EP0386085A4 - Mosfet in silicon carbide - Google Patents
Mosfet in silicon carbideInfo
- Publication number
- EP0386085A4 EP0386085A4 EP19880909938 EP88909938A EP0386085A4 EP 0386085 A4 EP0386085 A4 EP 0386085A4 EP 19880909938 EP19880909938 EP 19880909938 EP 88909938 A EP88909938 A EP 88909938A EP 0386085 A4 EP0386085 A4 EP 0386085A4
- Authority
- EP
- European Patent Office
- Prior art keywords
- mosfet
- silicon carbide
- carbide
- silicon
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Withdrawn
Links
- HBMJWWWQQXIZIP-UHFFFAOYSA-N silicon carbide Chemical compound [Si+]#[C-] HBMJWWWQQXIZIP-UHFFFAOYSA-N 0.000 title 1
- 229910010271 silicon carbide Inorganic materials 0.000 title 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/66—Types of semiconductor device ; Multistep manufacturing processes therefor
- H01L29/68—Types of semiconductor device ; Multistep manufacturing processes therefor controllable by only the electric current supplied, or only the electric potential applied, to an electrode which does not carry the current to be rectified, amplified or switched
- H01L29/76—Unipolar devices, e.g. field effect transistors
- H01L29/772—Field effect transistors
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L29/00—Semiconductor devices specially adapted for rectifying, amplifying, oscillating or switching and having potential barriers; Capacitors or resistors having potential barriers, e.g. a PN-junction depletion layer or carrier concentration layer; Details of semiconductor bodies or of electrodes thereof ; Multistep manufacturing processes therefor
- H01L29/02—Semiconductor bodies ; Multistep manufacturing processes therefor
- H01L29/12—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed
- H01L29/16—Semiconductor bodies ; Multistep manufacturing processes therefor characterised by the materials of which they are formed including, apart from doping materials or other impurities, only elements of Group IV of the Periodic Table
- H01L29/1608—Silicon carbide
Landscapes
- Engineering & Computer Science (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Physics & Mathematics (AREA)
- Ceramic Engineering (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Computer Hardware Design (AREA)
- Insulated Gate Type Field-Effect Transistor (AREA)
Applications Claiming Priority (2)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
US11356487A | 1987-10-26 | 1987-10-26 | |
US113564 | 1993-08-27 |
Publications (2)
Publication Number | Publication Date |
---|---|
EP0386085A1 EP0386085A1 (en) | 1990-09-12 |
EP0386085A4 true EP0386085A4 (en) | 1990-11-28 |
Family
ID=22350162
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
EP19880909938 Withdrawn EP0386085A4 (en) | 1987-10-26 | 1988-10-26 | Mosfet in silicon carbide |
Country Status (5)
Country | Link |
---|---|
EP (1) | EP0386085A4 (en) |
JP (1) | JP2644028B2 (en) |
KR (1) | KR0137966B1 (en) |
CA (1) | CA1313571C (en) |
WO (1) | WO1989004056A1 (en) |
Families Citing this family (13)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US5465249A (en) * | 1991-11-26 | 1995-11-07 | Cree Research, Inc. | Nonvolatile random access memory device having transistor and capacitor made in silicon carbide substrate |
US6344663B1 (en) | 1992-06-05 | 2002-02-05 | Cree, Inc. | Silicon carbide CMOS devices |
JP3146694B2 (en) * | 1992-11-12 | 2001-03-19 | 富士電機株式会社 | Silicon carbide MOSFET and method of manufacturing silicon carbide MOSFET |
