KR0185360B1 - Finger operating structure of gripper of auto-molding press for manufacturing semiconductor package - Google Patents
Finger operating structure of gripper of auto-molding press for manufacturing semiconductor package Download PDFInfo
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- KR0185360B1 KR0185360B1 KR1019950065461A KR19950065461A KR0185360B1 KR 0185360 B1 KR0185360 B1 KR 0185360B1 KR 1019950065461 A KR1019950065461 A KR 1019950065461A KR 19950065461 A KR19950065461 A KR 19950065461A KR 0185360 B1 KR0185360 B1 KR 0185360B1
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- fixing bar
- lead frame
- molding press
- semiconductor package
- gripper device
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
- Manipulator (AREA)
Abstract
본 발명은 반도체패키지 제조용 자동몰딩프레스에서 그립퍼장치의 핑거작동구조에 관한 것으로, 로딩-언로딩 로보트아암에 설치되어 예열장치, 펠렛로더유니트에 위치한 본딩된 리드프레임과 펠렛을 몰드아이로 운반하고, 몰드다이에서 몰딩된 리드프레임을 빼내어 디컬링장치로 운반하는 그립퍼장치에 있어서, 그립퍼장치에 설치된 핑거의 작동을 두 개의 편심캠에 의해 작동되도록 함으로써 리드프레임을 집을 때 충격을 흡수하여 제품의 불량을 방지할 수 있는 반도체패키지 제조용 자동몰딩프레스에서 그립퍼장치의 핑거 작동구조이다.The present invention relates to a finger operating structure of a gripper device in an automatic molding press for manufacturing a semiconductor package, and is mounted on a loading-unloading robot arm to transport a bonded lead frame and a pellet located in a preheating device and a pellet loader unit to a mold eye, A gripper device which removes a molded lead frame from a mold die and carries it to a decaling device, wherein a finger installed on the gripper device is operated by two eccentric cams to absorb shock when picking up the lead frame, thereby preventing product defects. It is a finger operation structure of the gripper device in the automatic molding press for manufacturing a semiconductor package that can be prevented.
Description
제1도는 본 발명의 자동몰딩프레스의 전체 구성을 나타낸 정면도.1 is a front view showing the overall configuration of the automatic molding press of the present invention.
제2도는 본 발명의 자동몰딩프레스의 전체 구성을 나타낸 평면도.2 is a plan view showing the overall configuration of the automatic molding press of the present invention.
제3도는 본 발명의 그립퍼장치의 구조를 보인 단면도.3 is a cross-sectional view showing the structure of the gripper device of the present invention.
제4도는 본 발명의 그립퍼장치의 저면도.4 is a bottom view of the gripper device of the present invention.
제5도는 본 발명의 그립퍼장치의 요부 측면도.5 is a side view of the main portion of the gripper device of the present invention.
제6도의 (a)(b)는 본 발명의 그립퍼장치의 핑거를 작동시키는 편심캠을 도시한 도면.(A) and (b) of FIG. 6 show an eccentric cam for operating a finger of the gripper device of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
11 : 회전실린더 12a, 12b : 제1, 2편심캠11: rotary cylinder 12a, 12b: first and second eccentric cam
13a, 13b : 제1,2캠팔로우 14 : 핀13a, 13b: 1st, 2nd cam follow 14: pin
15,16,17,18 : 제1,2,3,4고정바 19 : 축15, 16, 17, 18: 1st, 2, 3, 4 fixed bar 19: axis
본 발명은 반도체패키지 제조용 자동몰딩프레스에서 그립퍼장치의 핑거작동구조에 관한 것으로, 더욱 상세하게는 로딩-언로딩 보트아암에 설치되어 예열장치, 펠렛로딩유니트에 위치한 본딩된 리드프레임과 펠렛을 몰드다이로 운반하고, 몰드다이에서 몰딩된 리드프레임을 빼내어 디컬링장치로 운반하는 그립퍼장치로 리드프레임을 집는 핑거의 작동을 두 개의 편심캠을 이용함으로써 리드프레임을 집는 충격을 흡수하여 제품의 불량을 방지하고, 작업능률을 향상시켜 생산성을 높일 수 있는 반도체패키지 제조용 자동몰딩프레스에서 그립퍼장치의 핑거 작동구조에 관한 것이다.The present invention relates to a finger operating structure of a gripper device in an automatic molding press for manufacturing a semiconductor package, and more particularly, to a die-bonded lead frame and pellets mounted on a loading-unloading boat arm and positioned in a preheating device and a pellet loading unit. Gripper device which removes lead frame from mold die and carries it to decaling device by using two eccentric cams to absorb the impact of pin frame to prevent product defects. The present invention relates to a finger operating structure of a gripper device in an automatic molding press for manufacturing a semiconductor package which can increase productivity by improving work efficiency.
