JPWO2024228334A1 - - Google Patents
Info
- Publication number
- JPWO2024228334A1 JPWO2024228334A1 JP2025518123A JP2025518123A JPWO2024228334A1 JP WO2024228334 A1 JPWO2024228334 A1 JP WO2024228334A1 JP 2025518123 A JP2025518123 A JP 2025518123A JP 2025518123 A JP2025518123 A JP 2025518123A JP WO2024228334 A1 JPWO2024228334 A1 JP WO2024228334A1
- Authority
- JP
- Japan
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Classifications
-
- H—ELECTRICITY
- H02—GENERATION; CONVERSION OR DISTRIBUTION OF ELECTRIC POWER
- H02M—APPARATUS FOR CONVERSION BETWEEN AC AND AC, BETWEEN AC AND DC, OR BETWEEN DC AND DC, AND FOR USE WITH MAINS OR SIMILAR POWER SUPPLY SYSTEMS; CONVERSION OF DC OR AC INPUT POWER INTO SURGE OUTPUT POWER; CONTROL OR REGULATION THEREOF
- H02M7/00—Conversion of AC power input into DC power output; Conversion of DC power input into AC power output
- H02M7/42—Conversion of DC power input into AC power output without possibility of reversal
- H02M7/44—Conversion of DC power input into AC power output without possibility of reversal by static converters
- H02M7/48—Conversion of DC power input into AC power output without possibility of reversal by static converters using discharge tubes with control electrode or semiconductor devices with control electrode
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- H—ELECTRICITY
- H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
- H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
- H05K1/00—Printed circuits
- H05K1/18—Printed circuits structurally associated with non-printed electric components
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- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W40/00—Arrangements for thermal protection or thermal control
- H10W40/10—Arrangements for heating
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W72/00—Interconnections or connectors in packages
-
- H—ELECTRICITY
- H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
- H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
- H10W90/00—Package configurations
Landscapes
- Engineering & Computer Science (AREA)
- Power Engineering (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Applications Claiming Priority (2)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP2023076219 | 2023-05-02 | ||
| PCT/JP2024/015379 WO2024228334A1 (ja) | 2023-05-02 | 2024-04-18 | 半導体モジュールおよび車両 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024228334A1 true JPWO2024228334A1 (https=) | 2024-11-07 |
| JPWO2024228334A5 JPWO2024228334A5 (https=) | 2026-02-03 |
Family
ID=93333045
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025518123A Pending JPWO2024228334A1 (https=) | 2023-05-02 | 2024-04-18 |
Country Status (2)
| Country | Link |
|---|---|
| JP (1) | JPWO2024228334A1 (https=) |
| WO (1) | WO2024228334A1 (https=) |
Family Cites Families (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007180079A (ja) * | 2005-12-27 | 2007-07-12 | Cmk Corp | プレスフィット接合用プリント配線板及びその製造方法 |
| JP4988629B2 (ja) * | 2008-03-12 | 2012-08-01 | 日立オートモティブシステムズ株式会社 | 電子機器および車載モジュール |
| DE112022004107T5 (de) * | 2021-09-21 | 2024-06-20 | Rohm Co., Ltd. | Halbleitermodul |
-
2024
- 2024-04-18 JP JP2025518123A patent/JPWO2024228334A1/ja active Pending
- 2024-04-18 WO PCT/JP2024/015379 patent/WO2024228334A1/ja not_active Ceased
Also Published As
| Publication number | Publication date |
|---|---|
| WO2024228334A1 (ja) | 2024-11-07 |
Similar Documents
Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251027 |
|
| A521 | Request for written amendment filed |
Free format text: JAPANESE INTERMEDIATE CODE: A523 Effective date: 20251107 |