JPWO2025100050A5 - - Google Patents

Info

Publication number
JPWO2025100050A5
JPWO2025100050A5 JP2025556216A JP2025556216A JPWO2025100050A5 JP WO2025100050 A5 JPWO2025100050 A5 JP WO2025100050A5 JP 2025556216 A JP2025556216 A JP 2025556216A JP 2025556216 A JP2025556216 A JP 2025556216A JP WO2025100050 A5 JPWO2025100050 A5 JP WO2025100050A5
Authority
JP
Japan
Prior art keywords
substrate
annular electrode
main surface
rfid module
module according
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025556216A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2025100050A1 (https=
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2024/030672 external-priority patent/WO2025100050A1/ja
Publication of JPWO2025100050A1 publication Critical patent/JPWO2025100050A1/ja
Publication of JPWO2025100050A5 publication Critical patent/JPWO2025100050A5/ja
Pending legal-status Critical Current

Links

JP2025556216A 2023-11-06 2024-08-28 Pending JPWO2025100050A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023189507 2023-11-06
PCT/JP2024/030672 WO2025100050A1 (ja) 2023-11-06 2024-08-28 Ｒｆｉｄモジュール

Publications (2)

Publication Number Publication Date
JPWO2025100050A1 JPWO2025100050A1 (https=) 2025-05-15
JPWO2025100050A5 true JPWO2025100050A5 (https=) 2026-04-28

Family

ID=95695544

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025556216A Pending JPWO2025100050A1 (https=) 2023-11-06 2024-08-28

Country Status (2)

Country Link
JP (1) JPWO2025100050A1 (https=)
WO (1) WO2025100050A1 (https=)

Families Citing this family (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2026053597A1 (ja) * 2024-09-05 2026-03-12 株式会社村田製作所 Ｒｆｉｄモジュール及び無線通信デバイス

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP3644235B1 (en) * 2014-12-19 2022-11-02 Murata Manufacturing Co., Ltd. Wireless ic device, molded resin article, and method for manufacturing wireless ic device
DE212018000243U1 (de) * 2017-06-19 2020-03-12 Murata Manufacturing Co., Ltd. Spulenelementbaugruppe und Spulenmodul

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