일반적으로 반도체패키지 제조용 자동몰딩프레스의 그립퍼장치는 예열장치에서 예열된 리드프레임과 펠렛로딩유니트에 위치한 펠렛을 몰드다이로 운반하고, 몰드다이에서 몰디된 리드프레임을 빼내어 디컬링장치로 운반하는 동작을 할 때 리드프레임 및 펠렛을 집는(Grip ; 그립)역할을 한다.In general, the gripper device of the automatic molding press for manufacturing a semiconductor package transfers the lead frame preheated from the preheating device and the pellets located in the pellet loading unit to the mold die, and removes the lead frame molded from the mold die to the decaling device. And grips the leadframe and pellets.
이때, 리드프레임을 집는 것은 그립퍼에 설치된 핑거를 작동시켜 리드프레임을 집는데, 종래의 핑거 작동구조는 핑거작동용 실린더에 직접 핑거를 결합하여 작동시킴으로써 리드프레임을 집을 때 충격이 수반되어 리드프레임에 손상을 입혔던 것이다. 즉, 예열장치에서 예열된 리드프레임을 그립퍼로 집을 때 충격이 수반되어 리드프레임의 와이어가 끊어지는 현상이 발생되어 제품의 불량을 발생시키는 문제점을 내포하고 있었던 것이다.At this time, picking up the lead frame to pick up the lead frame by operating the finger installed in the gripper, the conventional finger operation structure is coupled to the finger operating cylinder directly by operating the finger to pick up the lead frame accompanied by an impact on the lead frame It was damaged. In other words, when the pre-heated lead frame is picked up by the gripper, a phenomenon occurs in which the wire of the lead frame is broken due to an impact, thereby causing a defect of the product.
따라서, 본 발명은 이와같은 문제점을 해결하기 위한 것으로, 그립퍼장치로 리드프레임을 집을 때 충격이 수반되지 않도록 두 개의 편심캠을 결합하여 리드프레임을 집는 핑거를 작동시킴으로써, 리드프레임의 손상없이 가볍게 리드프레임을 집을 수 있으므로 리드프레임의 와이어가 끊어지는 현상을 방지하여 제품의 불량 발생을 최소화할 수 있는 반도체패키지 제조용 자동몰딩프레스에서 그립퍼장치의 핑거 작동구조를 제공함에 그 목적이 있다.Accordingly, the present invention is to solve such a problem, by combining the two eccentric cams to operate the finger to pick up the lead frame so as not to be accompanied by impact when picking up the lead frame with the gripper device, the lead frame lightly damaged without damage The purpose of the present invention is to provide a finger operating structure of a gripper device in an automatic molding press for manufacturing a semiconductor package, which can prevent the breakage of the wire of the lead frame since the frame can be picked up.
