JPWO2024228334A5 - - Google Patents

Info

Publication number
JPWO2024228334A5
JPWO2024228334A5 JP2025518123A JP2025518123A JPWO2024228334A5 JP WO2024228334 A5 JPWO2024228334 A5 JP WO2024228334A5 JP 2025518123 A JP2025518123 A JP 2025518123A JP 2025518123 A JP2025518123 A JP 2025518123A JP WO2024228334 A5 JPWO2024228334 A5 JP WO2024228334A5
Authority
JP
Japan
Prior art keywords
thickness direction
wiring
semiconductor
semiconductor module
module according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025518123A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024228334A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/015379 external-priority patent/WO2024228334A1/ja
Publication of JPWO2024228334A1 publication Critical patent/JPWO2024228334A1/ja
Publication of JPWO2024228334A5 publication Critical patent/JPWO2024228334A5/ja
Pending legal-status Critical Current

Links

JP2025518123A 2023-05-02 2024-04-18 Pending JPWO2024228334A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023076219 2023-05-02
PCT/JP2024/015379 WO2024228334A1 (ja) 2023-05-02 2024-04-18 半導体モジュールおよび車両

Publications (2)

Publication Number Publication Date
JPWO2024228334A1 JPWO2024228334A1 (https=) 2024-11-07
JPWO2024228334A5 true JPWO2024228334A5 (https=) 2026-02-03

Family

ID=93333045

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025518123A Pending JPWO2024228334A1 (https=) 2023-05-02 2024-04-18

Country Status (2)

Country Link
JP (1) JPWO2024228334A1 (https=)
WO (1) WO2024228334A1 (https=)

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2007180079A (ja) * 2005-12-27 2007-07-12 Cmk Corp プレスフィット接合用プリント配線板及びその製造方法
JP4988629B2 (ja) * 2008-03-12 2012-08-01 日立オートモティブシステムズ株式会社 電子機器および車載モジュール
DE112022004107T5 (de) * 2021-09-21 2024-06-20 Rohm Co., Ltd. Halbleitermodul

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