KR0117717Y1 - Leadframe heater block for semiconductor package - Google Patents

Leadframe heater block for semiconductor package Download PDF

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Publication number
KR0117717Y1
KR0117717Y1 KR2019940033834U KR19940033834U KR0117717Y1 KR 0117717 Y1 KR0117717 Y1 KR 0117717Y1 KR 2019940033834 U KR2019940033834 U KR 2019940033834U KR 19940033834 U KR19940033834 U KR 19940033834U KR 0117717 Y1 KR0117717 Y1 KR 0117717Y1
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KR
South Korea
Prior art keywords
heater block
lead frame
fixture
semiconductor package
frame material
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KR2019940033834U
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Korean (ko)
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KR960025500U (en
Inventor
이규형
박성렬
공우현
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황인길
아남산업 주식회사
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Priority to KR2019940033834U priority Critical patent/KR0117717Y1/en
Publication of KR960025500U publication Critical patent/KR960025500U/en
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Publication of KR0117717Y1 publication Critical patent/KR0117717Y1/en

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    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67098—Apparatus for thermal treatment
    • H01L21/67103—Apparatus for thermal treatment mainly by conduction
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/67—Apparatus specially adapted for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus specially adapted for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components ; Apparatus not specifically provided for elsewhere
    • H01L21/67005—Apparatus not specifically provided for elsewhere
    • H01L21/67011—Apparatus for manufacture or treatment
    • H01L21/67121—Apparatus for making assemblies not otherwise provided for, e.g. package constructions

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  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

본 고안은 반도체패키지용 리드프레임 히터블록구조에 관한 것으로서, 히터블록(10)의 상부 평탄부(19)에 리드프레임이 안치되어질 수 있도록 형성된 돌출부(15)를 형성하고 있으며, 상기 돌출부(15)의 내측과 외측에는 그립퍼(20)의 고정구(25)가 삽입되어진후 상기 리드프레임자재(90)와 분리되어질 수 있는 요홈부(16)를 형성하여 픽스쳐의 핀에 리드프레임이 용이하게 안치되어질 수 있는 반도체패키지용 리드프레임 히터블록구조에 관한 것이다.The present invention relates to a lead frame heater block structure for a semiconductor package, and forms a protrusion 15 formed on the upper flat portion 19 of the heater block 10 so that the lead frame can be settled, and the protrusion 15 After the fastener 25 of the gripper 20 is inserted into the inner and outer sides of the gripper 20, a recess 16 may be formed to be separated from the lead frame material 90 so that the lead frame may be easily placed on the pin of the fixture. The present invention relates to a lead frame heater block structure for a semiconductor package.

Description

반도체 패키지용 리드프레임 히터블록구조Lead Frame Heater Block Structure for Semiconductor Package

제1도는 본 고안의 성형장치에 설치되어진 상태를 보인 설치상태 정면도1 is a front view showing the installation state showing the state installed in the molding apparatus of the present invention

제2도는 본 고안의 히터블록구조를 보인 평면도2 is a plan view showing a heater block structure of the present invention

제3도는 본 고안의 히터블록구조를 보인 요부확대 B­B선 단면도3 is a sectional view of the enlarged main BB line showing the heater block structure of the present invention

제4도는 본 고안의 히터블록구조를 보인 요부확대 A­A선 단면도4 is a cross-sectional view of the main portion enlarged A ­ A line showing the heater block structure of the present invention

제5도는 종래 고안의 히터블록구조를 보인 평면도5 is a plan view showing a heater block structure of a conventional design

제6도는 종래 고안의 히터블록구조를 보인 C­C선 단면도6 is a cross-sectional view taken along the line C ­ C showing a conventional heater block structure

＊ 도면의 주요부분에 대한 부호의 설명＊ Explanation of symbols on main parts of drawing

10 : 히터블록 15 : 돌출부10: heater block 15: protrusion

16 : 요홈부 19 : 평탄부16: groove portion 19: flat portion

20 : 그립퍼 25 : 고정구20: gripper 25: fixture

30 : 요홈 31 : 고정홈30: groove 31: fixed groove

35 : 돌기부 40 : 매거진홀더35: projection 40: magazine holder

50 : 푸셔장치 60 : 이송롤러50: pusher device 60: feed roller

70 : 픽스쳐 90 : 리드프레임자재70: fixture 90: lead frame material

본 고안은 반도체패키지용 리드프레임 히터블록구조에 관한 것으로서, 더욱더 상세하게는 와이어본딩된 리드프레임 자재를 패키지몰딩이 이루어지기 전에 히터블록에 안치시켜 소정온도를 예열시키어 줄수 있는 반도체패키지용 리드프레임 히터블록구조에 관한 것이다.The present invention relates to a lead frame heater block structure for a semiconductor package, and more particularly, a lead frame heater for a semiconductor package that can preheat a predetermined temperature by placing a wire bonded lead frame material in a heater block before package molding is performed. It is about a block structure.