이러한 본 발명의 목적을 달성하기 위해서는 다수개로 구비된 몰딩프레스에 온로더유니트, 에열장치, 펠렛로딩유니트, 디컬링유니트, 픽 플레이 스유니트 및 언로더유니트가 설치되고, 로보트아암에 설치되어 예열된 리드프레임 및 펠렛을 운반하여 몰드다이에 넣어주고, 몰딩된 리드프레임을 빼내어 디컬링유니트로 운반할 때 리드프레임을 그립(Grip)하는 그립퍼장치로 구성된 반도체패키지 제조용 자동몰딩프레스에 있어서, 상기 그립퍼장치에 설치된 회실린더와, 이 회전실린더의 회전축에 서로 편심 결합된 제1, 2편심캠과, 상기 제1, 2편심캠에 결합된 제1, 2캠팔로우와, 상기 제1, 2캠팔로우의 끝단에 핀 결합되고, 핑거의 상단과 연결하여 핑거를 작동시키는 제1,2고정바로 된 것을 특징으로 하는 반도체패키지 제조용 자동몰딩프레스에서 그립퍼장치의 핑거 작동구조에 의해 가능하다.In order to achieve the object of the present invention, the on-loader unit, the heating device, the pellet loading unit, the decaling unit, the pick place unit and the unloader unit are installed in a plurality of molding presses and are pre-installed on the robot arm. An automatic molding press for manufacturing a semiconductor package, comprising a gripper device for carrying a lead frame and pellets into a mold die, and gripping the lead frame when the molded lead frame is removed and transported to a decaling unit. A first cylinder, a second eccentric cam eccentrically coupled to each other and a rotation cylinder of the rotary cylinder, first, second cam followers coupled to the first and second eccentric cams, and the first and second cam followers The gripper length in the automatic molding press for manufacturing a semiconductor package, characterized in that the pin is coupled to the end, and the first and second fixing bars connected to the upper end of the finger to operate the finger. By the finger operating structure of the tooth.
이하, 본 발명을 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
제1도는 본 발명의 자동몰딩프레스의 전체 구성을 나타낸 정면도이고, 제2도는 본 발명의 자동몰딩프레스의 전체 구성을 나타낸 평면도로서, 몰딩프레스(A)의 일측에는 와이어본딩된 리드프레임을 공급한는 온로더유니트(B)와, 공급된 리드프레임을 예열하는 예열장치(C)와, 몰딩을 위해 펠렛을 공급하는 펠렛로딩유니트(D)가 설치되어 있고, 상기 몰딩프레스(A)의 전방에는 예열된 리드프레임과 펠렛을 몰드다이(MD)로 운반하는 로딩 로보트아암(E)이 설치되며, 후방에 몰드다이(MD)에서 몰딩된 리드프레임을 빼내는 언로딩 로보트아암(F)에는 크리너(H)가 일체형으로 부착 설치되어 있고, 상기 로딩-언로딩 로보트아암(E)(F)에는 리프프레임을 집을 수 있는 그립퍼(G)가 설치되어 있으며, 상기 몰딩프레스(A)의 타측에는 몰딩된 리드프레임에 붙어있는 런너게이트를 제거하는 디컬링유니트(I), 리드프레임을 적재할 수 있는 위치까지 이송시키는 픽 플레이스유니트(J) 및 이송된 리드프레임을 배출하는 언로더유니트(K)가 각각 설치된 구조로 되어 있다.1 is a front view showing the overall configuration of the automatic molding press of the present invention, Figure 2 is a plan view showing the overall configuration of the automatic molding press of the present invention, one side of the molding press (A) is supplied with a wire-bonded lead frame On-loader unit (B), a preheating device (C) for preheating the supplied lead frame, and a pellet loading unit (D) for supplying pellets for molding, are provided, and the preheating in front of the molding press (A) A loading robot arm (E) for transporting the lead frame and pellets to the mold die (MD) is installed, and a cleaner (H) is attached to the unloading robot arm (F) for removing the molded lead frame from the mold die (MD) at the rear. Is integrally attached and installed, the loading-unloading robot arm (E) (F) is provided with a gripper (G) for picking up a leaf frame, and a molded lead frame on the other side of the molding press (A) Runner gay attached to The decaling unit I for removing the track, the pick place unit J for transferring the lead frame to the position where the lead frame can be loaded, and the unloader unit K for discharging the transferred lead frame are provided.
