JPWO2025018148A5 - - Google Patents

Download PDF

Info

Publication number
JPWO2025018148A5
JPWO2025018148A5 JP2024565243A JP2024565243A JPWO2025018148A5 JP WO2025018148 A5 JPWO2025018148 A5 JP WO2025018148A5 JP 2024565243 A JP2024565243 A JP 2024565243A JP 2024565243 A JP2024565243 A JP 2024565243A JP WO2025018148 A5 JPWO2025018148 A5 JP WO2025018148A5
Authority
JP
Japan
Prior art keywords
laminate according
workpiece
producing
substrate
clad layer
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP2024565243A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025018148A1 (https=
JP7722604B2 (ja
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/024049 external-priority patent/WO2025018148A1/ja
Publication of JPWO2025018148A1 publication Critical patent/JPWO2025018148A1/ja
Publication of JPWO2025018148A5 publication Critical patent/JPWO2025018148A5/ja
Application granted granted Critical
Publication of JP7722604B2 publication Critical patent/JP7722604B2/ja
Active legal-status Critical Current
Anticipated expiration legal-status Critical

Links

JP2024565243A 2023-07-20 2024-07-03 積層体の製造方法 Active JP7722604B2 (ja)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023118086 2023-07-20
JP2023118086 2023-07-20
PCT/JP2024/024049 WO2025018148A1 (ja) 2023-07-20 2024-07-03 積層体の製造方法

Publications (3)

Publication Number Publication Date
JPWO2025018148A1 JPWO2025018148A1 (https=) 2025-01-23
JPWO2025018148A5 true JPWO2025018148A5 (https=) 2025-06-24
JP7722604B2 JP7722604B2 (ja) 2025-08-13

Family

ID=94281519

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024565243A Active JP7722604B2 (ja) 2023-07-20 2024-07-03 積層体の製造方法

Country Status (3)

Country Link
JP (1) JP7722604B2 (https=)
TW (1) TW202526397A (https=)
WO (1) WO2025018148A1 (https=)

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US9513434B2 (en) * 2012-01-11 2016-12-06 Hitachi Chemical Company, Ltd. Optical waveguide and manufacturing method thereof
JP2015114390A (ja) * 2013-12-09 2015-06-22 住友ベークライト株式会社 接着シート、接着シート付き光導波路、光電気混載基板、光電気混載基板の製造方法、光モジュールおよび電子機器

Similar Documents

Publication Publication Date Title
CN101436549B (zh) 铜核层多层封装基板的制作方法
CN103997862B (zh) 一种制作低应力低翘曲度超薄奇数层无芯板的方法
TWI466610B (zh) 封裝結構及其製作方法
TW201103385A (en) Printed circuit board having electro component and manufacturing method thereof
JP2025022922A5 (https=)
JPWO2025018148A5 (https=)
TWI569696B (zh) 製造電路板與晶片封裝之方法,以及藉由使用此方法製成之電路板
CN114765929A (zh) 一种电路板的层压方法及电路板
TW201032998A (en) Copper clad laminate and method of manufacturing the same
CN119255516A (zh) 阶梯厚铜嵌入式散热基板及其加工方法
TWI808614B (zh) 軟硬複合板的製程
CN115910807A (zh) 一种嵌埋器件封装基板制作方法、封装基板以及半导体
JPWO2024204324A5 (https=)
JP2005212428A (ja) 離型性フィルム、フィルム付き基材とその製造方法および回路基板の製造方法
JP2000221868A5 (https=)
JPWO2023127257A5 (https=)
JP4457399B2 (ja) 光導波路デバイスの製造方法、および、光導波路デバイス
JPWO2025033281A5 (https=)
CN114585154A (zh) 线路板制作结构及线路板制作方法
CN115866906B (zh) Pcb制备工艺及pcb板
TWI433632B (zh) 基板結構的製作方法
CN111328217A (zh) Mems封装载板叠构及其制作方法
CN120955044A (zh) 封装基板及其制法
JPWO2024070650A5 (https=)
JPWO2024204344A5 (https=)