KR970053149A - Preheating device of automatic molding press for manufacturing semiconductor package - Google Patents
Preheating device of automatic molding press for manufacturing semiconductor package Download PDFInfo
- Publication number
- KR970053149A KR970053149A KR1019950065469A KR19950065469A KR970053149A KR 970053149 A KR970053149 A KR 970053149A KR 1019950065469 A KR1019950065469 A KR 1019950065469A KR 19950065469 A KR19950065469 A KR 19950065469A KR 970053149 A KR970053149 A KR 970053149A
- Authority
- KR
- South Korea
- Prior art keywords
- lead frame
- preheating
- semiconductor package
- molding press
- automatic molding
- Prior art date
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67242—Apparatus for monitoring, sorting or marking
- H01L21/67259—Position monitoring, e.g. misposition detection or presence detection
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67098—Apparatus for thermal treatment
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67706—Mechanical details, e.g. roller, belt
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
- H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
- H01L23/495—Lead-frames or other flat leads
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Injection Moulding Of Plastics Or The Like (AREA)
Abstract
본 발명은 반도체패키지 제조용 자동몰딩프레스의 예일장치에 관한 것으로, 와이어본딩된 리드프레임올 몰딩하기 전에 리드프레임에 일정온도(150℃)로 예열시켜 주는 장치로서, 예열판에 리드프레임이 위치될 때 리드프레임의 상면 일측을 고정하는 고정바를 설치하여 리드프레임이 위로 들뜨는 현상을 방지하고, 리드프레임의 이탈을 방지하는 스톱핑거릍 설치하여 정확한 위치에 리드프레임이 지지고정 되도록 하고, 리드프레임의 진행방향을 체크하는 센서에는 열 전달이 되지 않도록 띄어서 설치하고, 스테핑모터에 의해 180°회전시켜 줌으로 정위치에서 정지하도록 하며, 예열된 리드프레임을 운반할 때 리드프레임의 손상을 방지하여 물량을 없애고, 생산성을 향상시키도록 된 반도체패키지 제조용 자동몰딩프레스의 예일장치이다.The present invention relates to a yale device for an automatic molding press for manufacturing a semiconductor package, wherein the device is preheated to a predetermined temperature (150 ° C.) in a lead frame before molding the wire-bonded lead frame. Install a fixed bar that fixes one side of the upper surface of the lead frame to prevent the lead frame from lifting up, and install a stop finger to prevent the lead frame from falling off so that the lead frame is fixed in the correct position, and the lead frame travel direction. The sensor that checks is installed so that it does not transmit heat, and it rotates by 180 ° by stepping motor to stop at the right position, and removes the quantity by preventing the damage of the lead frame when transporting the preheated lead frame. Yale device of automatic molding press for manufacturing semiconductor package to improve productivity.
Description
본 내용은 요부공개 건이므로 전문내용을 수록하지 않았음As this is a public information case, the full text was not included.
제1도는 본 발명이 적용된 자동몰딩프레스의 전체구성을 도시한 정면도1 is a front view showing the overall configuration of the automatic molding press to which the present invention is applied
Claims (4)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950065469A KR0185354B1 (en) | 1995-12-29 | 1995-12-29 | Preheating equipment of automatic molding press for semiconductor package manufacture |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
KR1019950065469A KR0185354B1 (en) | 1995-12-29 | 1995-12-29 | Preheating equipment of automatic molding press for semiconductor package manufacture |
Publications (2)
Publication Number | Publication Date |
---|---|
KR970053149A true KR970053149A (en) | 1997-07-29 |
KR0185354B1 KR0185354B1 (en) | 1999-04-15 |
Family
ID=19447050
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR1019950065469A KR0185354B1 (en) | 1995-12-29 | 1995-12-29 | Preheating equipment of automatic molding press for semiconductor package manufacture |
Country Status (1)
Country | Link |
---|---|
KR (1) | KR0185354B1 (en) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100815134B1 (en) * | 2006-10-16 | 2008-03-20 | 세크론 주식회사 | Preheating device for semiconductor device, and method for preheating semiconductor device using the same |
Families Citing this family (4)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR200302418Y1 (en) | 2002-11-08 | 2003-02-05 | 박준영 | Fastener Set for Lightning Plate. |
KR102369778B1 (en) | 2020-04-07 | 2022-03-03 | 유재현 | Grounding device for distribution lines |
KR102449609B1 (en) | 2020-10-19 | 2022-10-04 | 유재현 | Leadless grounding device of distribution line and its construction method |
KR102479371B1 (en) | 2020-11-10 | 2022-12-20 | 유재현 | Construction method of the leadless grounding device for distribution lines |
-
1995
- 1995-12-29 KR KR1019950065469A patent/KR0185354B1/en not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100815134B1 (en) * | 2006-10-16 | 2008-03-20 | 세크론 주식회사 | Preheating device for semiconductor device, and method for preheating semiconductor device using the same |
Also Published As
Publication number | Publication date |
---|---|
KR0185354B1 (en) | 1999-04-15 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
LAPS | Lapse due to unpaid annual fee |