제3도 내지 제5도는 본 발명 그립퍼장치(G)의 구조를 도시한 것이고, 제6도는 본 발명의 그립퍼장치(G)의 핑거(21)를 작동시키는 편심캠(12a)(12b)을 도시한 도면으로서, 상기 편심캠(12a)(12b)의 작동에 의해 두 개의 리드프레임을 한꺼번에 잡을 수 있는 것이다.3 to 5 show the structure of the gripper device G of the present invention, and FIG. 6 shows the eccentric cams 12a and 12b for operating the fingers 21 of the gripper device G of the present invention. As one figure, by operating the eccentric cam (12a) (12b) it is possible to hold two lead frames at once.
상기 그립퍼장치(G)에는 회전실린더(11)가 설치되어 있고, 이 회전실린더(11)의 회전축(G)에는 제1편심캠(12a)과 제2편심캠(12b)이 결합되어 있으며, 상기 제1,2편심캠(12a)(12b)에는 제1캠팔로우(13a)와 제2캠팔로우(13b)가 서로 대칭으로 결합되어 있고, 제1, 2캠팔로우(13a)(13b)의 끝단은 핑거(21)를 작동시키는 제1고정바(15)와 제2고정바(16)에 각각 핀(14)으로 결합되어 있다.The gripper device G is provided with a rotation cylinder 11, and the first eccentric cam 12a and the second eccentric cam 12b are coupled to the rotation shaft G of the rotation cylinder 11. The first cam follower 13a and the second cam follower 13b are symmetrically coupled to the first and second eccentric cams 12a and 12b, and the ends of the first and second cam followers 13a and 13b are symmetrically coupled to each other. The pins 14 are coupled to the first fixing bar 15 and the second fixing bar 16 for operating the fingers 21, respectively.
상기 제1고정바(15)는 제3고정바(17)에 축(19)으로 고정되어 있고, 상기 제2고정바(16)는 제4고정바(18)에 축(19)으로 고정되어 있어 제1고정바(15)의 운동은 제3고정바(17)에 전달되고, 제2고정바(16)의 운동은 제4고정바(18)에 전달되는 것으로, 제1고정바(15)와 제2고정바(16)가 한쌍으로 이루어지고, 제3고정바(17)와 제4고정바(18)가 한쌍으로 이루어져 두 개의 리드프레임을 동시에 집을 수 있는 것이다.The first fixing bar 15 is fixed to the third fixing bar 17 by the shaft 19, and the second fixing bar 16 is fixed to the fourth fixing bar 18 by the shaft 19. The movement of the first fixing bar 15 is transmitted to the third fixing bar 17, the movement of the second fixing bar 16 is transmitted to the fourth fixing bar 18, the first fixing bar (15) ) And the second fixing bar 16 is made of a pair, and the third fixing bar 17 and the fourth fixing bar 18 are made of a pair so that two lead frames can be simultaneously picked up.
이와같이 구성된 그립퍼장치(G)는 회전실린더(11)가 180°회전을 하게되면, 회전실린더(11)의 회전축(11')에 결합된 제1, 2편심캠(12a)(12b)이 회전을 하게되고, 상기 제1, 2편심캠(12a)(12b)의 회전에 의해 제1,2캠팔로우(13a)(13b)는 핀(14)에 의해 결합된 제1고정바(15)와 제2고정바(16)를 당기면서 싸인커브(Sine Curve)의 궤적을 따라 충격없이 자연스럽게 회전실린더(11) 회전축(11') 방향으로 이동하면서 핑거(21)를 작동시켜 리드프레임을 집는 것이다.In the gripper device G configured as described above, when the rotation cylinder 11 rotates 180 °, the first and second eccentric cams 12a and 12b coupled to the rotation shaft 11 'of the rotation cylinder 11 rotate. The first and second cam followers 13a and 13b are rotated by the first and second eccentric cams 12a and 12b, and the first fixing bar 15 and the first fixing bar 15 coupled by the pins 14 are formed. While pulling the two fixing bars 16, the lead frame is picked up by operating the finger 21 while naturally moving in the direction of the rotational cylinder 11'11 'with no impact along the trajectory of the sine curve.