일반적으로 히터블록은 반도체칩이 구비된 리드프레임자재를 와이어본딩한 후 회로적 성질을 보호하기 위하여 몰드금형에서 컴파운드재로 패키지 몰딩하는데 있어 몰딩공정전에 히팅장치가 구비된 히터블록에 소정시간 안치시켜 리드프레임자재에 예열시키도록 하는 것으로서, 종래에는 도시된 도면 제5도와 제6도에 도시된 바와같이 히터블록(10)의 평탄부(19) 좌우측 상부면으로 다수개의 돌기부(35)를 전후방향에 분리 형성되고, 상기 돌기부(35)가 구비된 평탄부(19)에는 좌우 길이방향으로 다수개의 요홈(30)을 형성하며, 평탄부(19)의 소정위치 전후로는 복수개의 홈(33)을 형성하고, 이홈(33)의 좌우양측 전후에 돌기부(35A)를 각각 형성하여 된 것이다.In general, a heater block is packaged from a mold mold to a compound material in order to protect the circuit properties after wire-bonding a lead frame material equipped with a semiconductor chip, and placed in a heater block equipped with a heating device for a predetermined time before the molding process. In order to preheat the lead frame material, as shown in FIG. 5 and FIG. 6, a plurality of protrusions 35 are moved to the front and rear directions on the upper and lower left and right sides of the flat part 19 of the heater block 10. A plurality of grooves 30 are formed in the flat part 19 provided with the protrusion part 35 in the left and right directions, and the plurality of grooves 33 are formed before and after the predetermined position of the flat part 19. And the projections 35A are formed at the front, rear, front, and rear sides of the groove 33, respectively.

이러한 종래의 히터블록(10)은 와이어본딩된 리드프레임자재(90)를 안치시켜 이동시킬 수 있는 픽스쳐(70)를 히터블록(10)의 돌기(35)(35A) 외부에 안치시킨 후 로더이송장치로 이송되는 리드프레임자재(90)를 픽스텨(70)에 놓여지게 함에 따라 와이어본딩 되어진 리드프레임자재(90)를 패키지몰딩이 이루어지기 전에 히터블록(10)에 안치시키어 소정온도(약 170℃)로 예열을 시키어 줄 수 있는 것이다.The conventional heater block 10 is a loader transported after placing the fixture 70 that can be moved by placing the wire-bonded lead frame material 90 outside the protrusions 35 (35A) of the heater block 10 As the lead frame material 90 transferred to the device is placed on the fixture 70, the wire-bonded lead frame material 90 is placed in the heater block 10 before the package molding is performed, and a predetermined temperature (about 170 It can be preheated at ℃).

그러나 이러한 종래 반도체패키지용 리드프레임 히터블록구조는 상기 히터블록(10)의 픽스쳐(70)와 평탄부(19)에 안치되어지는 리드프레임자재의 반도체칩이 위치하도록 형성되어진 요홈(30)과 돌기부(35)들에 의한 위치 제한성을 받게 되어 히터블록의 제작이 곤란하고, 상기 요홈(30)과 돌기부(35)(35A)들을 히터블록(10)의 평탄부(19)에 형성시키어 주어야 하므로, 제작이 곤란하게 됨은 물론 제작원가가 상승하게 되는등의 문제점이 있었던 것이다.However, such a conventional lead package heater block structure for a semiconductor package has a recess 30 and a protrusion formed so that the semiconductor chip of lead frame material is placed on the fixture 70 and the flat portion 19 of the heater block 10. Since it is difficult to manufacture the heater block due to the positional restriction by the 35, the grooves 30 and the protrusions 35 and 35A should be formed in the flat portion 19 of the heater block 10, The production was difficult, of course, there was a problem such as a rise in manufacturing costs.

본 고안의 목적은 상기와 같은 종래의 문제점을 해결하기 위해 히터블록의 상부 평탄부에 일체화된 다수개의 돌출부와 이 돌출부에 각각 소수의 요홈부만을 형성하여 상기 히터블록에 안치 고정되어진 픽스쳐의 핀에 리드프레임자재(90)가 용이하게 안치되어질 수 있는 반도체패키지용 리드레임 히터블록구조를 제공하는데 있다.An object of the present invention is to solve the conventional problems as described above to form a plurality of protrusions integral to the upper flat portion of the heater block and only a few grooves in each of the protrusions to the pin of the fixture fixed to the heater block A lead frame heater block structure for a semiconductor package in which the lead frame material 90 can be easily placed is provided.

