KR0137966B1 - Mosfet in silicon carbide - Google Patents
Mosfet in silicon carbideInfo
- Publication number
- KR0137966B1 KR0137966B1 KR89701157A KR890701157A KR0137966B1 KR 0137966 B1 KR0137966 B1 KR 0137966B1 KR 89701157 A KR89701157 A KR 89701157A KR 890701157 A KR890701157 A KR 890701157A KR 0137966 B1 KR0137966 B1 KR 0137966B1
- Authority
- KR
- South Korea
- Prior art keywords
- mosfet
- silicon carbide
- carbide
- silicon
- Prior art date
Links
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title 1
- 229910010271 silicon carbide Inorganic materials 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1608—Silicon carbide
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (3)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11356487A | 1987-10-26 | 1987-10-26 | |
US113,564 | 1987-10-26 | ||
PCT/US1988/003793 WO1989004056A1 (fr) | 1987-10-26 | 1988-10-26 | Transistor a effet de champ de type mos forme dans du carbure de silicium |
Publications (2)
Publication Number | Publication Date |
---|---|
KR890702245A KR890702245A (ko) | 1989-12-23 |
KR0137966B1 true KR0137966B1 (en) | 1998-06-01 |
Family
ID=22350162
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
KR89701157A KR0137966B1 (en) | 1987-10-26 | 1989-06-26 | Mosfet in silicon carbide |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0386085A4 (fr) |
JP (1) | JP2644028B2 (fr) |
KR (1) | KR0137966B1 (fr) |
CA (1) | CA1313571C (fr) |
WO (1) | WO1989004056A1 (fr) |
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100986807B1 (ko) | 2006-10-30 | 2010-10-08 | 가부시키가이샤 덴소 | 탄화규소 반도체 장치를 제조하는 방법 |
Families Citing this family (12)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5465249A (en) * | 1991-11-26 | 1995-11-07 | Cree Research, Inc. | Nonvolatile random access memory device having transistor and capacitor made in silicon carbide substrate |
US6344663B1 (en) | 1992-06-05 | 2002-02-05 | Cree, Inc. | Silicon carbide CMOS devices |
JP3146694B2 (ja) * | 1992-11-12 | 2001-03-19 | 富士電機株式会社 | 炭化けい素mosfetおよび炭化けい素mosfetの製造方法 |
US5322802A (en) * | 1993-01-25 | 1994-06-21 | North Carolina State University At Raleigh | Method of fabricating silicon carbide field effect transistor |
US5448081A (en) * | 1993-02-22 | 1995-09-05 | Texas Instruments Incorporated | Lateral power MOSFET structure using silicon carbide |
FR2707425A1 (fr) * | 1993-07-09 | 1995-01-13 | Thomson Csf | Structure en matériau semiconducteur, application à la réalisation d'un transistor et procédé de réalisation. |
US5323040A (en) * | 1993-09-27 | 1994-06-21 | North Carolina State University At Raleigh | Silicon carbide field effect device |
US5385855A (en) * | 1994-02-24 | 1995-01-31 | General Electric Company | Fabrication of silicon carbide integrated circuits |
US5719409A (en) * | 1996-06-06 | 1998-02-17 | Cree Research, Inc. | Silicon carbide metal-insulator semiconductor field effect transistor |
DE19712561C1 (de) * | 1997-03-25 | 1998-04-30 | Siemens Ag | SiC-Halbleiteranordnung mit hoher Kanalbeweglichkeit |
US6121633A (en) * | 1997-06-12 | 2000-09-19 | Cree Research, Inc. | Latch-up free power MOS-bipolar transistor |
US5969378A (en) * | 1997-06-12 | 1999-10-19 | Cree Research, Inc. | Latch-up free power UMOS-bipolar transistor |
Family Cites Families (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1073110B (de) * | 1957-08-16 | 1960-01-14 | General Electric Company, Schenectady, N Y (V St A) | Verfahren zur Herstellung gleichrichtender oder ohmscher Anschlußkontakte an Siliziumkarbidkorpern |
US3254280A (en) * | 1963-05-29 | 1966-05-31 | Westinghouse Electric Corp | Silicon carbide unipolar transistor |
US3577285A (en) * | 1968-03-28 | 1971-05-04 | Ibm | Method for epitaxially growing silicon carbide onto a crystalline substrate |
US3662458A (en) * | 1969-06-20 | 1972-05-16 | Westinghouse Electric Corp | Electrical contact for silicon carbide members |
US4032961A (en) * | 1974-10-16 | 1977-06-28 | General Electric Company | Gate modulated bipolar transistor |
US3975648A (en) * | 1975-06-16 | 1976-08-17 | Hewlett-Packard Company | Flat-band voltage reference |
US4028149A (en) * | 1976-06-30 | 1977-06-07 | Ibm Corporation | Process for forming monocrystalline silicon carbide on silicon substrates |
US4582561A (en) * | 1979-01-25 | 1986-04-15 | Sharp Kabushiki Kaisha | Method for making a silicon carbide substrate |
JPS567479A (en) * | 1979-06-29 | 1981-01-26 | Toshiba Corp | Field-effect type semiconductor device |
DE3208638A1 (de) * | 1982-03-10 | 1983-09-22 | Siemens AG, 1000 Berlin und 8000 München | Lumineszenzdiode aus siliziumkarbid |
US4762806A (en) * | 1983-12-23 | 1988-08-09 | Sharp Kabushiki Kaisha | Process for producing a SiC semiconductor device |
JP2615390B2 (ja) * | 1985-10-07 | 1997-05-28 | 工業技術院長 | 炭化シリコン電界効果トランジスタの製造方法 |
JPS62136077A (ja) * | 1985-12-10 | 1987-06-19 | Nec Corp | 半導体装置 |
-
1988
- 1988-10-25 CA CA000581146A patent/CA1313571C/fr not_active Expired - Lifetime
- 1988-10-26 EP EP19880909938 patent/EP0386085A4/en not_active Withdrawn
- 1988-10-26 WO PCT/US1988/003793 patent/WO1989004056A1/fr not_active Application Discontinuation
- 1988-10-26 JP JP63509172A patent/JP2644028B2/ja not_active Expired - Lifetime
-
1989
- 1989-06-26 KR KR89701157A patent/KR0137966B1/ko not_active IP Right Cessation
Cited By (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
KR100986807B1 (ko) | 2006-10-30 | 2010-10-08 | 가부시키가이샤 덴소 | 탄화규소 반도체 장치를 제조하는 방법 |
Also Published As
Publication number | Publication date |
---|---|
JPH03501670A (ja) | 1991-04-11 |
EP0386085A1 (fr) | 1990-09-12 |
KR890702245A (ko) | 1989-12-23 |
EP0386085A4 (en) | 1990-11-28 |
WO1989004056A1 (fr) | 1989-05-05 |
CA1313571C (fr) | 1993-02-09 |
JP2644028B2 (ja) | 1997-08-25 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
A201 | Request for examination | ||
E902 | Notification of reason for refusal | ||
E701 | Decision to grant or registration of patent right | ||
GRNT | Written decision to grant | ||
FPAY | Annual fee payment |
Payment date: 20120202 Year of fee payment: 15 |
|
EXPY | Expiration of term |