JPWO2024135784A5 - - Google Patents

Info

Publication number
JPWO2024135784A5
JPWO2024135784A5 JP2024566137A JP2024566137A JPWO2024135784A5 JP WO2024135784 A5 JPWO2024135784 A5 JP WO2024135784A5 JP 2024566137 A JP2024566137 A JP 2024566137A JP 2024566137 A JP2024566137 A JP 2024566137A JP WO2024135784 A5 JPWO2024135784 A5 JP WO2024135784A5
Authority
JP
Japan
Prior art keywords
type semiconductor
semiconductor layer
layer
electrode
light
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP2024566137A
Other languages
English (en)
Japanese (ja)
Other versions
JPWO2024135784A1 (https=
Filing date
Publication date
Application filed filed Critical
Priority claimed from PCT/JP2023/045975 external-priority patent/WO2024135784A1/ja
Publication of JPWO2024135784A1 publication Critical patent/JPWO2024135784A1/ja
Publication of JPWO2024135784A5 publication Critical patent/JPWO2024135784A5/ja
Pending legal-status Critical Current

Links

JP2024566137A 2022-12-21 2023-12-21 Pending JPWO2024135784A1 (https=)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
JP2022204799 2022-12-21
PCT/JP2023/045975 WO2024135784A1 (ja) 2022-12-21 2023-12-21 窒化物半導体発光素子

Publications (2)

Publication Number Publication Date
JPWO2024135784A1 JPWO2024135784A1 (https=) 2024-06-27
JPWO2024135784A5 true JPWO2024135784A5 (https=) 2025-08-26

Family

ID=91588811

Family Applications (1)

Application Number Title Priority Date Filing Date
JP2024566137A Pending JPWO2024135784A1 (https=) 2022-12-21 2023-12-21

Country Status (3)

Country Link
JP (1) JPWO2024135784A1 (https=)
CN (1) CN120391102A (https=)
WO (1) WO2024135784A1 (https=)

Family Cites Families (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
WO2017078368A1 (ko) * 2015-11-05 2017-05-11 서울바이오시스주식회사 자외선 발광 소자 및 그것을 제조하는 방법
CN110214380B (zh) * 2017-01-25 2024-04-09 苏州立琻半导体有限公司 半导体器件
JPWO2022220088A1 (https=) * 2021-04-14 2022-10-20
JP7594974B2 (ja) * 2021-05-20 2024-12-05 Tdk株式会社 半導体素子およびその製造方法

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