KR0185359B1 - Gripper of auto-molding press for manufacturing semiconductor package - Google Patents
Gripper of auto-molding press for manufacturing semiconductor package Download PDFInfo
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- KR0185359B1 KR0185359B1 KR1019950065460A KR19950065460A KR0185359B1 KR 0185359 B1 KR0185359 B1 KR 0185359B1 KR 1019950065460 A KR1019950065460 A KR 1019950065460A KR 19950065460 A KR19950065460 A KR 19950065460A KR 0185359 B1 KR0185359 B1 KR 0185359B1
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- South Korea
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- gripper device
- coupled
- fixing bar
- molding press
- semiconductor package
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
- H01L21/67721—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations the substrates to be conveyed not being semiconductor wafers or large planar substrates, e.g. chips, lead frames
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/67005—Apparatus not specifically provided for elsewhere
- H01L21/67011—Apparatus for manufacture or treatment
- H01L21/67126—Apparatus for sealing, encapsulating, glassing, decapsulating or the like
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- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/677—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations
- H01L21/67703—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for conveying, e.g. between different workstations between different workstations
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
- H01L21/683—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L21/687—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere for supporting or gripping using mechanical means, e.g. chucks, clamps or pinches
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- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Abstract
본 발명은 반도체패키지 제조용 자동몰딩프레스의 그립퍼장치에 관한 것으로, 로딩-언로딩 로보트아암에 설치되어 예열장치, 펠렛로더유니트에 위치한 본딩된 리드프레임과 펠렛을 몰드금형으로 운반하고, 몰드금형에서 몰딩된 리드프레임을 빼내어 디컬링장치로 운반하는 그립퍼장치로 전후좌우로의 자동조절이 용이하도록 설치되어 위치변화에 의한 위치정도의 오차를 줄이도록 한 반도체패키지 제조용 자동몰딩프레스의 그립퍼장치이다.The present invention relates to a gripper device of an automatic molding press for manufacturing a semiconductor package, which is mounted on a loading-unloading robot arm to transport a bonded leadframe and pellets located in a preheating device and a pellet loader unit to a mold mold, and molding in a mold mold. It is a gripper device of automatic molding press for manufacturing semiconductor package which reduces the error of position accuracy due to position change because it is installed in the gripper device to take out the lead frame and transport it to the decaling device.
Description
제1도는 본 발명의 자동몰딩프레스의 전체 구성을 나타낸 정면도.1 is a front view showing the overall configuration of the automatic molding press of the present invention.
제2도는 본 발명의 자동몰딩프레스의 전체 구성을 나타낸 평면도.2 is a plan view showing the overall configuration of the automatic molding press of the present invention.
제3도는 본 발명의 그립퍼장치가 설치되는 로보트아암의 정면도.3 is a front view of the robot arm to which the gripper device of the present invention is installed.
제4도는 제3도의 요부를 나타낸 평면도.4 is a plan view showing the main parts of FIG.
제5도는 본 발명의 그립퍼장치가 설치되는 로보트아암의 측면도.5 is a side view of the robot arm to which the gripper device of the present invention is installed.
제6도는 본 발명의 그립퍼장치의 구조를 보인 단면도.6 is a cross-sectional view showing the structure of the gripper device of the present invention.
제7도는 본 발명의 그립퍼장치의 저면도.7 is a bottom view of the gripper device of the present invention.
제8도는 본 발명의 그립퍼장치의 요부 측면도.8 is a side view of the main portion of the gripper device of the present invention.
제9도의 (a)(b)는 본 발명의 그립퍼장치의 핑거를 작동시키는 편심캠을 도시한 도면.Figure 9 (a) (b) shows an eccentric cam for operating the fingers of the gripper device of the present invention.
