KR0185353B1 - Position automatic control apparatus of gripper in auto molding press for semiconductor package manufacture - Google Patents
Position automatic control apparatus of gripper in auto molding press for semiconductor package manufacture Download PDFInfo
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- KR0185353B1 KR0185353B1 KR1019950065462A KR19950065462A KR0185353B1 KR 0185353 B1 KR0185353 B1 KR 0185353B1 KR 1019950065462 A KR1019950065462 A KR 1019950065462A KR 19950065462 A KR19950065462 A KR 19950065462A KR 0185353 B1 KR0185353 B1 KR 0185353B1
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- gripper
- link
- molding press
- lead frame
- mold
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
본 발명은 반도체패키지 체조용 자동몰딩프레스에서 그럽퍼의 위치 자동제어장치에 관한 것으로, 로딩-언로딩 로보트아암에 설치되어 예열장치에 위치한 본딩된 리드프레임과 펠렛로딩유니트에 위치한 폘렛을 몰드금형으로운반하고, 몰드금형에서 몰딩된 리드프레임을 빼내어 디컬링장치로 운반하는 그립퍼를 전후좌우로의 자동조절이 용이하도록 설치되어 위치변화에 의한 위치정도의 오차를 줄이도록 한 반도체패키지 제조용 자동몰딩프레스에서 그립퍼의 위치 자동제어장치이다.The present invention relates to an automatic control device of the gripper position in an automatic molding press for gymnastics for semiconductor packages. The mold is formed in a mold mold of a bonded lead frame and a pellet loading unit which are installed on a loading-unloading robot arm and located on a preheating device. In the automatic molding press for manufacturing semiconductor packages, the gripper for transporting and removing the lead frame from the mold mold and transporting it to the decaling device is installed to easily adjust the front, rear, left, and right sides. Gripper position automatic control device.
Description
제 1 도는 본 발명의 자동몰딩프레스의 전체 구성을 나타낸 정면도1 is a front view showing the overall configuration of the automatic molding press of the present invention
제 2 도는 본 발명의 자동몰딩프레스의 전체 구성을 나타낸 평면도2 is a plan view showing the overall configuration of the automatic molding press of the present invention
체 3 도는 본 발명의 자동몰딩프레스에 로보트아암이 설치된 측면도Sieve 3 is a side view of the robot arm installed in the automatic molding press of the present invention
제 4 도는 본 발명의 그립퍼가 설치된 로보트아암의 정면도4 is a front view of the robot arm provided with the gripper of the present invention.
제 5 도는 본 발명의 그립퍼가 설치된 로보트아암의 측면도5 is a side view of the robot arm provided with the gripper of the present invention.
＊ 도면의 주요부분에 대한 부호의 설명＊ Explanation of symbols on main parts of drawing
11 : 베이스플레이트 12 : 실린더11 base plate 12 cylinder
13, 14, 15 : 제1, 2, 3링크 16 : 회전축13, 14, 15: 1st, 2, 3 link 16: rotation axis
17 : 로드엔드베어링(Rod End Bearing) 18 : 가이드블럭17: Rod End Bearing 18: Guide Block
본 발명은 반도체패키지 제조용 자동몰딩프레스에서 그립퍼의 위치 자동제어장치에 관한 것으로, 더욱 상세하게는 로딩-언로딩 로보트아암에 설치되어 예열장치에 위치한 본딩된 리드프레임과 폘렛로딩유니트에 위치한 폘렛을 몰드금형으로 운반하고, 몰드금형에서 몰딩된 리드프레임을 빼내어 디컬링장치로 운반하는 그립퍼를 전후좌우로의 자동조절이 용이하도록 설치되어 위치변화에 의한 위치정도의 오차를 줄이도록 한 반도체패키지 제조용 자동몰딩프레스에서 그립퍼의 위치 자동제어장치에 관한 것이다.The present invention relates to an automatic control device of a gripper position in an automatic molding press for manufacturing a semiconductor package, and more particularly, to a bonded lead frame and a mallet located in a preloading device mounted on a loading-unloading robot arm. Automatic molding for semiconductor package manufacturing to reduce the error of position due to the change of position as it is installed to easily adjust the gripper for transporting to the mold and removing the lead frame from the mold and transporting it to the decaling device. An automatic control device for a gripper position in a press.