이때, 제1고정바(15)는 제3고정바(17)에 축(19)으로 고정되어 있고, 제2고정바(16)는 제4고정바(18)에 축(19)으로 고정되어 있으므로, 제1, 2고정바(15)(16)의 작동과 함께 제3, 4고정바(17)(18)가 함께 작동되면서, 제1고정바(15)와 제2고정바(16)에서 하나의 리드프레임을 집고, 제3고정바(17)와 제4고정바(18)에서 하나의 리드프레임을 집어 두 개의 리드프레임을 한꺼번에 집을수 있는 것이다.In this case, the first fixing bar 15 is fixed to the third fixing bar 17 by the shaft 19, and the second fixing bar 16 is fixed to the fourth fixing bar 18 by the shaft 19. Therefore, while the third and fourth fixing bars 17 and 18 are operated together with the operation of the first and second fixing bars 15 and 16, the first fixing bar 15 and the second fixing bar 16 are operated together. Picking one lead frame at, and picking one lead frame from the third fixing bar 17 and the fourth fixing bar 18 can pick up two lead frames at once.
이와같이 두 개의 편심캠(12a)(12b)에 의해 핑거(21)를 동시에 작동시켜 리드프레임을 집을 수 있는 그립퍼장치(G)는 로딩-언로딩 로보트아암(E)(F)에 설치되어 반도체패키지 제조용 자동몰딩프레스의 전후좌우로 이동되면서 몰드다이(MD)로 리드프레임을 운반하거나, 몰드다이(MD)에서 몰딩된 리드프레임을 운반하거나, 몰드다이(MD)에서 몰딩된 리드프레임을 집어서 디컬링장치(I)로 운반하는 것이다.In this way, a gripper device G capable of picking up a lead frame by simultaneously operating the fingers 21 by two eccentric cams 12a and 12b is installed on the loading-unloading robot arm E and F to provide a semiconductor package. The lead frame is transported to the mold die MD, the lead frame molded from the mold die MD, or the lead frame molded from the mold die MD Conveying to the curling device (I).
이상의 설명에서와 같이 본 발명은 리드프레임을 집을 때 두 개의 편심캠에 의해 충격없이 리드프레임을 그립함으로써, 리드프레임을 손상없이 가볍게 집을 수 있어 패키지의 불량을 감소시키고, 작업효율을 향상시켜 패키지의 신뢰성을 얻을 수 있는 잇점이 있다.As described above, in the present invention, when the lead frame is picked up by two eccentric cams, the lead frame is gripped without impact, so that the lead frame can be lightly picked up without damage, thereby reducing defects of the package and improving work efficiency. There is an advantage in achieving reliability.
Claims (2)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950065461A KR0185360B1 (en) | 1995-12-29 | 1995-12-29 | Finger operating structure of gripper of auto-molding press for manufacturing semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950065461A KR0185360B1 (en) | 1995-12-29 | 1995-12-29 | Finger operating structure of gripper of auto-molding press for manufacturing semiconductor package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970053710A KR970053710A (en) | 1997-07-31 |
| KR0185360B1 true KR0185360B1 (en) | 1999-03-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950065461A KR0185360B1 (en) | 1995-12-29 | 1995-12-29 | Finger operating structure of gripper of auto-molding press for manufacturing semiconductor package |
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| Country | Link |
|---|---|
| KR (1) | KR0185360B1 (en) |
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1995
- 1995-12-29 KR KR1019950065461A patent/KR0185360B1/en not_active IP Right Cessation
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| Publication number | Publication date |
|---|---|
| KR970053710A (en) | 1997-07-31 |
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