* 도면의 주요부분에 대한 부호의 설명* Explanation of symbols for main parts of the drawings
11 : 베이스플레이트 12 : 실린더11 base plate 12 cylinder
13,14,15 : 제1,2,3링크 16 : 회전축13,14,15: 1st, 2nd, 3rd link 16: rotating shaft
17 : 로드엔드베어링(Rod End Bearing)17: Rod End Bearing
21 : 회전실린더 22a,22b : 제1,2편심캠21: rotating cylinder 22a, 22b: first and second eccentric cam
23a,23b : 제1,2캠팔로우 24 : 핀23a, 23b: 1,2cam follow 24: pin
25,26,27,28 : 제1,2,3,4고정바 29a,29b : 제1,2결합축25, 26, 27, 28: 1, 2, 3, 4 fixed bar 29a, 29b: 1, 2 combined shaft
30 : 펠렛그립용레버 31 : 돌출턱30: pellet grip lever 31: protruding jaw
32 : 힌지축 33 : 박형실린더32: hinge axis 33: thin cylinder
34 : 힌지34: hinge
본 발명은 반도체패키지 제조용 자동몰딩프레스의 그립퍼장치에 관한 것으로, 더욱 상세하게는 로딩-언로딩 로보트아암에 설치되어 예열장치, 펠렛로딩유니트에 위치한 본딩된 리드프레임과 펠렛을 몰드금형으로 운반하고, 몰드금형에서 몰딩된 리드프레임을 빼내어 디컬링장치로 운반하는 그립퍼장치로 전후좌우로의 자동조절이 용이하도록 설치되어 위치변화에 의한 위치정도의 오차를 줄이도록 한 반도체패키지 제조용 자동몰딩프레스의 그립퍼장치에 관한 것이다.The present invention relates to a gripper device of an automatic molding press for manufacturing a semiconductor package, and more particularly, is mounted on a loading-unloading robot arm to transport a bonded lead frame and pellets located in a preheating device, a pellet loading unit, into a mold mold, A gripper device for removing a molded lead frame from a mold mold and transporting it to a decaling device. It is installed to facilitate automatic adjustment of the front, rear, left, and right sides. It is about.
일반적으로 반도체패키지 제조용 자동몰딩프레스의 그립퍼장치는 예열장치에서 예열된 리드프레임과 펠렛로딩유니트에 위치한 펠렛을 몰드금형으로 운반하고, 몰드금형에서 몰딩된 리드프레임을 빼내어 디컬링장치로 운반하는 동작을 할 때 리드프레임 및 펠렛을 잡는(Grip;그립) 역할을 한다.In general, the gripper device of the automatic molding press for manufacturing a semiconductor package carries the action of preheating the leadframe and pellets located in the pellet loading unit to the mold mold, and removing the molded leadframe from the mold mold and transporting it to the decaling device. Grips the leadframe and pellets.
그러나, 종래의 그립퍼장치는 리드프레임을 집을 때 충격을 흡수할 수 있는 제반 구조가 없어 리드프레임을 집을 때 충격이 수반되어 리드프레임을 손상시켜, 즉 예열장치에서 예열된 리드프레임의 와이어가 끊어지는 현상이 발생되어 제품의 불량을 발생시키는 문제점을 내포하고 있었던 것이다.However, the conventional gripper device does not have any structure that can absorb shock when picking up the lead frame, so that the impact is damaged when picking up the lead frame, that is, the wire of the lead frame preheated in the preheater is broken. There was a problem that caused the product defects.
따라서, 본 발명은 이와 같은 문제점을 해결하기 위하여 발명된 것으로, 그립퍼장치로 리드프레임을 집을 때 충격이 수반되지 않도록 두개의 편심캠을 결합하여 리드프레임을 집을 수 있도록 함으로써, 리드프레임의 손상없이 가볍게 리드프레임을 집을 수 있으므로 리드프레임의 와이어가 끊어지는 현상을 방지하여 제품의 불량 발생을 최소화할 수 있는 반도체패키지 제조용 자동몰딩프레스의 그립퍼장치를 제공함에 그 목적이 있다.Therefore, the present invention has been invented to solve such a problem, by combining the two eccentric cams so that the lead frame can be picked up so as not to be accompanied by an impact when the lead frame is picked up by the gripper device, so as not to damage the lead frame It is an object of the present invention to provide a gripper device of an automatic molding press for manufacturing a semiconductor package, which can prevent the breakage of the wire of the leadframe because the leadframe can be picked up.
