JPWO2024185677A1 - - Google Patents

Info

Publication number
JPWO2024185677A1
JPWO2024185677A1 JP2025505292A JP2025505292A JPWO2024185677A1 JP WO2024185677 A1 JPWO2024185677 A1 JP WO2024185677A1 JP 2025505292 A JP2025505292 A JP 2025505292A JP 2025505292 A JP2025505292 A JP 2025505292A JP WO2024185677 A1 JPWO2024185677 A1 JP WO2024185677A1
Authority
JP
Japan
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025505292A
Other languages
Japanese (ja)
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed filed Critical
Publication of JPWO2024185677A1 publication Critical patent/JPWO2024185677A1/ja
Pending legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B65CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65DCONTAINERS FOR STORAGE OR TRANSPORT OF ARTICLES OR MATERIALS, e.g. BAGS, BARRELS, BOTTLES, BOXES, CANS, CARTONS, CRATES, DRUMS, JARS, TANKS, HOPPERS, FORWARDING CONTAINERS; ACCESSORIES, CLOSURES, OR FITTINGS THEREFOR; PACKAGING ELEMENTS; PACKAGES
    • B65D73/00Packages comprising articles attached to cards, sheets or webs
    • B65D73/02Articles, e.g. small electrical components, attached to webs
    • HELECTRICITY
    • H10SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10PGENERIC PROCESSES OR APPARATUS FOR THE MANUFACTURE OR TREATMENT OF DEVICES COVERED BY CLASS H10
    • H10P95/00Generic processes or apparatus for manufacture or treatments not covered by the other groups of this subclass

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Laminated Bodies (AREA)
  • Packaging Frangible Articles (AREA)
  • Packages (AREA)
JP2025505292A 2023-03-08 2024-03-01 Pending JPWO2024185677A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2023035462 2023-03-08
PCT/JP2024/007733 WO2024185677A1 (ja) 2023-03-08 2024-03-01 カバーテープ、電子部品包装体およびカバーテープの製造方法

Publications (1)

Publication Number Publication Date
JPWO2024185677A1 true JPWO2024185677A1 (https=) 2024-09-12

Family

ID=92675085

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025505292A Pending JPWO2024185677A1 (https=) 2023-03-08 2024-03-01

Country Status (4)

Country Link
JP (1) JPWO2024185677A1 (https=)
CN (1) CN120752188A (https=)
TW (1) TWI892499B (https=)
WO (1) WO2024185677A1 (https=)

Family Cites Families (14)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP3563863B2 (ja) * 1996-02-09 2004-09-08 大日本印刷株式会社 カバーテープ
US6027802A (en) * 1997-10-23 2000-02-22 Four Piliars Enterprise Co., Ltd. Cover tape for packaging
JP3425547B2 (ja) * 1999-12-27 2003-07-14 電気化学工業株式会社 イージーピールフィルム
JP2005126081A (ja) * 2003-10-21 2005-05-19 Shin Etsu Polymer Co Ltd カバーテープ用樹脂組成物、およびこれを用いたカバーテープ、並びに包装体
MY190586A (en) * 2010-12-17 2022-04-27 3M Innovative Properties Co Heat-sealing film and cover tape for packaging electronic components
WO2013029261A1 (en) * 2011-09-01 2013-03-07 3M Innovative Properties Company Heat-sealing cover film for packaging electronic components
CN105377713A (zh) * 2013-07-09 2016-03-02 住友电木株式会社 电子部件包装用盖带
JP6231919B2 (ja) * 2014-03-25 2017-11-15 三井化学東セロ株式会社 カバーテープ用シーラントフィルム及びカバーテープ
JP2016182989A (ja) * 2015-03-27 2016-10-20 住友ベークライト株式会社 電子部品包装用カバーテープ、電子部品包装用包材、および電子部品包装体
CN108582903A (zh) * 2018-06-21 2018-09-28 北京康得新功能材料有限公司 一种电子元器件用包装复合膜
JP2021080024A (ja) * 2019-11-15 2021-05-27 住友ベークライト株式会社 カバーテープおよび電子部品包装体
JP6950774B1 (ja) * 2020-03-17 2021-10-13 大日本印刷株式会社 電子部品包装用カバーテープおよび包装体
JP7707527B2 (ja) * 2020-11-19 2025-07-15 住友ベークライト株式会社 電子部品包装用カバーテープ
JP7672324B2 (ja) * 2021-03-31 2025-05-07 住友ベークライト株式会社 電子部品包装用カバーテープおよび電子部品包装体

Also Published As

Publication number Publication date
CN120752188A (zh) 2025-10-03
WO2024185677A1 (ja) 2024-09-12
TWI892499B (zh) 2025-08-01
TW202442552A (zh) 2024-11-01

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Legal Events

Date Code Title Description
A621 Written request for application examination

Free format text: JAPANESE INTERMEDIATE CODE: A621

Effective date: 20250418