JPWO2025027675A5 - - Google Patents

Info

Publication number
JPWO2025027675A5
JPWO2025027675A5 JP2025537301A JP2025537301A JPWO2025027675A5 JP WO2025027675 A5 JPWO2025027675 A5 JP WO2025027675A5 JP 2025537301 A JP2025537301 A JP 2025537301A JP 2025537301 A JP2025537301 A JP 2025537301A JP WO2025027675 A5 JPWO2025027675 A5 JP WO2025027675A5
Authority
JP
Japan
Prior art keywords
wiring
layer
ground
multilayer
normal conducting
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025537301A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025027675A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/027712 external-priority patent/WO2025027675A1/ja
Publication of JPWO2025027675A1 publication Critical patent/JPWO2025027675A1/ja
Publication of JPWO2025027675A5 publication Critical patent/JPWO2025027675A5/ja
Pending legal-status Critical Current

Links

JP2025537301A 2023-07-28 2023-07-28 Pending JPWO2025027675A1 (https=)

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
PCT/JP2023/027712 WO2025027675A1 (ja) 2023-07-28 2023-07-28 量子デバイスおよび多層配線基板の製造方法

Publications (2)

Publication Number Publication Date
JPWO2025027675A1 JPWO2025027675A1 (https=) 2025-02-06
JPWO2025027675A5 true JPWO2025027675A5 (https=) 2026-02-19

Family

ID=94394350

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025537301A Pending JPWO2025027675A1 (https=) 2023-07-28 2023-07-28

Country Status (2)

Country Link
JP (1) JPWO2025027675A1 (https=)
WO (1) WO2025027675A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3157254B2 (ja) 1992-02-12 2001-04-16 日本電信電話株式会社 高周波通信系の等化器の作製方法
JP2914335B2 (ja) 1997-02-12 1999-06-28 株式会社移動体通信先端技術研究所 超伝導平面回路およびその製造方法
US10629535B2 (en) 2017-10-31 2020-04-21 Northrop Grumman Systems Corporation Thermally isolated ground planes with a superconducting electrical coupler
JP7501140B2 (ja) * 2020-06-19 2024-06-18 日本電気株式会社 量子デバイス

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