JPWO2024241674A5 - - Google Patents

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Publication number
JPWO2024241674A5
JPWO2024241674A5 JP2025521818A JP2025521818A JPWO2024241674A5 JP WO2024241674 A5 JPWO2024241674 A5 JP WO2024241674A5 JP 2025521818 A JP2025521818 A JP 2025521818A JP 2025521818 A JP2025521818 A JP 2025521818A JP WO2024241674 A5 JPWO2024241674 A5 JP WO2024241674A5
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JP
Japan
Prior art keywords
temperature
substrate
spectral characteristic
characteristic data
measurement object
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025521818A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024241674A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/010200 external-priority patent/WO2024241674A1/ja
Publication of JPWO2024241674A1 publication Critical patent/JPWO2024241674A1/ja
Publication of JPWO2024241674A5 publication Critical patent/JPWO2024241674A5/ja
Pending legal-status Critical Current

Links

JP2025521818A 2023-05-25 2024-03-15 Pending JPWO2024241674A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023085975 2023-05-25
JP2023149273 2023-09-14
PCT/JP2024/010200 WO2024241674A1 (ja) 2023-05-25 2024-03-15 放射温度測定装置、放射温度測定方法及び放射温度測定装置用プログラム

Publications (2)

Publication Number Publication Date
JPWO2024241674A1 JPWO2024241674A1 (https=) 2024-11-28
JPWO2024241674A5 true JPWO2024241674A5 (https=) 2026-02-20

Family

ID=93589303

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025521818A Pending JPWO2024241674A1 (https=) 2023-05-25 2024-03-15

Country Status (3)

Country Link
EP (1) EP4692742A1 (https=)
JP (1) JPWO2024241674A1 (https=)
WO (1) WO2024241674A1 (https=)

Family Cites Families (9)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4956538A (en) * 1988-09-09 1990-09-11 Texas Instruments, Incorporated Method and apparatus for real-time wafer temperature measurement using infrared pyrometry in advanced lamp-heated rapid thermal processors
JPH0469531A (ja) * 1990-07-09 1992-03-04 Tokyo Electron Ltd 放射温度計による温度測定方法
JPH0691144B2 (ja) * 1990-09-21 1994-11-14 株式会社日立製作所 ウエハ温度測定用の放射温度計およびウエハ温度測定方法
JPH06241907A (ja) * 1993-02-18 1994-09-02 Tokai Carbon Co Ltd 炉内物体の放射測温法および放射測温装置
JP4056148B2 (ja) * 1998-10-09 2008-03-05 東京エレクトロン株式会社 放射温度計を用いた温度測定方法
JP2000256848A (ja) * 1999-03-10 2000-09-19 Canon Inc 成膜方法及び装置
JP2002122480A (ja) * 2000-10-12 2002-04-26 Toshiba Corp 温度測定方法および装置、並びにプラズマ処理装置
EP4040122B1 (en) 2019-10-25 2026-02-18 HORIBA, Ltd. Radiation thermometer, temperature measurement method, and temperature measurement program
JPWO2022215417A1 (https=) * 2021-04-09 2022-10-13

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