test head while being placed on the test board transported to the test / measurement unit, and the electrical characteristics are tested / measured by energizing the IC device. After the test on the IC device is completed, the test board is transported to the unloader unit, and the IC devices are classified and stored in a tray or the like based on the test result.
[0003]
In order to efficiently test an IC device, each IC device is connected to the IC tester at the same time while a large number of IC devices are placed on the test board. In general, a loader unit, a test / measurement unit, and an unloader unit are arranged on the horizontal conveyance path. In other words, after the IC device to be tested by the loader unit is transferred to the test board, the test board is transported horizontally to be sent to the test / measurement unit, and the test board is positioned at a predetermined position. The tester is connected to the test head, and after the test is completed, the process moves to the unloader section along the horizontal conveyance path and the unloading work is performed. Therefore, the IC tester is arranged at the upper or lower position of the horizontal conveyance path for conveying the test board, and each IC device placed on the test board is placed in the socket of the test head depending on whether the test board is pushed up or lowered. It comes to connect.
[0004]
However, if the IC tester and the transfer surface of the test board on the horizontal transfer path in the IC handler are arranged above and below, the overall height of the apparatus becomes large. In recent years, various IC device packaging methods and sizes have been used, and the IC device test apparatus is configured to test several types or sizes of IC devices. It is common. Therefore, when testing different IC devices, some members constituting the apparatus must be replaced. As for the IC tester, some members such as an interface board in the test head are exchanged. However, if the IC tester is arranged at a high place, it is difficult to change the test head. In particular, since the replacement member is quite heavy, the higher the position of the IC tester, the more difficult the setup change operation. Further, when the transport surface of the test board is disposed on the upper part of the IC tester, the lower side of the test board must be connected to the test head of the IC tester. For this reason, it is impossible to directly contact the leads of the IC device. Therefore, the test board has a complicated structure such that an electrode for connecting to the contact portion of the test head must be provided on the test board. In addition, it is conceivable to invert the test board and connect it to the test head, but in that case, loading and unloading operations, that is, setting the tray on which the IC device to be tested is placed in the loader unit, the unloader unit performs the test. There is a problem in that it is troublesome to take out the tray in which the finished IC device is stored.
[0005]
In consideration of the above points, in Japanese Patent Application Laid-Open No. 9-152466, the test board is transported to the test / measurement unit in a vertical state, and the test board is unloaded from the test / measurement unit. The composition is shown. Accordingly, the test board can be brought into and out of contact with the test head of the IC tester while the test board is kept in a vertical state. If comprised in this way, an IC tester and the conveyance surface of a test board can be arrange | positioned in the substantially same height position. Here, in this test apparatus according to the prior art, each IC device mounted on the test board is heated to the set temperature in the front stage of the test / measurement unit because of the relationship of testing the IC device under a predetermined temperature condition. Alternatively, a preheating portion for cooling is provided, and a defroster portion for returning the temperature of the IC device and the test board to a state close to the outside air temperature is provided after the test / measurement portion.
[0006]
By configuring in this way, that is, by placing the IC tester at substantially the same height as the IC handler, a setup change operation when testing different types of IC devices, a tray setting and removal operation, Furthermore, maintenance work for the entire apparatus can be easily performed.
[0007]
Here, in the loader unit, an IC device to be tested is transferred from the tray or the like to the test board, and in the unloader unit, the tested IC device must be transferred from the test board to the tray or the like. Since this operation is normally performed by handling means for vacuum-sucking the package portion of the IC device, the test board needs to be in a horizontal state. For this reason, in the above-described known test apparatus, the loader unit and the unloader unit are arranged above the vertical conveyance path of the test board, and the test board is loaded before the test board is loaded from the loader unit to the preheat unit. Is rotated from the horizontal state to the vertical state to reverse the posture, and after the test board is carried out from the defroster unit, the vertical state is returned to the horizontal state. As means for changing the posture of the test board, there is provided a chuck means for chucking the end of the test board, a reversing shaft is connected to the chuck means, and the reversing shaft is reciprocally rotated 90 ° by a rotary cylinder. It is said.