이러한 본 발명의 목적을 달성하기 위해서는 다수개로 구비된 몰딩프레스에 온로더유니트, 예열장치, 펠렛로딩유니트, 디컬링유니트, 픽플레이스 유니트 및 언로더유니트가 설치되고, 로보트아암에 설치되어 예열된 리드프레임 및 펠렛을 운반하여 몰드다이에 넣어주고, 몰딩된 리드프레임을 빼내어 디컬링유니트로 운반할 때 리드프레임을 그립(Grip)하는 그립퍼장치로 구성된 반도체패키지 제조용 자동몰딩프레스에 있어서, 상기 그립퍼장치는 회전실린더를 설치하고, 이 회전실린더의 회전축에는 제1,2편심캠이 결합하며, 제1,2편심캠에는 제1,2캠팔로우를 서로 대칭으로 결합하되, 상기 제1,2캠팔로우의 끝단에 핑거를 작동시키는 제1,2고정바에 각각 핀 결합시키고, 상기 제1고정바는 제3고정바에 제1결합축으로 고정하며, 상기 제2고정바는 제4고정바에 제2결합축으로 고정하는 한편, 상기 제1,2고정바와 제3,4고정바 사이에 펠렛그립용레버를 설치하여 펠렛을 함께 그립(Grip)할 수 있는 것을 특징으로 하는 반도체패키지 제조용 자동몰딩프레스의 그립퍼장치에 의해 가능하다.In order to achieve the object of the present invention, the on-loader unit, preheating device, pellet loading unit, decaling unit, pick place unit and unloader unit are installed in a plurality of molding presses, and the lead is preheated and installed on the robot arm. In the automatic molding press for manufacturing a semiconductor package, the gripper device comprises a gripper device for transporting the frame and pellets to a mold die, and gripping the lead frame when the molded lead frame is removed and transported to a decaling unit. A rotating cylinder is installed, and the first and second eccentric cams are coupled to the rotary shaft of the rotary cylinder, and the first and second eccentric cams are symmetrically coupled to the first and second cam followers. Pins are respectively coupled to the first and second fixing bars for operating the finger at the end, and the first fixing bar is fixed to the third fixing bar by the first coupling shaft, and the second fixing bar is the fourth fixing bar. While fixing with a second coupling shaft in the second, the first and second fixing bar and the third, fourth fixed bar by installing a grip grip lever for the semiconductor package manufacturing, characterized in that the grip (Grip) together It is possible by the gripper device of the molding press.
이하, 본 발명을 첨부된 도면을 참조하여 상세히 설명하면 다음과 같다.Hereinafter, the present invention will be described in detail with reference to the accompanying drawings.
제1도는 본 발명의 자동몰딩프레스의 전체 구성을 나타낸 정면도이고, 제2도는 본 발명의 자동몰딩프레스의 전체 구성을 나타낸 평면도로서, 몰딩프레스(A)의 일측에는 와이어본딩된 리드프레임을 공급하는 온로더유니트(B)와, 공급된 리드프레임을 예열하는 예열장치(C)와, 몰딩을 위해 펠렛을 공급하는 펠렛로딩유니트(D)가 설치되어 있고, 상기 몰딩프레스(A)의 전방에는 예열된 리드프레임과 펠렛을 몰드금형(MD)로 운반하는 로딩 로보트 아암(E)이 설치되며, 후방에 몰드금형(MD)에서 몰딩된 리드프레임을 빼내는 언로딩 로보트아암(F)이 설치되어 있는데, 이 언로딩 로보트아암(F)에는 크리너(H)가 일체형으로 부착 설치되어 있고, 상기 로딩-언로딩 로보트아암(E)(F)에는 리드프레임을 집을 수 있는 그립퍼(G)가 설치되어 있으며, 상기 몰딩프레스(A)의 타측에는 몰딩된 리드프레임에 붙어있는 런너게이트를 제거하는 디컬링유니트(I), 리드프레임을 적재할 수 있는 위치까지 이송시키는 픽플레이스유니트(J) 및 이송된 리드프레임을 배출하는 언로더유니트(K)가 각각 설치된 구조로 되어 있다.1 is a front view showing the overall configuration of the automatic molding press of the present invention, Figure 2 is a plan view showing the overall configuration of the automatic molding press of the present invention, to supply a wire-bonded lead frame to one side of the molding press (A) On-loader unit (B), a preheating device (C) for preheating the supplied lead frame, and a pellet loading unit (D) for supplying pellets for molding, are provided, and the preheating in front of the molding press (A) The loading robot arm (E) for transporting the lead frame and pellets to the mold mold (MD) is installed, and the unloading robot arm (F) for removing the molded lead frame from the mold mold (MD) is installed at the rear. A cleaner (H) is integrally attached to the unloading robot arm (F), and the gripper (G) for picking up a lead frame is provided on the loading-unloading robot arm (E) (F). The other side of the molding press (A) The decaling unit (I) removes the runner gate attached to the molded lead frame, the pick place unit (J) for transferring the lead frame to the position where it can be loaded, and the unloader unit for discharging the transferred lead frame (K). ) Are each installed.
