KR0120969Y1 - Carrier of heating metal mold equipment - Google Patents
Carrier of heating metal mold equipment Download PDFInfo
- Publication number
- KR0120969Y1 KR0120969Y1 KR2019950033235U KR19950033235U KR0120969Y1 KR 0120969 Y1 KR0120969 Y1 KR 0120969Y1 KR 2019950033235 U KR2019950033235 U KR 2019950033235U KR 19950033235 U KR19950033235 U KR 19950033235U KR 0120969 Y1 KR0120969 Y1 KR 0120969Y1
- Authority
- KR
- South Korea
- Prior art keywords
- preheating
- mold
- mold apparatus
- power
- carrier
- Prior art date
Links
Classifications
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62B—HAND-PROPELLED VEHICLES, e.g. HAND CARTS OR PERAMBULATORS; SLEDGES
- B62B5/00—Accessories or details specially adapted for hand carts
-
- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05B—ELECTRIC HEATING; ELECTRIC LIGHT SOURCES NOT OTHERWISE PROVIDED FOR; CIRCUIT ARRANGEMENTS FOR ELECTRIC LIGHT SOURCES, IN GENERAL
- H05B3/00—Ohmic-resistance heating
- H05B3/40—Heating elements having the shape of rods or tubes
-
- B—PERFORMING OPERATIONS; TRANSPORTING
- B62—LAND VEHICLES FOR TRAVELLING OTHERWISE THAN ON RAILS
- B62B—HAND-PROPELLED VEHICLES, e.g. HAND CARTS OR PERAMBULATORS; SLEDGES
- B62B2204/00—Ventilation; Heating; Cooling; Insulation
- B62B2204/02—Ventilation; Heating; Cooling; Insulation comprising a heating unit
Landscapes
- Engineering & Computer Science (AREA)
- Chemical & Material Sciences (AREA)
- Combustion & Propulsion (AREA)
- Transportation (AREA)
- Mechanical Engineering (AREA)
- Moulds For Moulding Plastics Or The Like (AREA)
Abstract
본 고안은 예열장치를 가지는 금형 운반차에 관한 것으로, 특히 상부금형과 하부금형으로 이루어져 반도체칩 또는 전기부품을 성형하는 금형장치를 운반하는 운반차에 있어서, 금형장치(40)에 형성된 다수의 히터(41)와, 상기 히터(41)와 한쪽이 연결되며 다른 한쪽은 연결잭(51)과 연결되는 예열선(50)과, 상기 연결잭(51)에 전기적으로 연결되어 전원을 공급하는 전원선(20)과, 상기 전원선(20)에 의해 전원이 공급되어 금형장치(40)가 예열되면 이 예열상태를 지속할수 있도록 보호하는 예열커버(30)를 마련하여, 운반도중 금형장치(40)가 강제 예열되게 함으로서, 금형장치의 예열시간을 단축하여 생산성을 향상시킬 수 있도록 한 것이다.The present invention relates to a mold transporting vehicle having a preheating device. In particular, a plurality of heaters formed in a mold apparatus 40 in a transporting vehicle for carrying a mold apparatus formed of an upper mold and a lower mold to mold a semiconductor chip or an electrical component. 41, a preheating wire 50 connected to one side of the heater 41 and the other end of the connection jack 51, and a power line 20 electrically connected to the connection jack 51 to supply power. ) And a preheating cover 30 which protects the preheating state when the mold apparatus 40 is preheated by supplying power by the power supply line 20, thereby forcing the mold apparatus 40 during transportation. By preheating, it is possible to shorten the preheating time of the mold apparatus to improve the productivity.