[0008]
[Problems to be solved by the invention]
By the way, since the test board has as many IC devices as possible mounted thereon, most part of the test board is used as the IC device mounting portion, and the width of the peripheral margin is made as small as possible. Of course, the chuck means needs to chuck the margin portion so that the chuck means does not come into contact with the IC device mounting portion. Therefore, the area of the contact portion of the chuck means with respect to the test board is extremely small. Become. As a result, the chuck of the test board by the chuck means becomes unstable, and the test board may be removed during the reversing operation. In particular, a large test board is used to increase the number of IC devices placed on the test board, and the IC devices are tested and measured in a heated or cooled state while placed on the test board. In order to suppress heat loss, when the test board is made as thin as possible, the test board is easily deformed. Accordingly, when the test board is cantilevered by the chuck means and reversed, the balance becomes extremely poor and the stability is further lowered. In addition, in order to stabilize the test board, it is possible to sandwich the test board from the left and right using a pair of chuck means, but when an external force is applied to the test board in this way, a thin test board is formed. There is a possibility of deformation.
[0009]
The present invention has been made in view of the above points, and the object of the present invention is to change the posture smoothly and surely in a stable state without applying a special external force to the test board. There is to be able to do it.
[0010]
[Means for Solving the Problems]
In order to achieve the above-described object, the present invention is an apparatus for changing a posture of a test board on which a predetermined number of IC devices are installed between a horizontal state and a vertical state, and a pair of left and right support members By mounting a plurality of guide rollers rotatably on the opposite surfaces of the test board, one side is an entrance part for carrying in the test board, and the other side is an exit part for carrying out the test board. A reversing unit that forms a board passage through which the test board is inserted, is disposed at a position spaced apart from the guide roller by substantially the thickness of the test board, and includes a fall prevention roller for the test board, and the support member And a reversing drive member for reversing and driving the board path of the reversing unit between a horizontal position and a vertical position. Inlet of the board path and that it has a structure comprising a shutter member for opening and closing at least one of the outlet and its features.
[0011]
Here, there are a case where the posture of the test board is changed from the horizontal state to the vertical state and a case where the posture is changed from the vertical state to the horizontal state by the reversing unit described above. When the posture is changed from the horizontal state to the vertical state, the shutter member is provided on the entrance side of the board passage, and the fall prevention roller is disposed in the vicinity of the exit portion of the board passage. The shutter member is configured to bend so as to face the surface of the test board opposite to the contact portion with the guide roller when the board passage entrance is closed, and the reversing unit is in a vertical state. A lifter that pushes up the test board located in the board passage is provided at a lower position at that time. Further, a stopper is provided for elastically contacting the test board at an extended line position of the exit portion of the board passage when the reversing unit is in a horizontal state, and when the test board is fed into the board passage, the entrance portion It is desirable to make contact with this stopper at a position passing through the stopper, and it is more desirable that the stopper be made of an air cylinder.
[0012]
DETAILED DESCRIPTION OF THE INVENTION
Hereinafter, embodiments of the present invention will be described with reference to the drawings. In the embodiment described below, the IC device test apparatus shown in FIG. 1 is provided, and the test board on which a large number of IC devices are mounted is changed from the horizontal state to the vertical state and from the vertical state to the horizontal state. Although what is changed is illustrated, it is needless to say that the posture changing device of the test board of the present invention can be applied to other devices.