US5322802A (en) * | 1993-01-25 | 1994-06-21 | North Carolina State University At Raleigh | Method of fabricating silicon carbide field effect transistor |
US5448081A (en) * | 1993-02-22 | 1995-09-05 | Texas Instruments Incorporated | Lateral power MOSFET structure using silicon carbide |
FR2707425A1 (en) * | 1993-07-09 | 1995-01-13 | Thomson Csf | Structure of semiconductor material, application to the production of a transistor and method of production |
US5323040A (en) * | 1993-09-27 | 1994-06-21 | North Carolina State University At Raleigh | Silicon carbide field effect device |
US5385855A (en) * | 1994-02-24 | 1995-01-31 | General Electric Company | Fabrication of silicon carbide integrated circuits |
US5719409A (en) * | 1996-06-06 | 1998-02-17 | Cree Research, Inc. | Silicon carbide metal-insulator semiconductor field effect transistor |
DE19712561C1 (en) * | 1997-03-25 | 1998-04-30 | Siemens Ag | Silicon carbide semiconductor device e.g. lateral or vertical MOSFET |
US5969378A (en) * | 1997-06-12 | 1999-10-19 | Cree Research, Inc. | Latch-up free power UMOS-bipolar transistor |
US6121633A (en) * | 1997-06-12 | 2000-09-19 | Cree Research, Inc. | Latch-up free power MOS-bipolar transistor |
JP5098295B2 (en) | 2006-10-30 | 2012-12-12 | 株式会社デンソー | Method for manufacturing silicon carbide semiconductor device |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3446961A1 (en) * | 1983-12-23 | 1985-07-18 | Sharp K.K., Osaka | METHOD FOR PRODUCING A SIC SEMICONDUCTOR DEVICE |
US4757028A (en) * | 1985-10-07 | 1988-07-12 | Agency Of Industrial Science And Technology | Process for preparing a silicon carbide device |
Family Cites Families (11)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE1073110B (en) * | 1957-08-16 | 1960-01-14 | General Electric Company, Schenectady, N Y (V St A) | Process for the production of rectifying or ohmic connection contacts on silicon carbide bodies |
US3254280A (en) * | 1963-05-29 | 1966-05-31 | Westinghouse Electric Corp | Silicon carbide unipolar transistor |
US3577285A (en) * | 1968-03-28 | 1971-05-04 | Ibm | Method for epitaxially growing silicon carbide onto a crystalline substrate |
US3662458A (en) * | 1969-06-20 | 1972-05-16 | Westinghouse Electric Corp | Electrical contact for silicon carbide members |
US4032961A (en) * | 1974-10-16 | 1977-06-28 | General Electric Company | Gate modulated bipolar transistor |
US3975648A (en) * | 1975-06-16 | 1976-08-17 | Hewlett-Packard Company | Flat-band voltage reference |
US4028149A (en) * | 1976-06-30 | 1977-06-07 | Ibm Corporation | Process for forming monocrystalline silicon carbide on silicon substrates |
US4582561A (en) * | 1979-01-25 | 1986-04-15 | Sharp Kabushiki Kaisha | Method for making a silicon carbide substrate |
JPS567479A (en) * | 1979-06-29 | 1981-01-26 | Toshiba Corp | Field-effect type semiconductor device |
DE3208638A1 (en) * | 1982-03-10 | 1983-09-22 | Siemens AG, 1000 Berlin und 8000 München | SILICON CARBIDE LUMINESCENCE DIODE |
JPS62136077A (en) * | 1985-12-10 | 1987-06-19 | Nec Corp | Semiconductor device |
-
1988
- 1988-10-25 CA CA000581146A patent/CA1313571C/en not_active Expired - Lifetime
- 1988-10-26 EP EP19880909938 patent/EP0386085A4/en not_active Withdrawn
- 1988-10-26 JP JP63509172A patent/JP2644028B2/en not_active Expired - Lifetime
- 1988-10-26 WO PCT/US1988/003793 patent/WO1989004056A1/en not_active Application Discontinuation