Description
제 1 도는 본 고안의 정면도1 is a front view of the present invention
제 2도는 본 고안의 측면도2 is a side view of the present invention
* 도면의 주요 부분에 대한 부호의 설명* Explanation of symbols for the main parts of the drawings
10 : 운반차 20 : 전원선10: carrier 20: power line
30 : 예열커버 40 : 금형장치30: preheat cover 40: mold apparatus
41 : 히터 50 : 예열선41: heater 50: preheating wire
51 : 연결잭51: connection jack
본 고안은 금형장치를 예열하는 운반차에 관한 것으로, 특히 운반도중 금형장치가 강제 예열되게 함으로서, 금형장치의 예열시간을 단축하여 생산성을 향상시킬수 있도록 한 금형장치를 예열하는 운반차에 관한 것이다.The present invention relates to a carriage for preheating the mold apparatus, and more particularly, to a carriage for preheating the mold apparatus for reducing the preheating time of the mold apparatus to improve productivity by forcibly preheating the mold apparatus during transportation.
일반적으로 반도체칩 또는 전기부품을 성형하는 트랜스퍼 몰딩 유압프레스는 성형물을 사출하는 상부금형과 하부금형으로 이루어지는 금형장치와, 이 금형장치의 하부에 위치하여 금형장치를 구동시키는 금형구동장치로 크게 나뉘어진다.In general, a transfer molding hydraulic press for molding a semiconductor chip or an electric component is divided into a mold apparatus including an upper mold and a lower mold for injecting moldings, and a mold driving apparatus for driving the mold apparatus under the mold apparatus. .
이와 같은 목적으로 사용되는 금형장치를 사용하기 위해서는 별도로 마련된 운반용기구가 사용되는데 이 구성을 간단하게 살펴 보면 금형장치가 안치될수 있도록 일정한 크기와 높이를 가지는 운반차를 마련하고, 이 운반차가 이동될수 있도록 하부에는 바퀴가 형성되어 있다.In order to use the mold apparatus used for this purpose, a separately provided conveying mechanism is used. Looking at this configuration briefly, a carrier having a constant size and height is provided so that the mold apparatus can be placed, and the carriage can be moved. Wheels are formed at the bottom.
이와 같이 구성된 종래 운반차 상부에 금형장치를 올려 놓고 금형 구동장치까지 운반한후, 지그등을 이용하여 운반차에 안착된 금형장치를 들어올려 금형구동장치 상부에 결합한후 이률 4시간정도 가열하고 가열된 온도로서 반도체칩 또는 전기부품을 사출 성형해왔다.The mold device is placed on the upper part of the conventional transport vehicle configured as described above and transported to the mold drive device. Then, the mold device seated on the transport vehicle is lifted by using a jig and the like, and coupled to the upper part of the mold drive device. It has been injection molding semiconductor chips or electrical components at high temperatures.
이와 같이 금형장치를 운반하기 위해 사용되는 종래 운반차는 단지 금형장치를 운반하는 용도로 밖에 사용하지 못하고, 금형장치를 가열하는 시간이 장시간 걸리기 때문에 금형장치가 일정한 온도로 가열되기까지는 생산을 중단하고, 이에 따라 생산성이 저하되는 문제점이 발생 되었다.As such, the conventional transportation vehicle used for transporting the mold apparatus is only used for transporting the mold apparatus, and since the heating of the mold apparatus takes a long time, the production is stopped until the mold apparatus is heated to a constant temperature. As a result, there is a problem that the productivity is lowered.
따라서, 본 고안의 목적은 상기와 같은 종래의 문제점을 감안하여 안출한 것으로, 운반도중 금형장치가 강제 예열되게 하여 예열시간을 단축시키고 생산성을 향상시킬 수 있도록 한 금형장치를 예열하는 운반차를 제공하는데 있다.Accordingly, an object of the present invention is to provide a transport vehicle for preheating the mold apparatus to reduce the preheating time and improve productivity by forcibly preheating the mold apparatus during transportation, in view of the conventional problems as described above. It is.