[0013]
First, before describing an IC device test apparatus, an example of a test board for transporting an IC device is shown in FIGS. Thus, in FIG. 2, reference numeral 1 denotes a test board. This test board 1 has four socket installation openings 1a in which a large number of sockets 2 (4 × 16 = 64 in the example shown in FIG. 2) are mounted. It is formed over the columns. A margin of a predetermined width is formed around the test board 1 as the outer peripheral frame portion 1b. Positioning holes 3 and 3 are formed in the outer peripheral frame portion 1b so as to penetrate in the thickness direction at two positions on the upper and lower sides. As shown in FIG. 3, the socket 2 is supported by support shafts 4 and 4 provided in the socket installation opening 1 a of the test board 1, and a stopper portion 4 a is connected to the support shaft 4. The socket 2 can be moved by a slight distance in the thickness direction of the test board 1 between a position contacting the surface of the test board 1 and a position contacting the stopper portion 4a.
[0014]
Although not shown, the socket 2 is provided with a positioning wall for positioning the IC device 5 (hereinafter simply referred to as the device 5) and two clamping claws 6 for clamping the package portion. The clamp claw 6 can be rotated around the shaft 7. The clamp claw 6 is provided with a device presser 6a for pressing the package part of the device 5 and a release pressing part 6b for pressing the device presser 6a in a direction away from the device 5. The position between the device pressing portion 6a and the release pressing portion 6b is supported on the shaft 7 so as to be swingable in the vertical direction. A spring 8 acts on the clamp claw 6, and the device pressing portion 6 a is urged by the spring 8 in a direction in which the device 5 is clamped. Therefore, when the device 5 is clamped by the clamp claws 6, the device 5 is stably held at a predetermined position without being displaced even when the test board 1 is vertical or the front and back are reversed. .
[0015]
Here, when testing the electrical characteristics of the device 5, the test board 1 conveys a large number of devices 5 in a state where they are positioned in a predetermined position in the test apparatus, and is also connected to the test head of the IC tester. The device carrier means which exhibits the function for contacting and separating 5 is configured. On the other hand, outside the apparatus, the device 5 is installed in a state of being aligned with a predetermined jig. As this jig, a tray in which a concave portion for accommodating the device 5 with a short pitch interval in the vertical and horizontal directions is usually formed on a flat plate member. Here, the tray simply holds the device 5 in an aligned state and accommodates as many as possible, and the device 5 is accurately positioned by the above-described clamp claw 6 in that the device 5 is not particularly positioned in the recess. It is a member different from the test board 1 configured as described above.
[0016]
An IC device test apparatus for testing and measuring the electrical characteristics of the device 5 placed on the test board 1 having the above configuration will be described with reference to FIG. In the figure, 10 is a loader unit, 11 is a preheating unit, 12 is a test / measurement unit, 13 is a defroster unit, and 14 is an unloader unit. The loader unit 10 is provided with a plurality of trays 15 on which a plurality of devices 5 to be tested are stacked. The devices 5 are taken out from the trays 15 and placed in the sockets 2 of the test board 1. The In the unloader unit 14, the device 5 that has been tested is taken out of the test board 1 and transferred to the tray 16 after being classified according to the test result. Here, the tray 15 installed in the loader unit 10 and the tray 16 installed in the unloader unit 14 may have different structures or the same structure. . In short, a tray in which the device 5 is stored in advance is set in the loader unit 10, and an empty tray is set in the unloader unit 14.
[0017]
In the IC device test apparatus described above, the device 5 is set to a predetermined temperature state, and the electrical characteristics are tested and measured. For this purpose, the test head 17 faces the preheating unit 11 and the test / measurement unit 12, and a contact mechanism 18 that contacts and separates the test board 1 in two stages is disposed on the test head 17. In addition, the test / measurement unit 12 is provided in a thermostatic chamber 19, and the thermostatic chamber 19 heats the device 5 to, for example, 100 ° C. or higher, or cools the device 5 to −50 ° C. or lower. Can be tested. Even in the intermediate temperature range within this range, all devices 5 are tested under substantially the same temperature conditions if temperature control is performed using a thermostatic bath. The defroster unit 13 is a chamber maintained at a temperature state intermediate between the test temperature and the outside air temperature.