제3도 내지 제5도는 본 발명의 그립퍼장치(G)가 로딩-언로딩 로보트아암(E)(F)에 설치된 상태의 정면도, 평면도 및 측면도를 나타낸 것으로, 로딩-언로딩 로보트아암(E)(F)의 베이스플레이트(11)에 실린더(12)의 후단이 힌지(12')로 결합되어 있고, 이 실린더(12)는 선단히 하부로 경사지게 설치되는데, 상기 실린더(12)의 선단에 수직으로 제1링크(13)의 하단이 결합되며, 제1링크(13)의 상단에는 회전축(16)에 의해 수평으로 제2링크(14)의 일측단이 결합되며, 제2링크(14)의 타측단에는 로드엔드베어링(17 ; Rod End Bearing)에 의해 제3링크(15)가 수직으로 결합되고, 이 제3링크(15)의 하단이 가이드블럭(19)의 상부에 결합되며, 상기 가이드블럭(19)에는 그립퍼장치(G)가 결합되어 있다.3 to 5 show a front view, a plan view and a side view of the gripper device G of the present invention installed in the loading-unloading robot arm E (F), and the loading-unloading robot arm E The rear end of the cylinder 12 is coupled to the base plate 11 of the (F) by a hinge 12 ', and the cylinder 12 is installed to be inclined downwardly at the front end, and at the front end of the cylinder 12. The lower end of the first link 13 is vertically coupled, the one end of the second link 14 is horizontally coupled to the upper end of the first link 13 by the rotating shaft 16, the second link 14 The other end of the third link 15 is vertically coupled by a rod end bearing (17; Rod End Bearing), the lower end of the third link 15 is coupled to the upper portion of the guide block 19, The gripper device G is coupled to the guide block 19.
이와같이 로딩-언로딩 로보트아암(E)(F)에 설치된 그립퍼장치(G)의 작동은 베이스플레이트(11)에 힌지(12')로 결합된 실린더(12)가 작동되어 제1링크(13)를 반시계 방향으로 회전시키면, 제2링크(14)는 회전축(16)을 중심으로 반시계방향으로 회전되면서 원호운동을 하게 된다. 이때, 제2링크(14)에 결합된 제3링크(15)는 로드엔드베어링(17)의 회전에 의해 좌우로 원호운동을 할 수 있게 된다. 이와 같은 작동은 그립퍼장치(G)가 몰드금형(MD)에 설치된 안내홈 속으로 가이드블럭(19)이 자연스럽게 자동 조절되며 삽입될 수 있게 해주는 것이다.Thus, the operation of the gripper device G installed on the loading-unloading robot arm E (F) is operated by the cylinder 12 coupled to the base plate 11 by the hinge 12 'to operate the first link 13. When rotated counterclockwise, the second link 14 is rotated counterclockwise about the rotation axis 16 to the circular motion. In this case, the third link 15 coupled to the second link 14 may be circularly moved left and right by the rotation of the rod end bearing 17. This operation allows the gripper device G to be automatically adjusted and inserted into the guide groove 19 installed in the mold mold MD.
또한, 제2링크(14)와 제3링크(15)에는 로드엔드베어링(17)이 각각 설치되어 있어 좌·우는 물론, 전·후로도 움직일 수 있어 위치 정밀도를 스스로 보정하면서 몰드금형(MD)속에 삽입될 수 있는 것으로, 이는 각 스테이션(Station)마다 다른 위치를 기구적으로 보정하여 이로 인한 에러를 최소화시킬 수 있는 장점이 있다.In addition, the rod end bearings 17 are provided on the second link 14 and the third link 15, respectively, so that they can move forward and backward, as well as forward and backward. It can be inserted into the inside, which has the advantage of minimizing the error caused by mechanically correcting different positions for each station (Station).
