KR970053149A - Preheating device of automatic molding press for manufacturing semiconductor package - Google Patents

Preheating device of automatic molding press for manufacturing semiconductor package Download PDF

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Publication number
KR970053149A
KR970053149A KR1019950065469A KR19950065469A KR970053149A KR 970053149 A KR970053149 A KR 970053149A KR 1019950065469 A KR1019950065469 A KR 1019950065469A KR 19950065469 A KR19950065469 A KR 19950065469A KR 970053149 A KR970053149 A KR 970053149A
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KR
South Korea
Prior art keywords
lead frame
preheating
semiconductor package
molding press
automatic molding
Prior art date
Application number
KR1019950065469A
Other languages
Korean (ko)
Other versions
KR0185354B1 (en
Inventor
김정율
Original Assignee
황인길
아남산업 주식회사
정헌태
아남정공 주식회사
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
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Publication date
Application filed by 황인길, 아남산업 주식회사, 정헌태, 아남정공 주식회사 filed Critical 황인길
Priority to KR1019950065469A priority Critical patent/KR0185354B1/en
Publication of KR970053149A publication Critical patent/KR970053149A/en
Application granted granted Critical
Publication of KR0185354B1 publication Critical patent/KR0185354B1/en

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Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67242—Apparatus for monitoring, sorting or marking
    • H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67706—Mechanical details, e.g. roller, belt
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
    • H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
    • H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/495—Lead-frames or other flat leads

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
  • Injection Moulding Of Plastics Or The Like (AREA)

Abstract

본 발명은 반도체패키지 제조용 자동몰딩프레스의 예일장치에 관한 것으로, 와이어본딩된 리드프레임올 몰딩하기 전에 리드프레임에 일정온도(150℃)로 예열시켜 주는 장치로서, 예열판에 리드프레임이 위치될 때 리드프레임의 상면 일측을 고정하는 고정바를 설치하여 리드프레임이 위로 들뜨는 현상을 방지하고, 리드프레임의 이탈을 방지하는 스톱핑거릍 설치하여 정확한 위치에 리드프레임이 지지고정 되도록 하고, 리드프레임의 진행방향을 체크하는 센서에는 열 전달이 되지 않도록 띄어서 설치하고, 스테핑모터에 의해 180°회전시켜 줌으로 정위치에서 정지하도록 하며, 예열된 리드프레임을 운반할 때 리드프레임의 손상을 방지하여 물량을 없애고, 생산성을 향상시키도록 된 반도체패키지 제조용 자동몰딩프레스의 예일장치이다.The present invention relates to a yale device for an automatic molding press for manufacturing a semiconductor package, wherein the device is preheated to a predetermined temperature (150 ° C.) in a lead frame before molding the wire-bonded lead frame. Install a fixed bar that fixes one side of the upper surface of the lead frame to prevent the lead frame from lifting up, and install a stop finger to prevent the lead frame from falling off so that the lead frame is fixed in the correct position, and the lead frame travel direction. The sensor that checks is installed so that it does not transmit heat, and it rotates by 180 ° by stepping motor to stop at the right position, and removes the quantity by preventing the damage of the lead frame when transporting the preheated lead frame. Yale device of automatic molding press for manufacturing semiconductor package to improve productivity.

Description

반도체패키지 제조용 자동몰딩프레스의 예열장치Preheating device of automatic molding press for manufacturing semiconductor package

본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.

제1도는 본 발명이 적용된 자동몰딩프레스의 전체구성을 도시한 정면도1 is a front view showing the overall configuration of the automatic molding press to which the present invention is applied

Claims (4)