이하 첨부된 도면에 의하여 본 고안의 기술적 구성을 상세하게 설명하면 다음과 같다.Hereinafter, the technical configuration of the present invention in detail with reference to the accompanying drawings.

본 고안의 히터블록구조도 제1도에 도시되는 바와같이 와이어본딩된 리드프레임자재(90)를 매거진홀더(40)에 고정되어진 매거진에서 푸셔장치(50)에 의해 취출시키어 이송롤러(60)에 공급되어진후 그립퍼(20)의 고정구(25)로 리드프레임 자재를 조립하여 히터블록(10)에 안치고정되어져 있는 픽스쳐에 안치시키도록 하는 것은 종래와 같다. 단 본 고안은 히터블록(10)의 상부평탄부에 픽스쳐(70)가 안착되어질 수 있는 돌출부(15)를 형성하며 그립퍼(20)의 고정구(25)가 삽입 위치하여 그립 이송되는 동작이 원활하도록 하는 요홈부가 상기 돌출부(15)에 형성시켜 된 것을 그 기술적 구성상의 기본 특징으로 한다.As shown in FIG. 1, the heater block structure of the present invention draws out the wire-bonded lead frame material 90 from the magazine fixed to the magazine holder 40 by the pusher device 50 to the feed roller 60. After being supplied, the lead frame material is assembled with the fixture 25 of the gripper 20 to be placed in a fixture secured to the heater block 10 as in the related art. The present invention, however, forms a protrusion 15 on which the fixture 70 can be seated on the upper flat portion of the heater block 10, and the fastener 25 of the gripper 20 is inserted so that the grip conveyance can be smoothly carried out. It is a basic feature of the technical configuration that the groove is formed in the protrusion 15.

이와같이 구성되는 본 고안은 히터블록(10)에 안치 고정되어진 픽스쳐(70)의 핀에 리드프레임자재가 용이하게 안치되어질 수 있는 것이다.According to the present invention configured as described above, the lead frame material may be easily placed on the pin of the fixture 70 fixed to the heater block 10.

여기에서, 히터블록구조는 제2도에 도시되는 바와같이 픽스쳐(70)의 핀에 끼워진 리드프레임자재를 히터블록(10)의 상부 평탄부(19)에 지지할 수 있도록 형성된 다수개의 돌출부(15)를 일체화시켜 형성하고 있으며, 상기 각 돌출부(15)의 중앙부 좌우측과 전후 당주 좌우축에는 그립퍼(20)의 고정구(25)가 리드프레임자재(90)를 분리시 작동이 용이하도록 고정구(25)의 일부가 삽입되어지는 요홈부(16)가 형성된다.Here, the heater block structure includes a plurality of protrusions 15 formed to support the lead frame material fitted to the pin of the fixture 70 to the upper flat portion 19 of the heater block 10, as shown in FIG. ) Is integrally formed, and the fixture 25 of the gripper 20 is easy to operate when the lead frame material 90 is detached from the left and right sides and the front and rear right and left axes of the central portions of the protrusions 15. A recess 16 into which a part of the groove is inserted is formed.

이러한 히터블록(10) 구조는 와이어몰딩된 리드프레임자재(90)를 패키지몰딩이 이루어지기 전에 그립퍼(20)의 고정구(25)에 의해 히터블록(10)의 상부 평탄부(19)에 형성된 돌출부(15)에 리드프레임자재(90)를 위치시킨 고정구(25)가 상기 돌출부(15)에 형성되어 있는 요홈부(16)에 위치하여진후 제거되어지는 것이다.The heater block 10 structure is a protrusion formed in the upper flat portion 19 of the heater block 10 by the fixture 25 of the gripper 20 before package molding of the wire-molded lead frame material 90 The fastener 25 in which the lead frame material 90 is positioned at 15 is positioned in the recess 16 formed in the protruding portion 15 and then removed.