제6도 내지 제8도는 본 발명의 그립퍼장치(G)의 구조를 보인 단면도와 저면도 및 측면도를 도시한 것이고, 제9도는 본 발명의 그립퍼장치(G)의 핑거(36)를 작동시키는 편심캠(22a)(22b)을 도시한 도면으로서, 상기 편심캠(22a)(22b)에 의해 두개의 리드프레임을 한꺼번에 집을 수 있는 것이다.6 to 8 show a cross-sectional view, a bottom view, and a side view showing the structure of the gripper device G of the present invention, and FIG. 9 shows an eccentricity for operating the finger 36 of the gripper device G of the present invention. As the figure shows the cams 22a and 22b, the two eccentric cams 22a and 22b can pick up two lead frames at once.
상기 그립퍼장치(G)에는 회전실린더(12)가 설치되어 있고, 이 회전실린더(21)의 회전축(G)에는 제1편심캠(22a)과 제2편심캠(22b)이 결합되어 있고, 이 제1,2편심캠(22a)(22b)에는 제1캠팔로우(23a)와 제2캠팔로우(23b)가 서로 대칭으로 결합되어 있으며, 제1,2캠팔로우(23a)(23b)의 끝단은 핑거(36)를 작동시키는 제1고정바(25)와 제2고정바(26)에 각각 핀(24)으로 결합되어 있다.The gripper device G is provided with a rotation cylinder 12, and the first eccentric cam 22a and the second eccentric cam 22b are coupled to the rotation shaft G of the rotation cylinder 21. The first cam follower 23a and the second cam follower 23b are symmetrically coupled to the first and second eccentric cams 22a and 22b, and the ends of the first and second cam followers 23a and 23b are symmetrically coupled to each other. The pins are coupled to the first fixing bar 25 and the second fixing bar 26 for operating the finger 36, respectively.
상기 제1고정바(25)는 제3고정바(27)에 제1결합축(29a)으로 고정되어 있고, 상기 제2고정바(26)는 제4고정바(28)에 제2결합축(29b)으로 고정되어 제1고정바(25)의 운동은 제3고정바(27)에 전달하고, 제2고정바(26)의 운동은 제4고정바(28)에 전달하는 것으로, 제1고정바(25)와 제2고정바(26)가 한쌍으로 이루어지고, 제3고정바(27)와 제4고정바(28)가 한쌍으로 이루어져 두개의 리드프레임을 동시에 집을 수 있는 것이다.The first fixing bar 25 is fixed to the third fixing bar 27 by the first coupling shaft 29a, and the second fixing bar 26 is connected to the fourth fixing bar 28 by the second coupling shaft. The movement of the first fixing bar 25 is transmitted to the third fixing bar 27, and the movement of the second fixing bar 26 is transmitted to the fourth fixing bar 28. The first fixing bar 25 and the second fixing bar 26 are made in a pair, and the third fixing bar 27 and the fourth fixing bar 28 are made in a pair so that two lead frames can be simultaneously picked up.
또한, 본 발명의 그립퍼장치(G)는 펠렛(도시되지 않음)을 함께 집을 수 있는 것으로, 제1,2고정바(25)(26)와 제3,4고정바(27)(28) 사이에 펠렛그립용레버(30)가 설치되어 펠렛을 집는 것이다.In addition, the gripper device G of the present invention is capable of picking pellets together (not shown), and between the first and second fixing bars 25 and 26 and the third and fourth fixing bars 27 and 28. Pellet grip lever 30 is installed to pick up the pellets.
상기 펠렛그립용레버(30)는 하단에 돌출턱(31)을 형성하고, 상단에는 박형실린더(33 ; Jig Cylinder)의 선단에 결합되며 펠렛그립용레버(30)의 중앙부에 힌지(32) 결합되어 박형실린더(33)에 의해 힌지(32)를 지점으로 하단이 회전되어 돌출턱(31)에 의해 펠렛을 고정하는 것이다. 이때, 펠렛그립용레버(30)의 원호운동을 원활하게 하고, 박형실린더(33)의 실(Seal)을 보호하기 위해 박형실린더(33)에 힌지(34)를 설치하였다.The pellet grip lever 30 has a protruding jaw 31 formed at a lower end thereof, and is coupled to a tip of a thin cylinder 33 (Jig Cylinder) at an upper end thereof, and a hinge 32 coupled to a central portion of the pellet grip lever 30. The lower end is rotated by the thin cylinder 33 to the hinge 32 to fix the pellet by the protruding jaw 31. At this time, the hinge 34 is installed in the thin cylinder 33 in order to facilitate the circular motion of the pellet grip lever 30 and to protect the seal of the thin cylinder 33.