스테핑모터에 의해 회전되는 예열판과, 상기 예열판의 상면에 형성되며 리드프레임이 위치되고, 예열판이 180°회전되었을 때 동일하게 위치되는 두개의 삽입부와, 상기 삽입부의 일측에 형성되며 스프링이 설치되고, 하부에는 링크블럭이 결합되어 위치한 리드프레임의 상면일측을 지지하도록 된 고정바와, 상기 고정바의 하부에 위치되도록 설치되며 링크블럭의 하부를 밀어 고정바를 상부로 개폐시키는 푸셔핀과, 상기 삽입부의 단부에 설치되어 리드프레임의 유·무 및 리드프레임이 제대로 위치되었는지를 감지하는 감지센서와, 상기 삽입부에 리드프레임이 완전히 이송된 후, 리드프레임이 역으로 이탈되는 것을 방지하기 위하여 설치된 스톱핑거와, 상기 삽입부에 위치한 리드프레임을 예열하기 위해 예열판의 하부에 설치되며 히터가 결합된 가열판으로 구성된 것을 특징으로 하는 반도체패키지 제조용 자동몰딩프레스의 예열장치.The preheating plate rotated by the stepping motor, the lead frame is formed on the upper surface of the preheating plate, the two inserts are positioned equally when the preheating plate is rotated 180 °, and the spring is formed on one side of the insert It is installed, the fixing bar to support one side of the upper surface of the lead frame is coupled to the link block, the pusher pin is installed so as to be located in the lower portion of the fixing bar and push the lower of the link block to open and close the fixing bar to the top, and A detection sensor installed at the end of the insertion part to detect the presence or absence of the lead frame and the proper position of the lead frame, and to prevent the lead frame from being reversed after the lead frame is completely transferred to the insertion part. A stop finger and a heater installed in the lower part of the preheating plate for preheating the lead frame located in the insertion part. Preheating apparatus of an automatic molding press for manufacturing a semiconductor package, characterized in that consisting of a hot plate. 제1항에 있어서, 상기 예열판이 회전할 때 예열판의 떨림을 방지하며 회전할 수 있도록 로테이션로드와 서포트홀더가 결합된 것을 특징으로 하는 반도체패키지 제조용 자동몰딩프레스의 예열장치.The preheating apparatus of claim 1, wherein the rotation rod and the support holder are coupled to each other to prevent the preheating plate from being shaken while the preheating plate is rotated. 제1항과 2항에 있어서, 상기 예열판의 방향과 위치를 감지하여 스테핑모터가 정확한 위치를 찾을 수 있도록 로테이션로드의 하단부에 설치되어 센서가 감지되는 로터리 디렉터가 결합된 것을 특징으로 하는 반도체패키지 제조용 자동몰딩프레스의 예열장치.The semiconductor package according to claim 1 or 2, wherein a rotary director is installed at a lower end of the rotation rod to detect the direction and position of the preheating plate so that the stepping motor can find the correct position. Preheating device for automatic molding press for manufacturing. 제1항에 있어서, 상기 예열판의 상명에 형성된 삽입부에 리드프레임의 원할한 이송을 위하여 베어링이 설치된 것을 특징으로 하는 반도체패키지 제조용 자동몰딩프레스의 예열장치.The preheating apparatus of an automatic molding press for manufacturing a semiconductor package according to claim 1, wherein a bearing is provided for a smooth transfer of the lead frame to an insertion portion formed on the upper surface of the preheating plate. ※ 참고사항 : 최초출원 내용에 의하여 공개하는 것임.※ Note: The disclosure is based on the initial application.
KR1019950065469A 1995-12-29 1995-12-29 Preheating equipment of automatic molding press for semiconductor package manufacture KR0185354B1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR1019950065469A KR0185354B1 (en) 1995-12-29 1995-12-29 Preheating equipment of automatic molding press for semiconductor package manufacture

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Application Number Priority Date Filing Date Title
KR1019950065469A KR0185354B1 (en) 1995-12-29 1995-12-29 Preheating equipment of automatic molding press for semiconductor package manufacture

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KR970053149A true KR970053149A (en) 1997-07-29
KR0185354B1 KR0185354B1 (en) 1999-04-15

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Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100815134B1 (en) * 2006-10-16 2008-03-20 세크론 주식회사 Preheating device for semiconductor device, and method for preheating semiconductor device using the same

Families Citing this family (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR200302418Y1 (en) 2002-11-08 2003-02-05 박준영 Fastener Set for Lightning Plate.
KR102369778B1 (en) 2020-04-07 2022-03-03 유재현 Grounding device for distribution lines
KR102449609B1 (en) 2020-10-19 2022-10-04 유재현 Leadless grounding device of distribution line and its construction method
KR102479371B1 (en) 2020-11-10 2022-12-20 유재현 Construction method of the leadless grounding device for distribution lines

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
KR100815134B1 (en) * 2006-10-16 2008-03-20 세크론 주식회사 Preheating device for semiconductor device, and method for preheating semiconductor device using the same

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Publication number Publication date
KR0185354B1 (en) 1999-04-15

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