JPWO2025018161A1 - - Google Patents
Info
- Publication number
- JPWO2025018161A1 JPWO2025018161A1 JP2025533961A JP2025533961A JPWO2025018161A1 JP WO2025018161 A1 JPWO2025018161 A1 JP WO2025018161A1 JP 2025533961 A JP2025533961 A JP 2025533961A JP 2025533961 A JP2025533961 A JP 2025533961A JP WO2025018161 A1 JPWO2025018161 A1 JP WO2025018161A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P50/00—Etching of wafers, substrates or parts of devices
- H10P50/20—Dry etching; Plasma etching; Reactive-ion etching
- H10P50/24—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials
- H10P50/242—Dry etching; Plasma etching; Reactive-ion etching of semiconductor materials of Group IV materials
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023117004 | 2023-07-18 | ||
| JP2023117004 | 2023-07-18 | ||
| PCT/JP2024/024216 WO2025018161A1 (ja) | 2023-07-18 | 2024-07-04 | エッチング方法及びエッチング装置 |
Publications (3)
| Publication Number | Publication Date |
|---|---|
| JPWO2025018161A1 true JPWO2025018161A1 (https=) | 2025-01-23 |
| JPWO2025018161A5 JPWO2025018161A5 (https=) | 2026-03-05 |
| JP7852163B2 JP7852163B2 (ja) | 2026-04-27 |
Family
ID=94281496
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025533961A Active JP7852163B2 (ja) | 2023-07-18 | 2024-07-04 | エッチング方法及びエッチング装置 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JP7852163B2 (https=) |
| KR (1) | KR20260040018A (https=) |
| CN (1) | CN121533184A (https=) |
| TW (1) | TW202507839A (https=) |
| WO (1) | WO2025018161A1 (https=) |
Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021103710A (ja) * | 2019-12-25 | 2021-07-15 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
| JP2022116742A (ja) * | 2021-01-29 | 2022-08-10 | 東京エレクトロン株式会社 | 基板処理方法および基板処理装置 |
| WO2022234805A1 (ja) * | 2021-05-06 | 2022-11-10 | 東京エレクトロン株式会社 | エッチング方法及びプラズマ処理システム |
| WO2022265673A1 (en) * | 2021-06-17 | 2022-12-22 | Lam Research Corporation | Systems and methods for etching a high aspect ratio structure |
| JP2023083086A (ja) * | 2021-12-03 | 2023-06-15 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理システム |
| WO2023127820A1 (ja) * | 2021-12-28 | 2023-07-06 | 東京エレクトロン株式会社 | エッチング方法及びプラズマ処理装置 |
-
2024
- 2024-07-04 JP JP2025533961A patent/JP7852163B2/ja active Active
- 2024-07-04 CN CN202480045984.7A patent/CN121533184A/zh active Pending
- 2024-07-04 WO PCT/JP2024/024216 patent/WO2025018161A1/ja active Pending
- 2024-07-04 KR KR1020267003663A patent/KR20260040018A/ko active Pending
- 2024-07-08 TW TW113125453A patent/TW202507839A/zh unknown
Patent Citations (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2021103710A (ja) * | 2019-12-25 | 2021-07-15 | 東京エレクトロン株式会社 | 基板処理方法及び基板処理装置 |
| JP2022116742A (ja) * | 2021-01-29 | 2022-08-10 | 東京エレクトロン株式会社 | 基板処理方法および基板処理装置 |
| WO2022234805A1 (ja) * | 2021-05-06 | 2022-11-10 | 東京エレクトロン株式会社 | エッチング方法及びプラズマ処理システム |
| WO2022265673A1 (en) * | 2021-06-17 | 2022-12-22 | Lam Research Corporation | Systems and methods for etching a high aspect ratio structure |
| JP2023083086A (ja) * | 2021-12-03 | 2023-06-15 | 東京エレクトロン株式会社 | プラズマ処理方法及びプラズマ処理システム |
| WO2023127820A1 (ja) * | 2021-12-28 | 2023-07-06 | 東京エレクトロン株式会社 | エッチング方法及びプラズマ処理装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| CN121533184A (zh) | 2026-02-13 |
| TW202507839A (zh) | 2025-02-16 |
| WO2025018161A1 (ja) | 2025-01-23 |
| JP7852163B2 (ja) | 2026-04-27 |
| KR20260040018A (ko) | 2026-03-23 |
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