일반적으로 반도체패키지 제조용 자동몰딩프레스의 그립퍼는 예열장치에서 예열된 리드프레임과 폘렛로딩유니트에 위치한 폘렛을 몰드금형으로 운반하고, 몰드금형에서 몰딩된 리드프레임을 뻐내어 디컬링장치로 운반하는 동작을 하는 것으로, 상기 그림퍼가 하강하여 리드프레임 및 폘렛을 집는(Grip ; 그립) 역할을 한다.In general, the gripper of the automatic molding press for manufacturing a semiconductor package transfers the lead frame preheated in the preheating device and the mallet located in the mallet loading unit to the mold mold, and relieves the lead frame molded from the mold mold and transports it to the decaling device. In this case, the gripper is lowered to serve to grip the lead frame and the mallet (grip).
그러나, 종래의 그립퍼는 리드프레임올 집기 위해 하강할 때 정확한 위치에 있지 않으면 하강되지 못함으로써 제품의 불량을 발생시켜 생산성을 저하시키고, 장비의 수명을 단축시키는 등의 문제점을 내포하고 있었던 것이다.However, the conventional gripper had problems such as product failure, productiveness, and shortening of the life of the equipment by failing to descend unless it is not in the correct position when the lead frame is lowered to pick up the lead frame.
따라서, 본 발명은 이와같은 문제점을 해결하기 위하여 발명된 것으로, 리드프레임을 집기 위하여 그립퍼가 하강될 때 위치정도의 오차가 발생되어도 정확한 위치에 정확히 하강될 수 있도록 위치를 자동제어 함으로서 제품의 불량을 방지하여 생산성을 향상시키고, 장비의 수명을 연장시킬 수 있도록 된 반도체패키지 제조용 자동몰딩프레스에서 그립퍼의 위치 자동제어 장치를 제공함에 그 목적이 있다.Therefore, the present invention has been invented to solve such a problem, and even if the gripper is lowered to pick up the lead frame, even if an error of the position degree occurs, the product is automatically controlled so that the position can be correctly lowered to the correct position. The purpose of the present invention is to provide an automatic position control device for a gripper in an automatic molding press for manufacturing a semiconductor package, which can prevent productivity, and extend the life of equipment.
이러한 본 발명의 목적을 달성하기 위해서는 다수개로 구비된 몰딩프레스에 온로더유니트, 예열장치, 폘렛로딩유니트, 디컬링유니트, 픽 플레이스유니트 및 언로더유니트가 설치되고, 로보트아암에 설치되어 예열된 리드프레임 및 폘렛을 운반하여 몰드다이에 넣어주고, 몰딩된 리드프레임을 빼내어 디컬링유니트로 운반할 때 리드프레임을 그립(Grip)하는 그립퍼로 구성된 반도체패키지 제조용 자동몰딩프레스에 있어서, 상기 그립퍼는 로보트아암에 설치되고, 상기 로보트아암의 베이스플레이트에 설린더의 선단이 하부로 경사지게 후단을 힌지 결합하고, 이 실린더의 로드 선단에 수직으로게1링크를 결합하며, 제1링크의 상단에는 회전축에 의해 수명으로 제2링크를 결합하고, 제2링크의 타측단에는 로드엔드베어링(Rod End BeaHng)에 의해 제3링크를 수직으로 결합하며, 이 제3링크의 하단을 그럽퍼와 결합시키고, 그립퍼가 하강되어 몰드금형의 안내홈 속으로 삽입되는 가이드블럭을형성한 것을 특징으로 하는 반도체패키지 제조용 자동몰딩프레스의 그립퍼에 의해 가능하다.In order to achieve the object of the present invention, a plurality of molding presses are provided with on-loader units, preheating devices, mullet loading units, decaling units, pick place units and unloader units, and are mounted on the robot arm to preheat the leads. In the automatic molding press for manufacturing a semiconductor package, the gripper comprises a gripper for transporting the frame and the mallet into a mold die and gripping the leadframe when the molded leadframe is removed and transported to a decaling unit. It is installed on the base plate of the robot arm hinged to the rear end of the lower end is inclined downward, the first link is coupled to the rod end of the cylinder vertically, and the upper end of the first link life by the rotating shaft The second link is coupled to each other, and the third link is received at the other end of the second link by a rod end bearing (Rod End BeaHng). By a gripper of the automatic molding press for manufacturing a semiconductor package, wherein the third link is coupled to the lower end of the third link with the gripper, and the gripper is lowered to form a guide block inserted into the guide groove of the mold mold. Do.