[0018]
The test board 1 is a means for transporting the device 5 in this test apparatus, and the test board 1 is configured from the loader unit 10 to the preheating unit 11 and the test / measurement unit 12 as indicated by arrows in FIG. Then, the process proceeds to the unloader unit 14 through the defroster unit 13 and returns to the loader unit 10 after the unloading operation in the unloader unit 14 is completed. Therefore, the test board 1 circulates in the apparatus. The posture of the test board 1 is in a horizontal state in the loader unit 10 and the unloader unit 14 and is transported in a vertical state from the preheating unit 11 through the test / measurement unit 12 to the defroster unit 13. A loader unit 10 for performing a loading operation, that is, a task for transferring the device 5 from the tray 15 to the test board 1; In the section 14, the test board 1 is disposed at substantially the same height as the trays 15 and 16.
[0019]
When the horizontal plane on which the test board 1 is located during loading and unloading operations is H, the preheating unit 11 is located above the horizontal plane H, and the defroster unit 13 is located below the horizontal plane H. . In the test / measurement unit 12, the two test boards 1 are simultaneously brought into and out of contact with the contact mechanism 18 of the test head 17, and the two test boards 1, 1 are vertically moved across the horizontal plane H. Will be placed.
[0020]
From the above, as the movement trajectory of the test board 1, the loader unit 10 is held in the horizontal state at the height position of the horizontal plane H, and the posture is changed to the vertical state when moving to the preheating unit 11. Ascend to a position higher than the horizontal plane H. Since the two test boards 1 and 1 are tested and measured simultaneously, after moving to the test and measurement unit 12, the test board is lowered from the upper position of the horizontal plane H to the lower position, and further held at the lower position from the horizontal plane H. When moving to the defroster unit 13 and moving from the defroster unit 13 to the unloader unit 14, the posture is changed from the vertical state to the horizontal state and returned to the height position of the general horizontal plane H.
[0021]
The test board posture changing device is provided in a transition part from the loader part 10 to the preheating part 11 and a transition part from the defroster part 13 to the unloader part 14. 4 to 7, a test board posture changing device provided at a transition portion from the loader unit 10 to the preheating unit 11 will be described.
[0022]
First, in FIG. 4, 20 is a board reversing unit for reversing the test board 1 90 degrees from the horizontal state to the vertical state, and 21 is a lifter. Further, 22 is a horizontal conveying belt, and 23 is a pushing cylinder. The horizontal conveyance belt 22 is a conveyance means for carrying out the test board 1 from the loader unit 10, and the test board 1 conveyed by the horizontal conveyance belt 22 is further accommodated in the board reversing unit 20 by the pushing cylinder 23. ing.
[0023]
As shown in FIG. 5 and FIG. 6 in addition to FIG. 4, the board reversing unit 20 has left and right support plate bodies 24, 24 as support members, and both the support plates 24, 24 are bridged. The member 24a holds the gap so as to be constant. A plurality of guide rollers 25 are rotatably mounted on both support plates 24 so as to face each other, and these guide rollers 25 are arranged in a line substantially in the same plane as the conveyance surface by the horizontal conveyance belt 22. The board path 26 indicated by the arrow in FIG. 6 is formed by the guide roller 25 where the test board 1 travels. In this board passage 26, the side facing the conveyor belt 22 is an inlet part 26 a into which the test board 1 is carried in, and the opposite end part is an outlet part 26 b through which the test board 1 is carried out.