이와 같이 구성된 그립퍼장치(G)는 회전실린더(21)가 180°회전을 하게 되면, 회전실린더(21)의 회전축(21')에 결합된 제1,2편심캠(22a)(22b)이 회전을 하게 되고, 상기 제1,2편심캠(22a)(22b)의 회전에 의해 제1,2캠팔로우(23a)(23b)는 핀(24)에 의해 결합된 제1고정바(25)와 제2고정바(26)를 당기면서 싸인커브(Sine Curve)의 궤적을 따라 충격없이 자연스럽게 회전실린더(21) 회전축(21') 방향으로 이동하게 된다.In the gripper device G configured as described above, when the rotation cylinder 21 rotates 180 °, the first and second eccentric cams 22a and 22b coupled to the rotation shaft 21 'of the rotation cylinder 21 rotate. By the rotation of the first and second eccentric cams 22a and 22b, the first and second cam followers 23a and 23b are connected to the first fixing bar 25 by the pin 24. The second fixing bar 26 is pulled along the trajectory of the sine curve to move naturally in the direction of the rotation cylinder 21 of the rotation cylinder 21 without impact.
이때, 제1고정바(25)는 제3고정바(27)에 제1결합축(29a)으로 고정되어 있고, 제2고정바(26)는 제4고정바(28)에 제2결합축(29b)으로 고정되어 있으므로, 제1,2고정바(25)(26)의 작동과 함께 제3,4고정바(27)(28)가 함께 작동되면서 두개의 리드프레임을 한꺼번에 집을 수 있는 것이다.In this case, the first fixing bar 25 is fixed to the third fixing bar 27 by the first coupling shaft 29a, and the second fixing bar 26 is connected to the fourth fixing bar 28 by the second coupling shaft. Since it is fixed to (29b), the first and second fixing bar (25, 26) with the operation of the third and fourth fixing bar (27, 28) together to be able to pick up two lead frames at once. .
또한, 박형실린더(33)의 작동에 의해 힌지(32)를 지점으로 펠렛 그립용 레버(30)의 하부를 회전시켜 돌출턱(31)에 의해 펠렛을 픽플레이스(Pick And Place)하는 것으로, 두개의 리드프레임을 그립(Grip)함과 동시에 펠렛을 그립(Grip)함으로서 하나의 그립퍼에 일체로 된 것이다.In addition, by rotating the lower portion of the pellet grip lever 30 to the hinge 32 to the point by the operation of the thin cylinder 33, pick and place the pellets by the projection jaw 31 (two) It grips the lead frame and grips the pellet at the same time, so it is integrated into one gripper.
이상의 설명에서와 같이 본 발명은 리드프레임을 집을 때 두개의 편심캠에 의해 충격없이 리드프레임을 그립함으로써, 리드프레임을 손상없이 가볍게 집을 수 있어 패키지의 불량을 감소시키고, 작업효율을 향상시켜 패키지의 신뢰성을 얻을 수 있는 잇점이 있다.As described above, in the present invention, when the lead frame is picked up by two eccentric cams, the lead frame is gripped without impact, so that the lead frame can be lightly picked up without damage, thereby reducing defects of the package and improving work efficiency. There is an advantage in achieving reliability.
Claims (5)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950065460A KR0185359B1 (en) | 1995-12-29 | 1995-12-29 | Gripper of auto-molding press for manufacturing semiconductor package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR1019950065460A KR0185359B1 (en) | 1995-12-29 | 1995-12-29 | Gripper of auto-molding press for manufacturing semiconductor package |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970053709A KR970053709A (en) | 1997-07-31 |
| KR0185359B1 true KR0185359B1 (en) | 1999-03-20 |
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| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR1019950065460A KR0185359B1 (en) | 1995-12-29 | 1995-12-29 | Gripper of auto-molding press for manufacturing semiconductor package |
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| Country | Link |
|---|---|
| KR (1) | KR0185359B1 (en) |
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1995
- 1995-12-29 KR KR1019950065460A patent/KR0185359B1/en not_active IP Right Cessation
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| KR970053709A (en) | 1997-07-31 |
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