본 고안은 상기와 같은 목적을 달성하기 위한 수단으로 금형장치에 형성된 다수의 히터와, 상기 히터와 한쪽이 연결되며 다른 한쪽은 연결잭과 연결되는 예열선과, 상기 연결잭에 전기적으로 연결되어 전원을 공급하는 전원선과, 상기 전원선에 의해 전원이 공급되어 금형장치가 예열되면 이 예열상태를 지속할수 있도록 보호하는 예열커버로 구성함을 그 기술적 구성상의 기본 특징으로 한다.The present invention provides a plurality of heaters formed in the mold apparatus as a means for achieving the above object, a preheating wire that is connected to one side of the heater and the other is connected to the connection jack, and electrically connected to the connection jack to supply power. The main feature of the technical configuration is a power line and a preheating cover for protecting the mold apparatus from being preheated when power is supplied by the power line to protect the mold apparatus from being preheated.
이하 본 고안의 바람직한 실시예에 의거하여 기술적 구성을 상세히 설명하면 다음과 같다.Hereinafter, the technical configuration will be described in detail based on the preferred embodiment of the present invention.
제1도는 운반차(10)의 상부에 예열커버(30)가 형성되고 이 예열커버(30) 내부에는 금형장치(40)가 위치한 상태를 나타낸 정면도이고,제2도는 히터(41)가 예열선(50)에 의해 전원선(20)과 전기적으로 연결된 상태를 나타낸 측면도 이다.FIG. 1 is a front view showing a state in which a preheating cover 30 is formed on an upper portion of the transport vehicle 10, and a mold apparatus 40 is located inside the preheating cover 30, and FIG. 2 is a heater 41 of the preheating line. It is a side view which shows the state electrically connected with the power supply line 20 by 50. FIG.
본 고안은 제1도와 제2도에 도시되는 바와 같이 상부금형과 하부금형으로 이루어져 반도체칩 또는 전기부품을 성형하는 금형장치를 운반하는 운반차에 있어서, 금형장치(40)에 형성된 다수의 히터(41)와,상기 히터(41)와 한쪽이 연결되며 다른 한쪽은 연결잭(51)과 연결되는 예열선(50)과, 상기 연결잭(51)에 전기적으로 연결되어 전원을 공급하는 전원선(20)과, 상기 전원선(20)에 의해 전원이 공급되어 금형장치(40)가 예열되면 이 예열상태를 지속할 수 있도록 보호하는 예열커버(30)로 구성된다.The present invention has a plurality of heaters formed in the mold apparatus 40 in a vehicle for carrying a mold apparatus for forming a semiconductor chip or an electric component, which is composed of an upper mold and a lower mold, as shown in FIGS. 41, the preheater 50 is connected to the heater 41 and the other side is connected to the connecting jack 51, and the power line 20 is electrically connected to the connecting jack 51 to supply power And, when the power is supplied by the power line 20 and the mold apparatus 40 is preheated, it is composed of a preheating cover 30 to protect the preheating state.
이와 같이 구성된 본 고안은 금형장치(40)들 예열커버(30) 내부에 위치시킨후, 전원선(20)을 연결잭(51)에 연결하고 전원을 인가시킨다.The present invention configured as described above is located in the preheating cover 30 of the mold apparatus 40, connect the power line 20 to the connection jack 51 and apply power.
그러면 전원선(20)에 의해 예열선(50)에 전원이 공급되고 이에 따라 히터(41)가 가열됨으로서 금형장치(40)가 운반도증 예열되며, 예열된 복사열은 다시 예열커버(30)에 의해 금형장치(40)에 전달되어 가열을 더욱 촉진시킨다.Then, the power is supplied to the preheating line 50 by the power line 20 and the heater 41 is heated accordingly, so that the mold apparatus 40 is preheated for transporting, and the preheated radiant heat is again supplied to the preheating cover 30. It is transmitted to the mold apparatus 40 to further promote heating.