[0024]
A fall prevention roller 27 is rotatably provided at an upper position separated from the guide roller 25 by a distance slightly wider than the thickness dimension of the test board 1. When the test board 1 is fed into the board reversing unit 20 by the pushing cylinder 23, the left and right side portions of the outer peripheral frame portion 1b of the test board 1 are received by the guide rollers 25. Further, a stopper cylinder 28 for preventing overrun is disposed oppositely at a front position in the board reversing unit 20 in the feeding direction of the test board 1, that is, a position away from the outlet portion 26b by a predetermined distance. The test board 1 is held so as not to jump out of the board reversing unit 20. The stopper cylinder 28 is an air cylinder and constitutes a stopper that elastically contacts the test board 1. A stopper body 28 a is attached to the rod of the stopper cylinder 28. The stopper main body 28a is preferably made of an elastic member, and is disposed at a position that is a predetermined dimension away from the length dimension of the test board 1 from the inlet portion 26a of the board passage 26 in the board reversing unit 20 in the most extended position.
[0025]
The left and right support plate bodies 24 in the board reversing unit 20 are provided with extended portions 24b, and an inverted shaft 29 is connected to both the extended portions 24b and 24b. An operating plate 30 is attached to the reversing shaft 29. A long hole 30a is formed in the operating plate 30, and a drive pin 31a provided at the tip of the push shaft 31 is engaged with the long hole 30a. When the push shaft 31 is rotationally displaced in the direction of the arrow in FIG. 4, the board reversing unit 20 is reversed so as to be in a vertical state as shown in FIG. As a result, the posture of the test board 1 received in the board reversing unit 20 is changed from the horizontal state to the vertical state. Therefore, the reversing drive member is constituted by the reversing shaft 29, the operating plate 30, the pushing shaft 31 and the like.
[0026]
Here, when the board reversing unit 20 receives the test board 1, the inlet portion 26 a of the board passage 26 must be open. On the other hand, since the entrance 26a is directed downward during reversal, the test board 1 will fall off during reversal if it is kept open. For this purpose, a shutter plate 32 that can be opened and closed is provided at the inlet portion 26 a in the board passage 26 of the board reversing unit 20. The front end of the shutter plate 32 is a bent portion 32a bent approximately 90 °, and the shutter plate 32 is connected to a plate-like lever 33. An intermediate position of the lever 33 is supported by one support plate 24 at a shaft support 34 so as to be swingable, and a driving cylinder 35 is connected to the other end. Therefore, by operating the driving cylinder 35, the shutter plate 32 opens the receiving side of the board reversing unit 20, receives the test board 1 (the state shown in FIG. 4), and closes the receiving side. Thus, the test board 1 received at the time of reversal can be displaced to an operating state (the state shown in FIG. 7) that holds the test board 1 so as not to drop off. As a result, the test board 1 in the board reversing unit 20 has one side surface separated by the guide roller 25 and the other side surface separated from the guide roller 25 by a distance slightly larger than the thickness dimension of the test board 1. Since the fall prevention roller 27 provided at the position, the shutter plate 32, and the bent portion 32a of the shutter plate 32 go around the contact surface side to the fall prevention roller 27, the test board 1 is surely held in the vertical state. .
[0027]
In addition, after the test board 1 is received, when the shutter plate 32 is displaced to the operating state, the test board 1 stops in contact with the stopper cylinder 28 so as not to interfere with the received test board 1. The position to be moved is a front position from the movement locus of the shutter plate 32. Further, when the board reversing unit 20 is reversed, the reversing operation can be performed without any trouble by reducing the stopper cylinder 28.
[0028]
When the test board 1 is reversed by the board reversing unit 20 to be in a vertical state, it is positioned below the horizontal plane H. On the other hand, the preheating part 11 in the thermostat 19 is located above the horizontal plane H. Therefore, the test board 1 is pushed up to the position of the preheating portion 11. This work is performed by the lifter 21. The lifter 21 is connected to the rod 36 a of the push-up cylinder 36. When the rod 36 a of the push-up cylinder 36 is extended, the test board 1 is taken out from the board reversing unit 20 and moves to the preheating unit 11. The lifter 21 contacts the test board 1 at a position different from the position where the shutter plate 32 contacts. The preheating part 11 is provided in the thermostat 19, and, for example, a pitch feeding means is provided in order to send the test board 1 pushed up by the lifter 21 to the preheating part 11.
