JPWO2024204500A5 - - Google Patents

Info

Publication number
JPWO2024204500A5
JPWO2024204500A5 JP2025511121A JP2025511121A JPWO2024204500A5 JP WO2024204500 A5 JPWO2024204500 A5 JP WO2024204500A5 JP 2025511121 A JP2025511121 A JP 2025511121A JP 2025511121 A JP2025511121 A JP 2025511121A JP WO2024204500 A5 JPWO2024204500 A5 JP WO2024204500A5
Authority
JP
Japan
Prior art keywords
conductor
wiring board
printed wiring
end portion
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025511121A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024204500A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/012576 external-priority patent/WO2024204500A1/ja
Publication of JPWO2024204500A1 publication Critical patent/JPWO2024204500A1/ja
Publication of JPWO2024204500A5 publication Critical patent/JPWO2024204500A5/ja
Pending legal-status Critical Current

Links

JP2025511121A 2023-03-31 2024-03-28 Pending JPWO2024204500A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023056882 2023-03-31
JP2023185517 2023-10-30
PCT/JP2024/012576 WO2024204500A1 (ja) 2023-03-31 2024-03-28 印刷配線板

Publications (2)

Publication Number Publication Date
JPWO2024204500A1 JPWO2024204500A1 (https=) 2024-10-03
JPWO2024204500A5 true JPWO2024204500A5 (https=) 2025-11-17

Family

ID=92906785

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025511121A Pending JPWO2024204500A1 (https=) 2023-03-31 2024-03-28

Country Status (2)

Country Link
JP (1) JPWO2024204500A1 (https=)
WO (1) WO2024204500A1 (https=)

Family Cites Families (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2009032812A (ja) * 2007-07-25 2009-02-12 Toshiba Tec Corp 多層プリント基板
US9468090B2 (en) * 2012-10-29 2016-10-11 Cisco Technology, Inc. Current redistribution in a printed circuit board
JP6292908B2 (ja) * 2014-02-03 2018-03-14 キヤノン株式会社 プリント回路板
JP2017126707A (ja) * 2016-01-15 2017-07-20 日本電気株式会社 回路基板、それを備えた回路モジュールおよび回路基板の形成方法
JP7012543B2 (ja) * 2018-01-25 2022-01-28 京セラ株式会社 印刷配線板

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