상기와 같이 히터(41)와 연결된 내열선(50)의 전원공급에 의해 금형장치(40)가 예열되면서 운반되기 때문에 금형장치(40)를 금형구동 장치에 결합 가열 하더라도 그 만큽 가열시간이 단축되어 생산성이 대폭 향상된다.Since the mold apparatus 40 is preheated and transported by the power supply of the heat-resistant wire 50 connected to the heater 41 as described above, even when the mold apparatus 40 is coupled to the mold driving apparatus and heated, the heating time is shortened. Productivity is greatly improved.
이상에서 살펴본 바와 같이 본 고안은 히터에 예열선을 연결하고, 이 예열선은 전원선과 연결한 후 전원을 인가하여 운반도중 금형장치가 강제 예열되게 함으로서, 금형장치의 예열시간을 단축하여 생산성을 향상시킬 수 있는 것이다.As described above, the present invention connects a preheating wire to the heater, and this preheating wire is connected to the power supply line to apply power to force the preheating of the mold apparatus during transportation, thereby improving productivity by shortening the preheating time of the mold apparatus. It can be done.
Claims (1)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950033235U KR0120969Y1 (en) | 1995-11-13 | 1995-11-13 | Carrier of heating metal mold equipment |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| KR2019950033235U KR0120969Y1 (en) | 1995-11-13 | 1995-11-13 | Carrier of heating metal mold equipment |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| KR970022897U KR970022897U (en) | 1997-06-18 |
| KR0120969Y1 true KR0120969Y1 (en) | 1998-08-01 |
Family
ID=19428759
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| KR2019950033235U KR0120969Y1 (en) | 1995-11-13 | 1995-11-13 | Carrier of heating metal mold equipment |
Country Status (1)
| Country | Link |
|---|---|
| KR (1) | KR0120969Y1 (en) |
-
1995
- 1995-11-13 KR KR2019950033235U patent/KR0120969Y1/en not_active IP Right Cessation
Also Published As
| Publication number | Publication date |
|---|---|
| KR970022897U (en) | 1997-06-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR101554484B1 (en) | Moulding device | |
| KR0120969Y1 (en) | Carrier of heating metal mold equipment | |
| KR101780208B1 (en) | Cooling molding device | |
| JPH1041360A (en) | Selectively removing work to be heated | |
| KR100362005B1 (en) | Thermoplastic interior's molding device for vehicle | |
| KR100714248B1 (en) | Isotropic pressure forming device | |
| JP3632102B2 (en) | High temperature pressurizer | |
| KR0139128Y1 (en) | Moulding apparatus of molding press for semiconductor package | |
| JP2551100Y2 (en) | Semiconductor device encapsulation equipment | |
| JPH09307221A (en) | Flow solder device and soldering method of mounting board | |
| JP2998603B2 (en) | Chip bonding equipment | |
| KR0139127Y1 (en) | Moulding heating apparatus of molding press, semiconductor package | |
| JP2001110840A (en) | Wire-bonding device and method | |
| JPH01146712A (en) | Mold press apparatus | |
| JPH02212111A (en) | Mold conveying device | |
| KR100262464B1 (en) | Device for heating and hardening lead frame | |
| WO2023139825A1 (en) | Resin sealing device | |
| JP2772486B2 (en) | Mold for resin molding of electronic parts | |
| KR920008611Y1 (en) | Paste hardening system for manufacturing semiconductor device | |
| JP3103393B2 (en) | Injection mold heating device and injection mold heating method | |
| KR100219912B1 (en) | Semiconductor chip package mold exchange method | |
| KR200167855Y1 (en) | Preheating apparatus of lead on chip package | |
| KR0129221Y1 (en) | Pusher apparatus of lead frame loader for semiconductor package | |
| KR950004003Y1 (en) | Epoxy hardening equipment for leadframe | |
| JPS59172241A (en) | Semiconductor resin sealing device |
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A201 | Request for examination | ||
| E701 | Decision to grant or registration of patent right | ||
| REGI | Registration of establishment | ||
| FPAY | Annual fee payment |
Payment date: 20050328 Year of fee payment: 8 |
|
| LAPS | Lapse due to unpaid annual fee |