[0029]
Next, the inversion operation of the test board 1 will be described. First, the board passage 26 in the board reversing unit 20 is set in a horizontal state. Further, the stopper main body 28a of the stopper cylinder 28 is projected. Further, the shutter plate 32 is held in a state where the inlet portion 26a of the board passage 26 is opened. When the test board 1 is transported to a predetermined position by the horizontal transport belt 22, the board passage 26 in the board reversing unit 20 is positioned on an extension line of the transport path of the horizontal transport belt 22. Therefore, the push-in cylinder 23 is operated to transfer the test board 1 from the horizontal conveyance belt 22 to the board reversing unit 20. The board reversing unit 20 is provided with a guide roller 25, and when the test board 1 travels in the board passage 26, the outer peripheral frame portion 1 b of the test board 1 is guided by the guide roller 25, and the test board 1 Since the guide roller 25 rolls according to the progress, the test board 1 smoothly moves into the board passage 26. In addition, the contact position of the guide roller 25 to the test board 1 is the outer peripheral frame portion 1b, and is held in a non-contact state with the portion where the socket 2 is installed.
[0030]
The test board 1 that has advanced from the inlet portion 26a in the board passage 26 moves to a position where the tip portion passes through the outlet portion 26b and contacts the stopper main body 28a. Accordingly, the base end portion of the test board 1 is disposed at a position deeper than the entrance portion 26a. Since the stopper body 28a is connected to a stopper cylinder 28 made of an air cylinder, even if the test board 1 is pressed against the stopper body 28a, it is possible to prevent a load from acting on the test board 1 due to the cushioning action of air. . Further, if the stopper main body 28a is made of an elastic body such as rubber, the test board 1 can be further protected.
[0031]
In a state where the test board 1 has moved to a position where it has overrun by a predetermined distance in the board passage 26, the push-in cylinder 23 is returned and the stopper cylinder 28 is reduced. In this state, by operating the driving cylinder 35, the shutter plate 32 is displaced to a position where the inlet portion 26a of the board passage 26 is closed. At this time, since the test board 1 is overrun in the board passage 26, the test board 1 does not collide with the test board 1 when the shutter plate 32 is displaced. Therefore, the stop position of the test board 1 in the board passage 26 is set so as not to interfere with the base end portion when the shutter plate 32 is operated, but this overrun amount is not so large.
[0032]
When the entrance 26a of the board passage 26 is closed by the shutter plate 32, the operation plate 30 is rotated by pushing the push shaft 31. As a result, the reversing shaft 29 is reversed, so that the board reversing unit 20 that has been in the horizontal state is rotated 90 ° downward, so that the posture of the test board 1 is converted to the vertical state. At this time, the test board 1 in an overrun state in the board passage 26 is lowered to a position where it contacts the shutter plate 32. The test board 1 is located between the plurality of guide rollers 25 and the fall prevention roller 27, and the bent portion 32a of the shutter plate 32 comes to the fall prevention roller 27 side. By setting the dimensions slightly larger than the thickness of the test board 1, the test board 1 is stably held in a substantially vertical state.
[0033]
Therefore, by operating the push-up cylinder 36 and raising the lifter 21, the test board 1 is detached from the board reversing unit 20 as shown by the phantom line in FIG. The transfer path to the section 11 can be shifted. As a result, the transition from the horizontal conveyance path on the loader unit 10 side to the vertical conveyance path on the preheat unit 11 side does not require an external force such as a special load to be applied to the test board 1 and is smooth and sure in a stable state. Can be done.
