JPWO2024241674A1 - - Google Patents
Info
- Publication number
- JPWO2024241674A1 JPWO2024241674A1 JP2025521818A JP2025521818A JPWO2024241674A1 JP WO2024241674 A1 JPWO2024241674 A1 JP WO2024241674A1 JP 2025521818 A JP2025521818 A JP 2025521818A JP 2025521818 A JP2025521818 A JP 2025521818A JP WO2024241674 A1 JPWO2024241674 A1 JP WO2024241674A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
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- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/60—Radiation pyrometry, e.g. infrared or optical thermometry using determination of colour temperature
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01J—MEASUREMENT OF INTENSITY, VELOCITY, SPECTRAL CONTENT, POLARISATION, PHASE OR PULSE CHARACTERISTICS OF INFRARED, VISIBLE OR ULTRAVIOLET LIGHT; COLORIMETRY; RADIATION PYROMETRY
- G01J5/00—Radiation pyrometry, e.g. infrared or optical thermometry
- G01J5/70—Passive compensation of pyrometer measurements, e.g. using ambient temperature sensing or sensing of temperature within housing
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10P—GENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
- H10P74/00—Testing or measuring during manufacture or treatment of wafers, substrates or devices
- H10P74/20—Testing or measuring during manufacture or treatment of wafers, substrates or devices characterised by the properties tested or measured, e.g. structural or electrical properties
- H10P74/203—Structural properties, e.g. testing or measuring thicknesses, line widths, warpage, bond strengths or physical defects
Landscapes
- Physics & Mathematics (AREA)
- General Physics & Mathematics (AREA)
- Spectroscopy & Molecular Physics (AREA)
- Testing Or Measuring Of Semiconductors Or The Like (AREA)
Applications Claiming Priority (3)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023085975 | 2023-05-25 | ||
| JP2023149273 | 2023-09-14 | ||
| PCT/JP2024/010200 WO2024241674A1 (ja) | 2023-05-25 | 2024-03-15 | 放射温度測定装置、放射温度測定方法及び放射温度測定装置用プログラム |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024241674A1 true JPWO2024241674A1 (https=) | 2024-11-28 |
| JPWO2024241674A5 JPWO2024241674A5 (https=) | 2026-02-20 |
Family
ID=93589303
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025521818A Pending JPWO2024241674A1 (https=) | 2023-05-25 | 2024-03-15 |
Country Status (3)
| Country | Link |
|---|---|
| EP (1) | EP4692742A1 (https=) |
| JP (1) | JPWO2024241674A1 (https=) |
| WO (1) | WO2024241674A1 (https=) |
Family Cites Families (9)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US4956538A (en) * | 1988-09-09 | 1990-09-11 | Texas Instruments, Incorporated | Method and apparatus for real-time wafer temperature measurement using infrared pyrometry in advanced lamp-heated rapid thermal processors |
| JPH0469531A (ja) * | 1990-07-09 | 1992-03-04 | Tokyo Electron Ltd | 放射温度計による温度測定方法 |
| JPH0691144B2 (ja) * | 1990-09-21 | 1994-11-14 | 株式会社日立製作所 | ウエハ温度測定用の放射温度計およびウエハ温度測定方法 |
| JPH06241907A (ja) * | 1993-02-18 | 1994-09-02 | Tokai Carbon Co Ltd | 炉内物体の放射測温法および放射測温装置 |
| JP4056148B2 (ja) * | 1998-10-09 | 2008-03-05 | 東京エレクトロン株式会社 | 放射温度計を用いた温度測定方法 |
| JP2000256848A (ja) * | 1999-03-10 | 2000-09-19 | Canon Inc | 成膜方法及び装置 |
| JP2002122480A (ja) * | 2000-10-12 | 2002-04-26 | Toshiba Corp | 温度測定方法および装置、並びにプラズマ処理装置 |
| EP4040122B1 (en) | 2019-10-25 | 2026-02-18 | HORIBA, Ltd. | Radiation thermometer, temperature measurement method, and temperature measurement program |
| JPWO2022215417A1 (https=) * | 2021-04-09 | 2022-10-13 |
-
2024
- 2024-03-15 JP JP2025521818A patent/JPWO2024241674A1/ja active Pending
- 2024-03-15 EP EP24810682.5A patent/EP4692742A1/en active Pending
- 2024-03-15 WO PCT/JP2024/010200 patent/WO2024241674A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| EP4692742A1 (en) | 2026-02-11 |
| WO2024241674A1 (ja) | 2024-11-28 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20250731 |