이하, 본 발명올 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
제1도는 본 발명의 자동몰딩프레스의 전체 구성을 나타낸 정면도이고, 제2도는 본 발명의 자동몰딩프레스의 전체 구성을 나타낸 명면도이며, 제3도는 본 발명의 자동몰딩프레스에 로보트아암이 설치된 상태를 나타낸측면도로서, 몰딩프레스(A)의 일측에는 와이어본딩된 리드프레임을 공급하는 온로더유니트(B)와, 공급된 리드프레임을 예열하는 예열장치(C)와, 몰딩을 위해 폘렛올 공급하는 폘렛로딩유니트(D)가 설치되어 있고, 상기 몰딩프레스(A)의 전방에는 예열된 리드프레임과 펠렛을 몰드금형(MD)로 운반하는로딩 로보트아암(E)이 설치되며, 후방에 몰드금형(MD)에서 몰딩된 리드프레임을 삐내는 언로딩 로보트아암(F)이 설치되어 있는데, 이 언로딩 로보트아암(F)에는 크리너(H)가 일체형으로 부작 설치되어 있고, 상기 로딩-언로딩로보트아암(E)(F)에는 리드프레임을 집을 수 있는 그립퍼(G)가 설치되어 있으며, 상기 몰딩프레스(A)의 타측이는 몰딩된 리드프레임에 붙어있는 런너게이트를 제거하는 디컬링유니트(I), 리드프레임을 적재할 수 있는 위치까지이숭시키는 픽 플레이스유니트(J) 및 이송된 리드프레임을 배출하는 언로더유니트(K)가 각각 설치된 구조로 되어 있다.1 is a front view showing the overall configuration of the automatic molding press of the present invention, Figure 2 is a bright view showing the overall configuration of the automatic molding press of the present invention, Figure 3 is a robot arm installed in the automatic molding press of the present invention As a side view showing, on one side of the molding press (A), the on-loader unit (B) for supplying the wire-bonded lead frame, the preheater (C) for preheating the supplied lead frame, and supplying the pellet for molding The mallet loading unit (D) is installed, and a loading robot arm (E) for transporting the preheated lead frame and pellets to the mold mold (MD) is installed at the front of the molding press (A), and at the rear of the mold mold ( An unloading robot arm (F) which spouts the lead frame molded in the MD) is installed, and the unloading robot arm (F) is provided with a cleaner (H) integrally installed, and the loading-unloading robot arm (E) (F) A gripper (G) for picking up a lead frame is installed, and the other side of the molding press (A) can load a decaling unit (I) for removing a runner gate attached to the molded lead frame and a lead frame. The pick place unit J to be moved to the position where it is, and the unloader unit K for discharging the transferred lead frame are respectively provided.
제4도 내지 제5도는 본 발명의 그립퍼(G)가 설치된 로딩-언로딩 로보트아암(E)(F)의 정면도와 측면도릍 나타낸 것으로, 로딩-언로딩 로보트아암(E)(F)의 베이스플레이트(11)에 실린더(12)의 후단이 힌지(12,)로 결합되어있고, 이 실린더(12)는 선단이 하부로 겅사지게 설치되어 있는데, 상기 실린더(12)의 선단에는 수직으로 제1링크(13)의 하단이 결합되고, 제1링크(13)의상단에는 회진축(16)에 의해 수평으로 제2링크(14)의 일측단이 결합되며, 제2링크(14)의 타측단에는 로드엔드비어링(17 ; Rod End BeaHng)에 의해 제3링크(15)가 수직으로 결합되고, 이 제3링크(15)의 하단이 그립퍼(G)에 결합되며, 상기 그럼퍼(G)가 하강되어 몰드금형(MD)의 안내홈(21) 속으로 삽입될수 있는 가이드블럭(18)이 형성되어 있어 상기 그림퍼(G)를 가이드 하면서 하강되어 자동으로 정확한 위치에 하강될 수 있도록 하는 것이다. 이는제2링크(14)와 제3링크(15)가 르드엔드베어링(17)으로 결합되어 있으므로 로드엔드베어링(17)에 의해서 정확한 위치에 하강될수 있는 것이다.4 to 5 are a front view and a side view of the loading-unloading robot arm E (F) provided with the gripper G of the present invention, and the base of the loading-unloading robot arm E (F). The rear end of the cylinder 12 is coupled to the plate 11 by a hinge 12, and the cylinder 12 is provided with its tip bent downward, and is perpendicular to the tip of the cylinder 12. The lower end of the link 13 is coupled, and one end of the second link 14 is horizontally coupled to the upper end of the first link 13 by the rotation shaft 16, and the other end of the second link 14. The third link 15 is vertically coupled by a rod end bearing 17 (Rod End BeaHng), and the lower end of the third link 15 is coupled to the gripper G, and the gripper G Is lowered to form a guide block 18 which can be inserted into the guide groove 21 of the mold mold MD. The guide block 18 is lowered while guiding the gripper G and automatically lowered to the correct position. To ensure that. This is because the second link 14 and the third link 15 is coupled to the rod end bearing 17, so that it can be lowered to the correct position by the rod end bearing 17.