상기 히터블록(10)의 돌출부(15)는 볼트 및 세트스크류등의 착탈수단(20A)으로 고정시키므로서 리드프레임자재(90)의 종류에 따라 돌출부(15)를 교환할 수 있도록 하고, 히터블록(10)의 상부로 복수개이상의 위치조정핀(P)을 구비하여, 이 조정판(P)에 돌출부(15)에 형성된 구멍이 삽입되게 하므로서 교환되는 돌출부(15)의 위치조정이 용이하도록 한 것이다.Protruding portion 15 of the heater block 10 is fixed to the removable means such as bolts and set screws (20A), so that the protrusions 15 can be replaced according to the type of the lead frame material 90, the heater block A plurality of positioning pins P are provided at the upper portion of the upper portion 10 so that the holes formed in the protrusions 15 are inserted into the adjusting plate P so that the position of the protrusions 15 to be replaced can be easily adjusted.

따라서 본 고안은 히터블록(10)의 형상이 단순화되어지므로 제작가공성이 용이하여지며 상기 히터블록(10)에 안치 고정되어있는 픽스쳐(70)의 핀에 리드프레임이 용이하게 안치되어지는 효과가 있는 것이다.Therefore, the present invention is simplified in the shape of the heater block 10, the manufacturing process is easy and the lead frame is easily placed on the pin of the fixture 70 is fixed to the heater block 10 is effective will be.

이상에서 살펴본 바와같이, 본 고안은 히터블록의 형상이 단순화되어 가공성이 용이하여 지게 되므로 제작과 가공성이 용이하게 이루어져 제작원가가 절감되어질 수 있는 매우 유용한 고안인 것이다.As described above, the present invention is a very useful design that can be reduced in manufacturing cost because the shape of the heater block is simplified to facilitate the processability and the manufacturing and processing is easy.

Claims (3)

와이어본딩된 매거진홀더(40)에 고정되어진 매거진에서 푸셔장치(50)에 의해 취출시키어 이송롤러(60)에 공급되어진후 그립퍼(20)의 고정구(25)로 리드프레임자재(90)를 그립하여 히터블록(10)에 안치고정되어져 있는 픽스쳐에 안치시키도록 하는 것에 있어서, 상기 히터블록(10)의 상부 평탄부(19)에 일체화된 돌출부(15)를 다수개 형성하고 이 각각의 돌출부(15)에는 중앙부 좌우측과 전후단부 좌우측에 요홈부(16)를 각각 형성하여 그립퍼(20)의 고정구(25)에 그립된 리드프레임자재(90)가 픽스쳐(70)에 안치될 때 고정구(25)의 일부가 상기 요홈부(16)에 위치하여 리드프레임의 분리 작동을 용이하게 할 수 있도록 한 것을 특징으로 하는 반도체 패키지용 리드프레임 히터블록.The lead frame material 90 is gripped by the fastener 25 of the gripper 20 after being taken out by the pusher device 50 from the magazine fixed to the wire-bonded magazine holder 40 and supplied to the feed roller 60. In mounting the fixture secured to the heater block 10, a plurality of protrusions 15 integrated in the upper flat portion 19 of the heater block 10 are formed, and each of the protrusions 15 is formed. ), Grooves 16 are formed on the left and right sides of the center portion and the left and right ends of the front and rear ends, respectively, so that the lead frame material 90 gripped by the fixture 25 of the gripper 20 is placed in the fixture 70. Lead block heater block for a semiconductor package, characterized in that part is located in the groove portion 16 to facilitate the separation operation of the lead frame. 제1항에 있어서, 상기 돌출부(15)에는 히터블록(10)을 착탈시킬 수 있도록 착탈수단(20A)으로 고정시켜 된 것을 특징으로 하는 반도체 패키지용 리드프레임 히터블록.2. The lead frame heater block for semiconductor packages according to claim 1, wherein the protruding portion (15) is fixed by detachable means (20A) so as to detach the heater block (10). 제1항 또는 제2항중 어느 한항에 있어서, 상기 히터블록(10)에 위치조정핀(P)을 구비하여 돌출부(15)의 위치조정이 용이하게 한 것을 특징으로 하는 반도체 패키지용 리드프레임 히터블록.The semiconductor package leadframe heater block according to any one of claims 1 to 4, wherein the heater block (10) is provided with a positioning pin (P) to facilitate positioning of the protrusion (15). .
KR2019940033834U 1994-12-13 1994-12-13 Leadframe heater block for semiconductor package KR0117717Y1 (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
KR2019940033834U KR0117717Y1 (en) 1994-12-13 1994-12-13 Leadframe heater block for semiconductor package

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Application Number Priority Date Filing Date Title
KR2019940033834U KR0117717Y1 (en) 1994-12-13 1994-12-13 Leadframe heater block for semiconductor package

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KR960025500U KR960025500U (en) 1996-07-22
KR0117717Y1 true KR0117717Y1 (en) 1998-04-24

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