[0034]
The board reversing unit 20 having the above configuration can also be used to change the posture of the test board 1 from the vertical state to the horizontal state. In this case, as shown in FIG. 7, when the board reversing unit 20 is in the vertical state, the test board 1 is received and the test board 1 is turned 90 ° in the state shown in FIG. Sent out. Here, the outlet portion 26b when the test board 1 is changed from the horizontal state to the vertical state is the inlet portion in this case. Further, the exit portion of the test board 1 can be an entrance portion 26a. In this case, the shutter plate 32 is attached. And it can also take out from the entrance side of the test board 1 in a perpendicular state. In this case, the shutter plate is not necessarily openable / closable. Further, it is desirable to provide a calling portion for allowing the test board 1 to accurately enter the board passage 26 of the board reversing unit 20 on the entrance side in the vertical state. A member corresponding to the lifter 21 serves as a means for carrying the test board 1 into the board reversing unit 20, and a member equivalent to the push-in cylinder 23 functions as a means for carrying out the test board 1.
[0035]
【The invention's effect】
Since the present invention is configured as described above, there is an effect that the posture can be changed smoothly and surely in a stable state without applying a special external force to the test board.
[Brief description of the drawings]
FIG. 1 is an overall configuration diagram showing an IC device test apparatus provided with a posture changing apparatus for a test board according to the present invention.
FIG. 2 is a plan view of a test board.
3 is a cross-sectional view taken along line XX in FIG.
FIG. 4 is an explanatory diagram of a configuration of a test board attitude changing device;
FIG. 5 is a plan view of FIG. 4;
FIG. 6 is an external perspective view of a posture changing device for a test board.
7 is an operation explanatory diagram of a test board posture changing device showing an operation state different from that in FIG. 4; FIG.
[Explanation of symbols]
1 Test board 1a Socket opening
1b Outer frame 2 Socket
5 IC device 20 Board reversing unit
21 Lifter 22 Horizontal conveyor belt
23 Push cylinder 24 Support plate
25 Guide roller 26 Board passage
26a Inlet part 26b Outlet part
27 Roll-over prevention roller 28 Stopper cylinder
28a Stopper body 29 Reverse shaft
30 Actuating plate 31 Push shaft
32 Shutter plate 32a Bent part
33 Lever 34 Shaft support
35 Cylinder for driving

Claims (5)

A device for changing the posture of a test board on which a predetermined number of IC devices are installed between a horizontal state and a vertical state, and a plurality of guide rollers can be freely rotated on opposing surfaces of a pair of left and right support members By attaching to the test board, the one side is an inlet part into which the test board is carried in, and the other side is an outlet part from which the test board is carried out, forming a board passage for guiding and inserting both side parts of the test board, The reversing unit is disposed at a position approximately spaced apart from the guide roller by the thickness of the test board, and is provided with a reversing unit provided with a fall prevention roller for the test board, and connected to the support member. a position where the, the inversion driving member for inverting drive on the position to be vertical, at least one of the inlet and outlet portions of the prior SL board passage opening Posture changing device of the test board, characterized in that a configuration and a shutter member.   The reversing unit is for changing the posture from a horizontal conveyance path for conveying the test board in a horizontal state to a vertical state, and the shutter member is provided on the inlet side of the board passage, The fall prevention roller is disposed in the vicinity of the exit portion of the board passage, and the shutter member is opposite to the contact portion of the test board with the guide roller when it closes the entrance portion of the board passage. It is configured to bend so as to face the side surface, and is provided with a lifter that pushes up the test board located in the board passage at a lower position when the reversing unit is in a vertical state. The test board posture changing apparatus according to claim 1.   When the reversing unit is in a horizontal state, a stopper is provided to elastically contact the test board at an extended line position of the outlet portion of the board passage, and when the test board is fed into the board passage, the inlet 3. The test board posture changing device according to claim 2, wherein the posture changing device is configured to abut against the stopper at a position passing through the portion.   4. The test board posture changing apparatus according to claim 3, wherein the stopper comprises an air cylinder.   2. The test board posture changing apparatus according to claim 1, wherein the reversing unit changes the posture of the test board from a vertical state to a horizontal state.

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