JPWO2024201649A5 - - Google Patents
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- Publication number
- JPWO2024201649A5 JPWO2024201649A5 JP2025509280A JP2025509280A JPWO2024201649A5 JP WO2024201649 A5 JPWO2024201649 A5 JP WO2024201649A5 JP 2025509280 A JP2025509280 A JP 2025509280A JP 2025509280 A JP2025509280 A JP 2025509280A JP WO2024201649 A5 JPWO2024201649 A5 JP WO2024201649A5
- Authority
- JP
- Japan
- Prior art keywords
- wafer
- divided
- wafers
- manufacturing
- bonded wafer
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| PCT/JP2023/012178 WO2024201649A1 (ja) | 2023-03-27 | 2023-03-27 | 半導体デバイスの製造方法および接合ウェハ |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPWO2024201649A1 JPWO2024201649A1 (cg-RX-API-DMAC7.html) | 2024-10-03 |
| JPWO2024201649A5 true JPWO2024201649A5 (cg-RX-API-DMAC7.html) | 2025-06-05 |
Family
ID=92904161
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP2025509280A Pending JPWO2024201649A1 (cg-RX-API-DMAC7.html) | 2023-03-27 | 2023-03-27 |
Country Status (5)
| Country | Link |
|---|---|
| JP (1) | JPWO2024201649A1 (cg-RX-API-DMAC7.html) |
| KR (1) | KR20250150609A (cg-RX-API-DMAC7.html) |
| CN (1) | CN120981885A (cg-RX-API-DMAC7.html) |
| DE (1) | DE112023006051T5 (cg-RX-API-DMAC7.html) |
| WO (1) | WO2024201649A1 (cg-RX-API-DMAC7.html) |
Family Cites Families (6)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP4715470B2 (ja) * | 2005-11-28 | 2011-07-06 | 株式会社Sumco | 剥離ウェーハの再生加工方法及びこの方法により再生加工された剥離ウェーハ |
| EP1835533B1 (en) * | 2006-03-14 | 2020-06-03 | Soitec | Method for manufacturing compound material wafers and method for recycling a used donor substrate |
| US9923063B2 (en) * | 2013-02-18 | 2018-03-20 | Sumitomo Electric Industries, Ltd. | Group III nitride composite substrate and method for manufacturing the same, laminated group III nitride composite substrate, and group III nitride semiconductor device and method for manufacturing the same |
| DE102017119568B4 (de) | 2017-08-25 | 2024-01-04 | Infineon Technologies Ag | Siliziumkarbidbauelemente und Verfahren zum Herstellen von Siliziumkarbidbauelementen |
| CN112839813A (zh) * | 2018-10-16 | 2021-05-25 | 麻省理工学院 | 在升华的sic基底上使用碳缓冲的外延生长模板 |
| JP7512641B2 (ja) * | 2020-03-27 | 2024-07-09 | 住友金属鉱山株式会社 | 接合基板の製造方法 |
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2023
- 2023-03-27 KR KR1020257030679A patent/KR20250150609A/ko active Pending
- 2023-03-27 CN CN202380095859.2A patent/CN120981885A/zh active Pending
- 2023-03-27 DE DE112023006051.7T patent/DE112023006051T5/de active Pending
- 2023-03-27 JP JP2025509280A patent/JPWO2024201649A1/ja active Pending
- 2023-03-27 WO PCT/JP2023/012178 patent/WO2024201649A1/ja not_active Ceased