이와같이 로딩-언로딩 로보트아암(E)(F)에 설치된 그립퍼(G)의 하강은베이스플레이트(11)에 힌지(12')로 결합된 실린더(12)가 작동되어 제1링크(13)를 반시계 방향으로 회전시키면, 제2링크(14)는 회전축(16)을 증심으로반시계방향으로 회전되면서 원호운동을 하게된다. 이 때, 제2링크(14)에 결합된 제3링크(15)는 로드엔드베어링(17)의 회전에 의해 좌우로 원호운동을할 수 있게 된다. 이와같은 작동은 그림퍼(G)가 몰드금힝(MD)에 설치된 안내홈(21) 속으로 가이드블럭(18)이 자연스럽게 자동 조절되며 삽입될 수 있게 해주는 것이다.As such, the lowering of the gripper G installed on the loading-unloading robot arm (E) (F) causes the cylinder 12 coupled to the base plate 11 to the hinge 12 'to actuate the first link 13. When rotated in the counterclockwise direction, the second link 14 rotates in the counterclockwise direction at the center of the rotation shaft 16 to perform an arc motion. In this case, the third link 15 coupled to the second link 14 may be circularly moved left and right by the rotation of the rod end bearing 17. This operation allows the guide block 18 to be automatically adjusted and inserted into the guide groove 21 installed in the mold clamping MD.
이는 제2링크(14)와 제3링크(15)에 로드엔드베어링(17)이 설치되어 있어좌·우는 물론, 전·후로도 움직일 수 있어서 위치 정밀도를 스스로 보정하면서 몰드금형(MD)외 안내홈(21)속에 삽입될 수 있는 것으로, 이는 각 스테이션(Station) 마다 다른 위치를 기구적으로 보정하여 이로 인한 에러를 최소화 시킬 수 있는 장점이 있다.The rod end bearings 17 are installed on the second link 14 and the third link 15 so that they can be moved forward and backward, as well as forward and backward. It can be inserted into the groove 21, which has the advantage of minimizing the error caused by mechanically correcting different positions for each station (Station).
이상의 설명에서와 같이 본 발명은 리드프레임을 집기 위하여 하강되는그립퍼의 하강시 정확한 위치에 하강될 수 있도록 함으로써 제품의 불량을 방지하여 생산성을 향상시키고, 장비를 보호하여 그 수명을 연장시킬 수 있는 장접이 있다.As described above, the present invention can be lowered to the correct position when the gripper is lowered to pick up the lead frame to prevent product defects to improve productivity, protect the equipment to extend the life span There is a folding.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950065462A KR0185353B1 (en) | 1995-12-29 | 1995-12-29 | Position automatic control apparatus of gripper in auto molding press for semiconductor package manufacture |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950065462A KR0185353B1 (en) | 1995-12-29 | 1995-12-29 | Position automatic control apparatus of gripper in auto molding press for semiconductor package manufacture |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970053147A KR970053147A (en) | 1997-07-29 |
| KR0185353B1 true KR0185353B1 (en) | 1999-04-15 |
Family
ID=19447044
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950065462A KR0185353B1 (en) | 1995-12-29 | 1995-12-29 | Position automatic control apparatus of gripper in auto molding press for semiconductor package manufacture |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0185353B1 (en) |
-
1995
- 1995-12-29 KR KR1019950065462A patent/KR0185353B1/en not_active IP Right Cessation
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| Publication number | Publication date |
|---|---|
| KR970053147A (en) | 1997-07-29 |
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