-
1989
- 1989-06-26 KR KR89701157A patent/KR0137966B1/en not_active IP Right Cessation
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
DE3446961A1 (en) * | 1983-12-23 | 1985-07-18 | Sharp K.K., Osaka | METHOD FOR PRODUCING A SIC SEMICONDUCTOR DEVICE |
US4757028A (en) * | 1985-10-07 | 1988-07-12 | Agency Of Industrial Science And Technology | Process for preparing a silicon carbide device |
Non-Patent Citations (8)
Title |
---|
APPLIED PHYSICS LETTERS, vol. 49, no. 17, 27th October 1986, pages 1074-1076, American Institute of Physics; H.S. KONG et al.: "Epitaxial growth of beta-SiC thin films on 6H alpha-SiC substrates via chemical vapor deposition" * |
APPLIED PHYSICS LETTERS, vol. 51, no. 6, 10th August 1987, pages 442-444, American Institute of Physics, New York, US; H.S. KONG et al.: "Temperature dependence of the current-voltage characteristics of metal-semiconductor field-effect transistors in n-type beta-SiC grown via chemical vapor deposition" * |
I.E.E.E. ELECTRON DEVICE LETTERS, vol. EDL-8, no. 2, February 1987, pages 48-49, IEEE, New York, US; K. FURUKAWA et al.: "Insulated-gate and junction-gate FET's of CVD-grown beta-SiC" * |
IEEE ELECTRON DEVICE LETTERS, vol. EDL-7, no. 12, December 1986, pages 692-693, IEEE, New York, US; K. SHIBAHARA et al.: "Fabrication of inversion-type n-channel MOSFET's using cubic-SiC on Si(100)" * |
JAPANESE JOURNAL OF APPLIED PHYSICS/PART 1: REGULAR PAPERS & SHORT NOTES, vol. 26, no. 2, February 1987, pages 310-311, Tokyo, JP; Y. KONDO et al.: "High-temperature operation of silicon carbide MOSFET" * |
JOURNAL OF APPLIED PHYSICS, vol. 64, no. 4, 15th August 1988, pages 2168-2177, American Institute of Physics, Woodbury, NY, US; J.W. PALMOUR et al.: "Characterization of device parameters in high-temperature metal-oxide-semiconductor field-effect transistors in beta-SiC thin films" * |
JOURNAL OF THE ELECTROCHEMICAL SOCIETY, vol. 133, no. 3, March 1986, pages 650-652, Manchester, NH, US; J.A. EDMOND et al.: "Chemical etching of ion implanted amorphous silicon carbide" * |
See also references of WO8904056A1 * |
Also Published As
Publication number | Publication date |
---|---|
KR0137966B1 (en) | 1998-06-01 |
KR890702245A (en) | 1989-12-23 |
CA1313571C (en) | 1993-02-09 |
WO1989004056A1 (en) | 1989-05-05 |
EP0386085A1 (en) | 1990-09-12 |
JP2644028B2 (en) | 1997-08-25 |
JPH03501670A (en) | 1991-04-11 |
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Legal Events
Date | Code | Title | Description |
---|---|---|---|
PUAI | Public reference made under article 153(3) epc to a published international application that has entered the european phase |
Free format text: ORIGINAL CODE: 0009012 |
|
17P | Request for examination filed |
Effective date: 19900501 |
|
AK | Designated contracting states |
Kind code of ref document: A1 Designated state(s): DE FR GB IT NL SE |
|
A4 | Supplementary search report drawn up and despatched |
Effective date: 19901011 |
|
AK | Designated contracting states |
Kind code of ref document: A4 Designated state(s): DE FR GB IT NL SE |
|
RIN1 | Information on inventor provided before grant (corrected) |
Inventor name: DAVIS, ROBERT, F. Inventor name: KONG, HUA-SHUANG Inventor name: PALMOUR, JOHN W. |
|
STAA | Information on the status of an ep patent application or granted ep patent |
Free format text: STATUS: THE APPLICATION HAS BEEN WITHDRAWN |
|
18W | Application withdrawn |
Withdrawal date: 19910916 |