JPWO2024171683A5 - - Google Patents

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Publication number
JPWO2024171683A5
JPWO2024171683A5 JP2025500727A JP2025500727A JPWO2024171683A5 JP WO2024171683 A5 JPWO2024171683 A5 JP WO2024171683A5 JP 2025500727 A JP2025500727 A JP 2025500727A JP 2025500727 A JP2025500727 A JP 2025500727A JP WO2024171683 A5 JPWO2024171683 A5 JP WO2024171683A5
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JP
Japan
Prior art keywords
contact hole
alloy layer
interlayer insulating
insulating film
semiconductor device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2025500727A
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English (en)
Japanese (ja)
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JPWO2024171683A1 (https=
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Priority claimed from PCT/JP2024/000848 external-priority patent/WO2024171683A1/ja
Publication of JPWO2024171683A1 publication Critical patent/JPWO2024171683A1/ja
Publication of JPWO2024171683A5 publication Critical patent/JPWO2024171683A5/ja
Pending legal-status Critical Current

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JP2025500727A 2023-02-14 2024-01-15 Pending JPWO2024171683A1 (https=)

Applications Claiming Priority (3)

Application Number Priority Date Filing Date Title
JP2023020798 2023-02-14
JP2023130511 2023-08-09
PCT/JP2024/000848 WO2024171683A1 (ja) 2023-02-14 2024-01-15 半導体装置および半導体装置の製造方法

Publications (2)

Publication Number Publication Date
JPWO2024171683A1 JPWO2024171683A1 (https=) 2024-08-22
JPWO2024171683A5 true JPWO2024171683A5 (https=) 2025-05-09

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ID=92421482

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2025500727A Pending JPWO2024171683A1 (https=) 2023-02-14 2024-01-15

Country Status (5)

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US (1) US20250194207A1 (https=)
JP (1) JPWO2024171683A1 (https=)
CN (1) CN119817188A (https=)
DE (1) DE112024000113T5 (https=)
WO (1) WO2024171683A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP5694119B2 (ja) * 2010-11-25 2015-04-01 三菱電機株式会社 炭化珪素半導体装置
WO2012176305A1 (ja) * 2011-06-23 2012-12-27 三菱電機株式会社 障害情報処理装置、障害情報処理方法および障害情報処理システム
JP6104523B2 (ja) * 2012-06-07 2017-03-29 株式会社日立製作所 半導体装置の製造方法
JP7403386B2 (ja) * 2020-05-27 2023-12-22 三菱電機株式会社 半導体装置

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